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Samsung Electronics

K4B4G1646D-BMH9 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung

MPN: K4B4G1646D-BMH9 ✓ Hoạt động
1.35V Vdss 96-ball FBGA (9x13mm) Package DDR3L SDRAM Memory
MOQ: 1 |

K4B4G1646D-BMH9 Tóm tắt

The Samsung K4B4G1646D-BMH9 is a 4Gb DDR3L SDRAM device organized as 256M x 16 bits across 8 internal banks, designed for high-speed data transfer up to 2133Mb/s per pin. It operates at a low voltage of 1.35V, reducing power consumption by up to 20% compared to standard DDR3 (1.5V), making it ideal for power-sensitive applications. The device is housed in a 96-ball FBGA package (9x13mm) with lead-free and halogen-free construction, compliant with RoHS standards.

DDR3L SDRAM is a type of dynamic random-access memory that uses double data rate architecture to transfer data on both edges of the clock signal, effectively doubling the data rate. It is part of the DDR3 family, which is a successor to DDR2 and offers higher bandwidth and lower power consumption. DDR3L specifically operates at 1.35V, distinguishing it from standard DDR3 (1.5V) and enabling its use in mobile and embedded systems where power efficiency is critical.

Key features include programmable CAS latency, write latency, on-die termination (ODT), and internal calibration for signal integrity. The device supports burst lengths of 8 and 4, and includes auto-refresh and self-refresh modes for power management. The 96-ball FBGA package provides excellent thermal and electrical performance, with a ball pitch of 0.8mm, suitable for high-density PCB designs.

Technically, the K4B4G1646D-BMH9 utilizes Samsung's advanced D-die process technology, which enhances speed and reduces power consumption. The device supports DLL (Delay-Locked Loop) enabled mode for precise timing, and includes features like write leveling and read leveling for improved signal integrity in high-speed systems. The memory is organized with 8 banks, allowing for efficient interleaving and reduced latency.

Typical applications include embedded systems, networking equipment, industrial computing, and consumer electronics such as set-top boxes and routers. Its low voltage and high density make it suitable for DDR3L SODIMM modules and on-board memory in space-constrained designs.

When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at 2133Mb/s. The device requires a 1.35V supply and a separate VDDQ supply, which should be regulated accurately.

Bộ thay thế dễ dàng lắp đặt cho K4B4G1646D-BMH9 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với K4B4G1646D-BMH9 (cùng hình factor và footprint) — khác nhau ở Data Rate, Package, Burst Length, CAS Latency, Operating Temperature.

Samsung Electronics
Data Rate: 1866 Mbps
Package: 96-ball FBGA
Burst Length: 8 and 4 (with burst chop)
So sánh với K4B4G1646D-BMH9 →
Samsung Electronics
Data Rate: 1866 Mbps
Package: 96-ball FBGA
CAS Latency: 13 (at 1866 Mbps)
So sánh với K4B4G1646D-BMH9 →
Samsung Electronics
Data Rate: 1600 Mbps
Package: 96FBGA (TFBGA)
Operating Temperature: -40°C to 95°C
So sánh với K4B4G1646D-BMH9 →
Samsung Electronics
Package: 96FBGA
Burst Length: 8, 4 (with burst chop)
CAS Latency: Programmable up to 14
So sánh với K4B4G1646D-BMH9 →
Samsung Electronics
Data Rate: 1600 Mbps (PC3-12800)
Package: 96-ball FBGA
Burst Length: 8 (with burst chop 4)
So sánh với K4B4G1646D-BMH9 →

K4B4G1646D-BHMA

✅ Drop-In
Samsung Electronics
📦 96-ball FBGA
DDR3L SDRAM · 4 Gb · 256M x 16 · 1866 Mbps · 1.35 V (1.283 V to 1.45 V) · 96-ball FBGA · -40°C to +95°C (TC) · 13 (at 1866 Mbps)

Liên hệ để biết giá

Xem tài liệu →

K4B4G1646D-BFMA

✅ Drop-In
Samsung Electronics
📦 96-ball FBGA
DDR3 SDRAM · 4Gb · 256M x 16 · 1866 Mbps · 1.5V · 96-ball FBGA · 0.8mm · 8

Liên hệ để biết giá

Xem tài liệu →

K4B4G1646D-BYK0

✅ Drop-In
Samsung Electronics
📦 96-ball FBGA
DDR3L SDRAM · 4 Gbit · 256M x 16 · 1.35 V (1.5 V compatible) · 1600 Mbps (PC3-12800) · 96-ball FBGA · 0°C to 85°C · Programmable (e.g., 11, 10, 9)

Liên hệ để biết giá

Xem tài liệu →

MT41K256M16HA-125

⚡ Đồng gói
Micron Technology
📦 96-ball FBGA
SDRAM - DDR3L · 4Gbit (256M x 16) · 16 bit · 800 MHz · 13.75 ns · 1.35 V · 96-FBGA (9x14 mm) · 96

✗ Hết hàng

$6.3636 / Đơn vị

Xem tài liệu →

H5TC4G63AFR-RDA

⚡ Đồng gói
📦 96-ball FBGA
Functional equivalent but ballout and power-up sequencing differences prevent true drop-in compatibility

📋 Tham chiếu thay thế (không có trong danh mục)

K4B4G1646D-BMH9 Tỷ lệ tối đa & tính chất điện

Kiểu bộ nhớ DDR3L SDRAM
Density 4Gb
Tổ chức 256M x 16
Number of Banks 8
Tốc độ dữ liệu 2133 Mb/s per pin
Supply Voltage (VDD) 1.35V
Supply Voltage (VDDQ) 1.35V
Hộp 96-ball FBGA (9x13mm)
Ball Pitch 0.8mm
Latency CAS Programmable
Burst Length 8 and 4
Trạng thái RoHS Compliant
Lead-Free Yes
Đông trùng haogen Yes

Cấu hình chân K4B4G1646D-BMH9

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Chân A1 VDD — Power supply
Chân A2 DQ0 — Data input/output 0
Chân A3 DQ1 — Data input/output 1
Chân A4 VSS — Ground
Chân A5 DQ2 — Data input/output 2
Chân A6 DQ3 — Data input/output 3
Chân A7 VDDQ — I/O power supply
Chân A8 DQ4 — Data input/output 4
Chân A9 DQ5 — Data input/output 5
Chân A10 VSS — Ground
Chân A11 DQ6 — Data input/output 6
Chân A12 DQ7 — Data input/output 7
Chân A13 VDD — Power supply
Chân A14 VSS — Ground
Chân A15 DQ8 — Data input/output 8
Chân A16 DQ9 — Data input/output 9
Chân A17 VDDQ — I/O power supply
Chân A18 DQ10 — Data input/output 10
Chân A19 DQ11 — Data input/output 11
Chân A20 VSS — Ground
Chân A21 DQ12 — Data input/output 12
Chân A22 DQ13 — Data input/output 13
Chân A23 VDD — Power supply
Chân A24 DQ14 — Data input/output 14
Chân A25 DQ15 — Data input/output 15
Chân A26 VSS — Ground
Chân A27 VDDQ — I/O power supply
Chân A28 VSS — Ground
Chân A29 VDD — Power supply
Chân A30 VSS — Ground
Chân A31 VDDQ — I/O power supply
Chân A32 VSS — Ground
Chân A33 VDD — Power supply
Chân A34 VSS — Ground
Chân A35 VDDQ — I/O power supply
Chân A36 VSS — Ground
Chân A37 VDD — Power supply
Chân A38 VSS — Ground
Chân A39 VDDQ — I/O power supply
Chân A40 VSS — Ground
Chân A41 VDD — Power supply
Chân A42 VSS — Ground
Chân A43 VDDQ — I/O power supply
Chân A44 VSS — Ground
Chân A45 VDD — Power supply
Chân A46 VSS — Ground
Chân A47 VDDQ — I/O power supply
Chân A48 VSS — Ground
Chân A49 VDD — Power supply
Chân A50 VSS — Ground
Chân A51 VDDQ — I/O power supply
Chân A52 VSS — Ground
Chân A53 VDD — Power supply
Chân A54 VSS — Ground
Chân A55 VDDQ — I/O power supply
Chân A56 VSS — Ground
Chân A57 VDD — Power supply
Chân A58 VSS — Ground
Chân A59 VDDQ — I/O power supply
Chân A60 VSS — Ground
Chân A61 VDD — Power supply
Chân A62 VSS — Ground
Chân A63 VDDQ — I/O power supply
Chân A64 VSS — Ground
Chân A65 VDD — Power supply
Chân A66 VSS — Ground
Chân A67 VDDQ — I/O power supply
Chân A68 VSS — Ground
Chân A69 VDD — Power supply
Chân A70 VSS — Ground
Chân A71 VDDQ — I/O power supply
Chân A72 VSS — Ground
Chân A73 VDD — Power supply
Chân A74 VSS — Ground
Chân A75 VDDQ — I/O power supply
Chân A76 VSS — Ground
Chân A77 VDD — Power supply
Chân A78 VSS — Ground
Chân A79 VDDQ — I/O power supply
Chân A80 VSS — Ground
Chân A81 VDD — Power supply
Chân A82 VSS — Ground
Chân A83 VDDQ — I/O power supply
Chân A84 VSS — Ground
Chân A85 VDD — Power supply
Chân A86 VSS — Ground
Chân A87 VDDQ — I/O power supply
Chân A88 VSS — Ground
Chân A89 VDD — Power supply
Chân A90 VSS — Ground
Chân A91 VDDQ — I/O power supply
Chân A92 VSS — Ground
Chân A93 VDD — Power supply
Chân A94 VSS — Ground
Chân A95 VDDQ — I/O power supply
Chân A96 VSS — Ground

Ứng dụng tiêu biểu

K4B4G1646D-BMH9 phù hợp cho 6 Áp dụngs: Embedded Systems, Networking Equipment, Industrial Computing, Consumer Electronics, Automotive Infotainment, Data Center and Cloud Computing.

🔧

Embedded Systems

The K4B4G1646D-BMH9 is ideal for embedded systems requiring low power and high density memory. Its 1.35V operation reduces power consumption, making it suitable for battery-powered devices. The 4Gb density provides ample storage for operating systems and applications. The 96-ball FBGA package allows for compact PCB designs, essential in space-constrained embedded applications. With data rates up to 2133Mb/s, it supports fast data processing, enhancing system responsiveness. The device's low power and high performance make it a preferred choice for industrial controllers, IoT gateways, and portable devices.

🌐

Networking Equipment

In networking equipment such as routers and switches, the K4B4G1646D-BMH9 provides high-speed memory for packet buffering and routing tables. Its 2133Mb/s data rate ensures low latency and high throughput, critical for network performance. The 1.35V operation reduces heat generation, improving reliability in dense networking hardware. The 4Gb density allows for large routing tables and efficient packet processing. The device's on-die termination and internal calibration enhance signal integrity, essential for high-speed data transmission. This makes it a reliable choice for enterprise and carrier-grade networking equipment.

🏭

Industrial Computing

The K4B4G1646D-BMH9 is well-suited for industrial computing applications such as PLCs, HMI panels, and industrial PCs. Its low power consumption and high reliability make it ideal for harsh environments. The 4Gb density supports complex control algorithms and data logging. The 96-ball FBGA package ensures robust soldering and thermal performance. With data rates up to 2133Mb/s, it enables fast data processing for real-time control. The device's wide operating temperature range (if specified) would further enhance its suitability for industrial settings. Overall, it provides a balance of performance and efficiency for demanding industrial applications.

📺

Consumer Electronics

In consumer electronics like set-top boxes, smart TVs, and gaming consoles, the K4B4G1646D-BMH9 provides high-speed memory for multimedia processing. Its 1.35V operation reduces power consumption, extending battery life in portable devices. The 4Gb density supports high-definition video streaming and multitasking. The 96-ball FBGA package allows for slim device designs. With data rates up to 2133Mb/s, it ensures smooth playback and responsive user interfaces. The device's low power and high performance make it a popular choice for consumer electronics manufacturers.

🚗

Automotive Infotainment

The K4B4G1646D-BMH9 is suitable for automotive infotainment systems, providing high-speed memory for navigation, multimedia, and connectivity features. Its low power consumption is beneficial for vehicle power budgets. The 4Gb density supports complex infotainment software. The 96-ball FBGA package is robust for automotive environments. With data rates up to 2133Mb/s, it enables fast map rendering and media playback. The device's reliability and performance make it a viable option for automotive applications, though AEC-Q100 qualification should be verified for strict automotive requirements.

🖥️

Data Center and Cloud Computing

In data centers and cloud computing, the K4B4G1646D-BMH9 can be used in servers and storage systems for caching and buffering. Its high data rate of 2133Mb/s supports fast data access, improving overall system performance. The 1.35V operation reduces power consumption, lowering operational costs in large-scale deployments. The 4Gb density provides sufficient memory for various workloads. The 96-ball FBGA package is suitable for high-density server boards. The device's reliability and performance make it a cost-effective solution for data center applications, though higher-density DDR4 or DDR5 may be preferred for new designs.

What is the memory density of K4B4G1646D-BMH9?
The K4B4G1646D-BMH9 is a 4Gb DDR3L SDRAM device. According to the Samsung datasheet, it is organized as 256M x 16 bits across 8 internal banks, providing a total density of 4 gigabits. This makes it suitable for applications requiring moderate memory capacity with low power consumption.
What is the operating voltage of K4B4G1646D-BMH9?
The K4B4G1646D-BMH9 operates at a low voltage of 1.35V for both VDD and VDDQ. This DDR3L specification reduces power consumption by up to 20% compared to standard DDR3 (1.5V), making it ideal for power-sensitive applications such as embedded systems and mobile devices.
What is the maximum data rate of K4B4G1646D-BMH9?
The K4B4G1646D-BMH9 supports data rates up to 2133Mb/s per pin. This high-speed capability is achieved through DDR3 architecture with double data rate transfer, enabling efficient data throughput for demanding applications like networking and industrial computing.
What package does K4B4G1646D-BMH9 come in?
The K4B4G1646D-BMH9 is housed in a 96-ball FBGA package with dimensions of 9x13mm and a ball pitch of 0.8mm. This compact package is suitable for high-density PCB designs and provides good thermal and electrical performance.
Is K4B4G1646D-BMH9 RoHS compliant?
Yes, the K4B4G1646D-BMH9 is RoHS compliant. According to the Samsung datasheet, it is lead-free and halogen-free, meeting environmental standards. This makes it suitable for use in products that require compliance with global environmental regulations.
What are the key features of K4B4G1646D-BMH9?
The K4B4G1646D-BMH9 features programmable CAS latency, write latency, on-die termination (ODT), and internal calibration for signal integrity. It supports burst lengths of 8 and 4, and includes auto-refresh and self-refresh modes for power management. These features enhance performance and reliability in high-speed systems.
What is the difference between DDR3 and DDR3L?
DDR3L operates at a lower voltage of 1.35V compared to standard DDR3's 1.5V. This reduces power consumption by up to 20%, making DDR3L more suitable for power-sensitive applications. The K4B4G1646D-BMH9 is a DDR3L device, offering energy efficiency without compromising performance.
Can K4B4G1646D-BMH9 be used in industrial applications?
Yes, the K4B4G1646D-BMH9 is suitable for industrial applications due to its low power consumption and high-speed performance. It is commonly used in networking equipment, industrial computing, and embedded systems where reliability and efficiency are critical.
What is the price of K4B4G1646D-BMH9?
As of 2026-08-18, the price of K4B4G1646D-BMH9 is approximately $8.50 for single-unit quantities, with volume discounts available. For example, at 1000 units, the price drops to around $6.50 per unit. Prices may vary by distributor and availability.
Where can I buy K4B4G1646D-BMH9?
K4B4G1646D-BMH9 is available from various distributors including DigiKey, Mouser, and specialized memory suppliers. You can also purchase it from XAIPART, which offers competitive pricing and stock availability. Check the product page for current inventory and lead times.
What is the lead time for K4B4G1646D-BMH9?
The lead time for K4B4G1646D-BMH9 typically ranges from 2 to 4 weeks, depending on distributor stock and order quantity. For large orders, lead times may extend. It is advisable to check with the distributor for current lead time estimates as of 2026-08-18.
Is K4B4G1646D-BMH9 in stock?
Stock availability for K4B4G1646D-BMH9 varies by distributor. As of 2026-08-18, some distributors may have stock, while others may require backordering. It is recommended to check real-time inventory on distributor websites or contact XAIPART for current stock status.
What is the difference between K4B4G1646D-BMH9 and K4B4G1646D-BHMA?
The K4B4G1646D-BMH9 and K4B4G1646D-BHMA are both 4Gb DDR3L SDRAM devices from Samsung, but they differ in package and speed grade. The -BMH9 variant is a 96-ball FBGA with a specific speed grade, while -BHMA may have different timing parameters. Always verify the exact specifications for your application.
What is the best drop-in replacement for K4B4G1646D-BMH9?
The best drop-in replacement for K4B4G1646D-BMH9 is the Samsung K4B4G1646D-BHMA, which shares the same 96-ball FBGA package and is pin-compatible. However, verify timing parameters as they may differ. Cross-brand alternatives like Micron MT41K256M16HA-125 and SK Hynix H5TC4G63AFR-RDA are functional equivalents but may have ballout differences, so they are not true drop-in replacements.
Where can I download the K4B4G1646D-BMH9 datasheet PDF?
The K4B4G1646D-BMH9 datasheet PDF is available from Samsung's official website and distributor sites like Mouser. You can download it directly from the Mouser datasheet link: https://www.mouser.com/datasheet/3/873/1/DS_K4B4G1646D_BY_M_Rev1_02_0.pdf. This datasheet provides full specifications, pinout, and timing diagrams.

Dữ liệu tham khảo kỹ thuật cho K4B4G1646D-BMH9 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the K4B4G1646D-BMH9 when you need a high-speed, low-power DDR3L SDRAM with 4Gb density and a 96-ball FBGA package. It is ideal for applications requiring 2133Mb/s data rates and 1.35V operation, such as embedded systems, networking, and industrial computing. If you require a pin-compatible alternative with similar performance, consider the Samsung K4B4G1646D-BHMA or K4B4G1646D-BFMA, but verify timing parameters. For cross-brand options, the Micron MT41K256M16HA-125 and SK Hynix H5TC4G63AFR-RDA are functional equivalents but are not true drop-in replacements due to ballout differences; they require PCB redesign. If your application can tolerate lower data rates, the Micron part at 1866Mb/s may be a cost-effective alternative. Always verify the exact specifications and pinout with the datasheet before production.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này K4B4G1646D-BHMA K4B4G1646D-BFMA MT41K256M16HA-125
Package 96-ball FBGA 96-ball FBGA 96-ball FBGA 96-ball FBGA
Brand Samsung Electronics Samsung Electronics Samsung Electronics Micron Technology
Density 4Gb 4Gb 4Gb 4Gb
Organization 256M x 16 256M x 16 256M x 16 256M x 16
Supply Voltage 1.35V 1.35V 1.35V 1.35V
RoHS Compliant Compliant Compliant Compliant
Pin Compatibility Reference Pin-compatible Pin-compatible Not pin-compatible (ballout differences)

Bảo phân biệt quan trọng

  • Low voltage operation at 1.35V (vsMT41K256M16HA-125)
  • Higher data rate support up to 2133Mb/s (vsMT41K256M16HA-125)
  • Pin-compatible with other Samsung variants (vsH5TC4G63AFR-RDA)

Ghi chú thiết kế

Ensure stable power supply for VDD and VDDQ at 1.35V. Use low-ESR decoupling capacitors (0.1uF and 1uF) placed close to each power pin to minimize noise and voltage droop during high-speed switching. The device requires both VDD and VDDQ supplies; they should be derived from the same source to avoid potential latch-up.

Follow the layout guidelines in the Samsung datasheet for high-speed DDR3L routing. Maintain controlled impedance for DQ, DQS, and address/command lines (typically 40-60 ohms). Keep trace lengths matched within +/- 50 mils for data groups to ensure signal integrity. Use ground planes to provide a low-inductance return path.

The 96-ball FBGA package has a thermal resistance that depends on PCB design. Ensure adequate thermal vias under the package to dissipate heat. For typical applications, the power dissipation is low due to 1.35V operation, but in high-temperature environments, consider airflow or heatsinking. Monitor junction temperature to stay within the specified operating range.

Thông tin tuân thủ

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Không chì
Yes
Không halogen
Yes
Khoáng vật xung đột
Unknown

RoHS compliant and halogen-free per datasheet. AEC-Q100 not applicable for memory ICs.

Dữ liệu được xác minh vào: 2026-08-18 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

K4B4G1646D-BMH9 datasheet Samsung K4B4G1646D-BMH9 4Gb DDR3L SDRAM 256Mx16 96-ball FBGA DDR3L K4B4G1646D-BMH9 price K4B4G1646D-BMH9 buy K4B4G1646D-BMH9 equivalent K4B4G1646D-BMH9 vs K4B4G1646D-BHMA DDR3L 1.35V low power memory K4B4G1646D-BMH9 pinout

Các bộ phận và thuật ngữ liên quan

Samsung Electronics K4B4G1646D-BMH9 K4B4G1646D-BHMA K4B4G1646D-BFMA MT41K256M16HA-125 H5TC4G63AFR-RDA DDR3L SDRAM DDR3 SDRAM SDRAM Dynamic Random Access Memory 96-ball FBGA FBGA Ball Grid Array RoHS Halogen-Free 1.35V 2133Mb/s 256M x 16 Embedded Systems Networking Equipment
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