H5TC4G63AFR-PBI - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix
MPN： H5TC4G63AFR-PBI ✗ 停產H5TC4G63AFR-PBI 概覽
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DDR3 memory family, which uses double data rate signaling to transfer data on both edges of the clock, and is commonly used in servers, routers, and industrial PCs. DDR3L is backward compatible with DDR3 slots in many designs, making it a versatile choice for memory upgrades.
Key features include a 16-bit I/O width, 8 internal banks, and a burst length of 8 (BL8) with on-die termination (ODT) and programmable CAS latency. The device supports auto-refresh and self-refresh modes, with a typical refresh period of 7.8us at 85°C. The industrial temperature grade ensures reliable operation in harsh environments, and the 96-ball FBGA package provides a compact footprint for space-constrained designs.
The H5TC4G63AFR-PBI uses a CMOS process technology and features a pseudo-open-drain output driver with adjustable impedance. It includes a DLL (Delay-Locked Loop) for precise timing alignment and supports write leveling for improved signal integrity. The memory operates from a single 1.35V supply, with an on-chip voltage regulator for the core, reducing external component count.
Typical applications include network routers and switches, industrial automation controllers, embedded computing modules, and test and measurement equipment. Its low voltage and high density make it ideal for power-sensitive systems that require large memory capacity.
When designing with this device, ensure proper decoupling capacitors are placed near the VDD and VDDQ pins, and follow the PCB layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable 1.35V supply and a clean clock signal for reliable operation.
直接替換替代品，適用於 H5TC4G63AFR-PBI — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： H5TC4G63AFR-PBI （相同外形與佔位） — 差異在於 Package, Data Rate, Burst Length, Supply Voltage, Operating Temperature.
H5TC4G63AFR-PBR
✅ 直接替換✗ 缺貨
$5.9091 / 單位
查看資料表 →H5TC4G63CFR-PBA
✅ 直接替換✗ 缺貨
$6.23 / 單位
查看資料表 →H5TC4G63MFR-PBA
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MT41K256M16HA-125
✅ 直接替換✗ 缺貨
$6.3636 / 單位
查看資料表 →MT41K256M16RE-125:D
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →IS43TR16256AL-125KBLI-TR
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$8.25 / 單位
查看資料表 →NT5CC256M16ER-EKI
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$16.7045 / 單位
查看資料表 →K4B4G1646E-BYMA
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$14.3182 / 單位
查看資料表 →H5TC4G63AFR-PBI 最大額定值與電氣特性
| 記憶體類型 | DDR3L SDRAM |
| 組織 | 256M x 16 |
| Total Memory Size | 4 Gb |
| 資料速率 | DDR3-1600 (PC3L-12800) |
| 供應電壓 | 1.35 V |
| Number of Banks | 8 |
| Burst Length | 8 (BL8) |
| CAS 延遲 | Programmable |
| On-Die Termination (ODT) | Yes |
| Refresh Period | 7.8 us at 85°C |
| 工作溫度範圍 | -40°C to +95°C |
| 封裝 | 96-ball FBGA (TFBGA, BGA96, 9x16, 32) |
| 安裝類型 | Surface Mount |
| Number of Terminals | 96 |
| RoHS 狀態 | Compliant |
H5TC4G63AFR-PBI 腳位配置
| 腳位 A1 | VDD — Power supply for core logic |
| 腳位 A2 | VSS — Ground |
| 腳位 A3 | DQ0 — Data input/output bit 0 |
| 腳位 A4 | DQ1 — Data input/output bit 1 |
| 腳位 A5 | VDDQ — Power supply for I/O |
| 腳位 A6 | VSSQ — Ground for I/O |
| 腳位 A7 | DQ2 — Data input/output bit 2 |
| 腳位 A8 | DQ3 — Data input/output bit 3 |
| 腳位 A9 | VDD — Power supply for core logic |
| 腳位 A10 | VSS — Ground |
| 腳位 B1 | VSS — Ground |
| 腳位 B2 | DQ4 — Data input/output bit 4 |
| 腳位 B3 | DQ5 — Data input/output bit 5 |
| 腳位 B4 | VDDQ — Power supply for I/O |
| 腳位 B5 | VSSQ — Ground for I/O |
| 腳位 B6 | DQ6 — Data input/output bit 6 |
| 腳位 B7 | DQ7 — Data input/output bit 7 |
| 腳位 B8 | VDD — Power supply for core logic |
| 腳位 B9 | VSS — Ground |
| 腳位 B10 | CK — Clock input |
典型應用
H5TC4G63AFR-PBI 適用於 6 應用s: Network Routers and Switches, Industrial Automation Controllers, Embedded Computing Modules, Test and Measurement Equipment, Networking Appliances, Medical Monitoring Devices.
Network Routers and Switches
The H5TC4G63AFR-PBI provides 4Gb DDR3L memory for packet buffering and routing tables in network equipment. Its 1.35V operation reduces power consumption in 24/7 operation, and the industrial temperature range ensures reliability in telecom cabinets. The 16-bit interface simplifies PCB routing, and the 96-ball FBGA package saves board space. With DDR3-1600 speed, it handles high-throughput packet processing without bottlenecking the CPU.
推薦
Industrial Automation Controllers
In industrial PLCs and robotics controllers, the H5TC4G63AFR-PBI offers reliable memory for real-time control algorithms and data logging. Its -40°C to +95°C range withstands factory floor temperatures, and the low 1.35V supply reduces heat generation in sealed enclosures. The 256Mx16 organization provides ample storage for program code and sensor data. The device's on-die termination improves signal integrity in noisy industrial environments.
推薦
Embedded Computing Modules
The H5TC4G63AFR-PBI is ideal for single-board computers and embedded modules that require a balance of performance and power efficiency. Its 4Gb capacity supports Linux-based applications, and the 1.35V operation extends battery life in portable systems. The 96-ball FBGA package is compatible with standard manufacturing processes, and the industrial temperature grade allows deployment in outdoor kiosks and digital signage. The DDR3-1600 speed ensures smooth multitasking.
推薦
Test and Measurement Equipment
In oscilloscopes, spectrum analyzers, and data acquisition systems, the H5TC4G63AFR-PBI provides high-speed memory for waveform capture and processing. Its DDR3-1600 data rate enables fast sampling, and the 16-bit interface matches ADC output widths. The industrial temperature range ensures accuracy in lab and field environments. The low 1.35V supply reduces noise coupling into analog front-ends, preserving measurement integrity.
推薦
Networking Appliances
The H5TC4G63AFR-PBI is used in firewalls, VPN concentrators, and load balancers for session state storage and packet buffering. Its 4Gb density supports large connection tables, and the 1.35V operation reduces power in dense chassis. The industrial temperature range is suitable for server rooms with variable cooling. The device's burst length of 8 optimizes throughput for network traffic patterns.
推薦
Medical Monitoring Devices
In patient monitors and diagnostic equipment, the H5TC4G63AFR-PBI provides reliable memory for real-time data processing and storage. Its industrial temperature range ensures operation in clinical environments, and the low 1.35V supply is suitable for battery-powered portable devices. The 4Gb capacity supports high-resolution waveform storage, and the 16-bit interface simplifies integration with medical-grade MCUs. The device's low power consumption extends battery life.
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推薦產品摘要
工程參考資料，適用於 H5TC4G63AFR-PBI — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | H5TC4G63AFR-PBR | H5TC4G63CFR-PBA | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA (TFBGA, BGA96, 9x16, 32) | 96-ball FBGA (same) | 96-ball FBGA (same) | 96-ball FBGA (same) |
| Brand | SK Hynix | SK Hynix | SK Hynix | Micron |
| Memory Size | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Data Rate | DDR3-1600 | DDR3-1600 | DDR3-1600 | DDR3-1600 |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Temperature Range | -40°C to +95°C | 0°C to +95°C | -40°C to +95°C | 0°C to +95°C |
| Lifecycle Status | Obsolete | Obsolete | Active | Active |
主要差異化特點
- Industrial temperature grade (對比H5TC4G63AFR-PBR)
- Low voltage operation (對比MT41K256M16HA-125)
- Pin compatibility with newer Hynix parts (對比H5TC4G63CFR-PBA)
設計說明
The H5TC4G63AFR-PBI requires a stable 1.35V supply for VDD and VDDQ. Use low-ESR ceramic capacitors (0.1uF and 1uF) placed close to each power pin to decouple high-frequency noise. A bulk capacitor (10uF) should be placed near the memory device to handle transient currents during refresh and burst operations. Ensure the power supply can deliver peak current without voltage droop.
Follow the PCB layout guidelines in the SK Hynix datasheet to minimize signal integrity issues. Route DQ, DQS, and address/command lines with matched lengths to maintain timing. Use ground planes beneath the memory to reduce noise. Place termination resistors for ODT as recommended. Keep the clock traces short and shielded to avoid crosstalk.
The industrial temperature range (-40°C to +95°C) allows operation in harsh environments, but proper thermal management is still required. Ensure adequate airflow or heatsinking if the device is placed near other heat-generating components. The 96-ball FBGA package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values and design accordingly.
合規資訊
RoHS compliant per Kynix product page. Not AEC-Q100 qualified. Other compliance data not available in provided sources.
