K4A8G085WB-BCPB vs K4A8G085WC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4A8G085WB-BCPB sa pamamagitan ng Samsung Electronics at K4A8G085WC sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K4A8G085WB-BCPB - 8Gb DDR4 SDRAM 1Gx8 1.2V | Samsung
K4A8G085WB-BCPB ✓ NakahandaSamsung Electronics
K4A8G085WC - 8Gb DDR4 SDRAM 1Gx8 2666Mbps | Samsung Electronics
K4A8G085WC ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K4A8G085WB-BCPB | K4A8G085WC |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Presyo ng Yunit (USD) | $4.10 | — |
| Uri ng Memory | DDR4 SDRAM (volatile DRAM) | DDR4 SDRAM |
| Laki ng Memory | 8 Gb | — |
| Memory Organization | 1G x 8 | — |
| Volte ng Pagbibigay | 1.2 V | 1.2 V |
| Max Clock Frequency | 1066 MHz | — |
| Max Access Time | 0.18 ns | — |
| Max Standby Current | 0.016 mA | — |
| Refresh Cycles | 8192 | — |
| Technology | CMOS, 8Gb B-die | — |
| Packhaging | 78-ball FBGA (BGA78 / TFBGA), rectangular, 11 mm length | 78-ball FBGA (78FBGA) |
| Number of Terminals | 78 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0C to +85C | — |
| Interface | DDR4 SDRAM parallel interface | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Operating Temperature Grade | Commercial (0C to 85C) | — |
| Density | — | 8 Gbit |
| Organisasyon | — | 1G x 8 |
| Speed | — | 2666 Mbps/pin (DDR4-2666) |
| Supply Voltage Range | — | 1.14 V to 1.26 V |
| Clock Frequency | — | 1333 MHz (1333.333 GHz nominal, per web data) |
| Operating Temperature (K4A8G085WC-BITD) | — | -40 C to +95 C |
| Operating Temperature (K4A8G085WC-BCTD) | — | 0 C to +95 C |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Chip Termination (ODT) | — | Yes |
| Data Mask (DM) | — | Yes |