S9S08AW16AE0MLC vs MC9S08GT16CFBE 比較
詳細並排比較 S9S08AW16AE0MLC 由 NXP Semiconductors 與 MC9S08GT16CFBE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
S9S08AW16AE0MLC - 8-bit HCS08 MCU, 16KB Flash, CAN, LQFP-32 | NXP
S9S08AW16AE0MLC ✓ 啟用中
規格比較
| 參數 | S9S08AW16AE0MLC | MC9S08GT16CFBE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | Obsolete |
| Core | HCS08 (enhanced HC08) 8-bit | — |
| CPU Frequency | 40 MHz (20 MHz internal bus) | — |
| Program Flash | 16 KB | — |
| RAM | 1 KB | 2 KB |
| CAN Module | MSCAN (CAN 2.0 A/B) | — |
| ADC | 10-bit, 8-channel | — |
| Timers/PWM | 6-channel 16-bit | — |
| Communication Interfaces | 2x SCI (UART), 1x SPI, 1x I2C | I2C, SCI, SPI |
| GPIO (max) | 27 | — |
| 供應電壓 | 2.7 V to 5.5 V | 2.5 V / 3.3 V |
| 工作溫度 | -40 C to +125 C (automotive AEC-Q100) | [DATA_NEEDED: operating temperature range] |
| 封裝 | 32-pin LQFP, 7 x 7 mm | 44-QFP (10x10 mm) |
| 安裝類型 | Surface Mount (gull-wing) | Surface Mount |
| Debug Interface | Single-wire BDM (background debug mode) | — |
| Instruction Set | HC08 with BGND extension | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-Bit |
| Maximum Bus Frequency | — | 40 MHz |
| Flash Memory | — | 16 KB (16K x 8) |
| EEPROM | — | None (Flash-based) |
| ADC Resolution | — | 10-bit (8 channels) |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 36 |
| Packaging | — | Tray |
| RoHS 狀態 | — | [DATA_NEEDED: RoHS status] |