S9S08AW16AE0MLC vs MC9S08GT16CFBE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng S9S08AW16AE0MLC sa pamamagitan ng NXP Semiconductors at MC9S08GT16CFBE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
S9S08AW16AE0MLC - 8-bit HCS08 MCU, 16KB Flash, CAN, LQFP-32 | NXP
S9S08AW16AE0MLC ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | S9S08AW16AE0MLC | MC9S08GT16CFBE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Core | HCS08 (enhanced HC08) 8-bit | — |
| CPU Frequency | 40 MHz (20 MHz internal bus) | — |
| Program Flash | 16 KB | — |
| RAM | 1 KB | 2 KB |
| CAN Module | MSCAN (CAN 2.0 A/B) | — |
| ADC | 10-bit, 8-channel | — |
| Timers/PWM | 6-channel 16-bit | — |
| Communication Interfaces | 2x SCI (UART), 1x SPI, 1x I2C | I2C, SCI, SPI |
| GPIO (max) | 27 | — |
| Volte ng Pagbibigay | 2.7 V to 5.5 V | 2.5 V / 3.3 V |
| Temperature na Operasyon | -40 C to +125 C (automotive AEC-Q100) | [DATA_NEEDED: operating temperature range] |
| Packhaging | 32-pin LQFP, 7 x 7 mm | 44-QFP (10x10 mm) |
| Uri ng Pagpapasok | Surface Mount (gull-wing) | Surface Mount |
| Debug Interface | Single-wire BDM (background debug mode) | — |
| Instruction Set | HC08 with BGND extension | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-Bit |
| Maximum Bus Frequency | — | 40 MHz |
| Flash Memory | — | 16 KB (16K x 8) |
| EEPROM | — | None (Flash-based) |
| ADC Resolution | — | 10-bit (8 channels) |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 36 |
| Packaging | — | Tray |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |