K4B4G1646D-BMH9 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
MPN: K4B4G1646D-BMH9 ✓ NakahandaK4B4G1646D-BMH9 Ulas
DDR3L SDRAM is a type of dynamic random-access memory that uses double data rate architecture to transfer data on both edges of the clock signal, effectively doubling the data rate. It is part of the DDR3 family, which is a successor to DDR2 and offers higher bandwidth and lower power consumption. DDR3L specifically operates at 1.35V, distinguishing it from standard DDR3 (1.5V) and enabling its use in mobile and embedded systems where power efficiency is critical.
Key features include programmable CAS latency, write latency, on-die termination (ODT), and internal calibration for signal integrity. The device supports burst lengths of 8 and 4, and includes auto-refresh and self-refresh modes for power management. The 96-ball FBGA package provides excellent thermal and electrical performance, with a ball pitch of 0.8mm, suitable for high-density PCB designs.
Technically, the K4B4G1646D-BMH9 utilizes Samsung's advanced D-die process technology, which enhances speed and reduces power consumption. The device supports DLL (Delay-Locked Loop) enabled mode for precise timing, and includes features like write leveling and read leveling for improved signal integrity in high-speed systems. The memory is organized with 8 banks, allowing for efficient interleaving and reduced latency.
Typical applications include embedded systems, networking equipment, industrial computing, and consumer electronics such as set-top boxes and routers. Its low voltage and high density make it suitable for DDR3L SODIMM modules and on-board memory in space-constrained designs.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at 2133Mb/s. The device requires a 1.35V supply and a separate VDDQ supply, which should be regulated accurately.
Mga alternatibo na pwedeng ilagay na K4B4G1646D-BMH9 — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok K4B4G1646D-BMH9 (parehas na form factor at footprint) — pagkakaiba sa Data Rate, Package, Burst Length, CAS Latency, Operating Temperature.
K4B4G1646D-BHMA
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →K4B4G1646D-BFMA
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →K4B4G1646D-BYK0
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →MT41K256M16HA-125
⚡ Parehong Package✗ Wala sa Stock
$6.3636 / Yunit
Tingnan ang Datasheet →H5TC4G63AFR-RDA
⚡ Parehong Package📋 Alternatibo na Reference (hindi sa katalogo)
K4B4G1646D-BMH9 Mga Pinakamataas na Rating at Electrical Characteristics
| Uri ng Memory | DDR3L SDRAM |
| Density | 4Gb |
| Organisasyon | 256M x 16 |
| Number of Banks | 8 |
| Rate ng Data | 2133 Mb/s per pin |
| Supply Voltage (VDD) | 1.35V |
| Supply Voltage (VDDQ) | 1.35V |
| Packhaging | 96-ball FBGA (9x13mm) |
| Ball Pitch | 0.8mm |
| Latensya ng CAS | Programmable |
| Burst Length | 8 and 4 |
| Tindminan RoHS | Compliant |
| Lead-Free | Yes |
| Wala sa Halogen | Yes |
Pin Configuration ng K4B4G1646D-BMH9
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDDQ — I/O power supply |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
| Pin A13 | VDD — Power supply |
| Pin A14 | VSS — Ground |
| Pin A15 | DQ8 — Data input/output 8 |
| Pin A16 | DQ9 — Data input/output 9 |
| Pin A17 | VDDQ — I/O power supply |
| Pin A18 | DQ10 — Data input/output 10 |
| Pin A19 | DQ11 — Data input/output 11 |
| Pin A20 | VSS — Ground |
| Pin A21 | DQ12 — Data input/output 12 |
| Pin A22 | DQ13 — Data input/output 13 |
| Pin A23 | VDD — Power supply |
| Pin A24 | DQ14 — Data input/output 14 |
| Pin A25 | DQ15 — Data input/output 15 |
| Pin A26 | VSS — Ground |
| Pin A27 | VDDQ — I/O power supply |
| Pin A28 | VSS — Ground |
| Pin A29 | VDD — Power supply |
| Pin A30 | VSS — Ground |
| Pin A31 | VDDQ — I/O power supply |
| Pin A32 | VSS — Ground |
| Pin A33 | VDD — Power supply |
| Pin A34 | VSS — Ground |
| Pin A35 | VDDQ — I/O power supply |
| Pin A36 | VSS — Ground |
| Pin A37 | VDD — Power supply |
| Pin A38 | VSS — Ground |
| Pin A39 | VDDQ — I/O power supply |
| Pin A40 | VSS — Ground |
| Pin A41 | VDD — Power supply |
| Pin A42 | VSS — Ground |
| Pin A43 | VDDQ — I/O power supply |
| Pin A44 | VSS — Ground |
| Pin A45 | VDD — Power supply |
| Pin A46 | VSS — Ground |
| Pin A47 | VDDQ — I/O power supply |
| Pin A48 | VSS — Ground |
| Pin A49 | VDD — Power supply |
| Pin A50 | VSS — Ground |
| Pin A51 | VDDQ — I/O power supply |
| Pin A52 | VSS — Ground |
| Pin A53 | VDD — Power supply |
| Pin A54 | VSS — Ground |
| Pin A55 | VDDQ — I/O power supply |
| Pin A56 | VSS — Ground |
| Pin A57 | VDD — Power supply |
| Pin A58 | VSS — Ground |
| Pin A59 | VDDQ — I/O power supply |
| Pin A60 | VSS — Ground |
| Pin A61 | VDD — Power supply |
| Pin A62 | VSS — Ground |
| Pin A63 | VDDQ — I/O power supply |
| Pin A64 | VSS — Ground |
| Pin A65 | VDD — Power supply |
| Pin A66 | VSS — Ground |
| Pin A67 | VDDQ — I/O power supply |
| Pin A68 | VSS — Ground |
| Pin A69 | VDD — Power supply |
| Pin A70 | VSS — Ground |
| Pin A71 | VDDQ — I/O power supply |
| Pin A72 | VSS — Ground |
| Pin A73 | VDD — Power supply |
| Pin A74 | VSS — Ground |
| Pin A75 | VDDQ — I/O power supply |
| Pin A76 | VSS — Ground |
| Pin A77 | VDD — Power supply |
| Pin A78 | VSS — Ground |
| Pin A79 | VDDQ — I/O power supply |
| Pin A80 | VSS — Ground |
| Pin A81 | VDD — Power supply |
| Pin A82 | VSS — Ground |
| Pin A83 | VDDQ — I/O power supply |
| Pin A84 | VSS — Ground |
| Pin A85 | VDD — Power supply |
| Pin A86 | VSS — Ground |
| Pin A87 | VDDQ — I/O power supply |
| Pin A88 | VSS — Ground |
| Pin A89 | VDD — Power supply |
| Pin A90 | VSS — Ground |
| Pin A91 | VDDQ — I/O power supply |
| Pin A92 | VSS — Ground |
| Pin A93 | VDD — Power supply |
| Pin A94 | VSS — Ground |
| Pin A95 | VDDQ — I/O power supply |
| Pin A96 | VSS — Ground |
Tipikal na mga Gamit
K4B4G1646D-BMH9 ay nararapat para sa 6 aplikasyons: Embedded Systems, Networking Equipment, Industrial Computing, Consumer Electronics, Automotive Infotainment, Data Center and Cloud Computing.
Embedded Systems
The K4B4G1646D-BMH9 is ideal for embedded systems requiring low power and high density memory. Its 1.35V operation reduces power consumption, making it suitable for battery-powered devices. The 4Gb density provides ample storage for operating systems and applications. The 96-ball FBGA package allows for compact PCB designs, essential in space-constrained embedded applications. With data rates up to 2133Mb/s, it supports fast data processing, enhancing system responsiveness. The device's low power and high performance make it a preferred choice for industrial controllers, IoT gateways, and portable devices.
Inirekomenda
Networking Equipment
In networking equipment such as routers and switches, the K4B4G1646D-BMH9 provides high-speed memory for packet buffering and routing tables. Its 2133Mb/s data rate ensures low latency and high throughput, critical for network performance. The 1.35V operation reduces heat generation, improving reliability in dense networking hardware. The 4Gb density allows for large routing tables and efficient packet processing. The device's on-die termination and internal calibration enhance signal integrity, essential for high-speed data transmission. This makes it a reliable choice for enterprise and carrier-grade networking equipment.
Inirekomenda
Industrial Computing
The K4B4G1646D-BMH9 is well-suited for industrial computing applications such as PLCs, HMI panels, and industrial PCs. Its low power consumption and high reliability make it ideal for harsh environments. The 4Gb density supports complex control algorithms and data logging. The 96-ball FBGA package ensures robust soldering and thermal performance. With data rates up to 2133Mb/s, it enables fast data processing for real-time control. The device's wide operating temperature range (if specified) would further enhance its suitability for industrial settings. Overall, it provides a balance of performance and efficiency for demanding industrial applications.
Inirekomenda
Consumer Electronics
In consumer electronics like set-top boxes, smart TVs, and gaming consoles, the K4B4G1646D-BMH9 provides high-speed memory for multimedia processing. Its 1.35V operation reduces power consumption, extending battery life in portable devices. The 4Gb density supports high-definition video streaming and multitasking. The 96-ball FBGA package allows for slim device designs. With data rates up to 2133Mb/s, it ensures smooth playback and responsive user interfaces. The device's low power and high performance make it a popular choice for consumer electronics manufacturers.
Inirekomenda
Automotive Infotainment
The K4B4G1646D-BMH9 is suitable for automotive infotainment systems, providing high-speed memory for navigation, multimedia, and connectivity features. Its low power consumption is beneficial for vehicle power budgets. The 4Gb density supports complex infotainment software. The 96-ball FBGA package is robust for automotive environments. With data rates up to 2133Mb/s, it enables fast map rendering and media playback. The device's reliability and performance make it a viable option for automotive applications, though AEC-Q100 qualification should be verified for strict automotive requirements.
Inirekomenda
Data Center and Cloud Computing
In data centers and cloud computing, the K4B4G1646D-BMH9 can be used in servers and storage systems for caching and buffering. Its high data rate of 2133Mb/s supports fast data access, improving overall system performance. The 1.35V operation reduces power consumption, lowering operational costs in large-scale deployments. The 4Gb density provides sufficient memory for various workloads. The 96-ball FBGA package is suitable for high-density server boards. The device's reliability and performance make it a cost-effective solution for data center applications, though higher-density DDR4 or DDR5 may be preferred for new designs.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for K4B4G1646D-BMH9 — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | K4B4G1646D-BHMA | K4B4G1646D-BFMA | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Pin Compatibility | Reference | Pin-compatible | Pin-compatible | Not pin-compatible (ballout differences) |
Pangunahing mga Pagkakaiba
- Low voltage operation at 1.35V (kumpara saMT41K256M16HA-125)
- Higher data rate support up to 2133Mb/s (kumpara saMT41K256M16HA-125)
- Pin-compatible with other Samsung variants (kumpara saH5TC4G63AFR-RDA)
Talaan ng Disenyo
Ensure stable power supply for VDD and VDDQ at 1.35V. Use low-ESR decoupling capacitors (0.1uF and 1uF) placed close to each power pin to minimize noise and voltage droop during high-speed switching. The device requires both VDD and VDDQ supplies; they should be derived from the same source to avoid potential latch-up.
Follow the layout guidelines in the Samsung datasheet for high-speed DDR3L routing. Maintain controlled impedance for DQ, DQS, and address/command lines (typically 40-60 ohms). Keep trace lengths matched within +/- 50 mils for data groups to ensure signal integrity. Use ground planes to provide a low-inductance return path.
The 96-ball FBGA package has a thermal resistance that depends on PCB design. Ensure adequate thermal vias under the package to dissipate heat. For typical applications, the power dissipation is low due to 1.35V operation, but in high-temperature environments, consider airflow or heatsinking. Monitor junction temperature to stay within the specified operating range.
Impormasyon ng Pagsunod sa Kautusan
RoHS compliant and halogen-free per datasheet. AEC-Q100 not applicable for memory ICs.
