K4RAH086VP-BCWM vs K4RBH086VB-BCQK 比較
詳細並排比較 K4RAH086VP-BCWM 由 Samsung Electronics 與 K4RBH086VB-BCQK 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4RAH086VP-BCWM | K4RBH086VB-BCQK |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR5 SDRAM | DDR5 SDRAM |
| 記憶體容量 | 16 Gb | — |
| Memory Organization | 2G x 8 | — |
| 資料速率 | 5600 Mbps/pin | 4800 Mbps |
| 供應電壓 | 1.1 V | — |
| 介面 | Parallel | DDR5 (CA bus, ODECC) |
| Technology | DRAM DDR5 | — |
| Memory Format | DRAM | — |
| Volatile / Non-Volatile | Volatile | — |
| 封裝 | [DATA_NEEDED: exact FBGA package code and body size] | FBGA-82 |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tray | [DATA_NEEDED: tray or tape and reel standard quantity] |
| Application Segment | Industrial | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| 生命週期狀態 | Active | — |
| RoHS 狀態 | unknown | Compliant |
| MSL 等級 | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| Density | — | 16 Gb |
| 組織 | — | 2G x 8 |
| Supply Voltage (VDD) | — | 1.1 V |
| On-die ECC | — | Yes |
| Refresh | — | [DATA_NEEDED: refresh rate 32ms/64ms] |
| CAS Latency (CL) | — | [DATA_NEEDED: CAS latency at 4800 Mbps] |
| Power Supply Rails | — | VDD/VDDQ 1.1 V (PMIC on module) |