EPM570F100C4N - MAX II CPLD, 440 LEs, 100-FBGA | Intel
MPN： EPM570F100C4N ✓ 啟用中EPM570F100C4N 概覽
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device built from a small number of macrocells organized into logic array blocks, designed to replace discrete glue-logic ICs with high-speed combinational and registered logic. CPLDs sit in the programmable logic hierarchy below FPGAs, offering lower logic density but deterministic timing, faster I/O response, and instant-on operation. MAX II devices extend this category with lower static power, higher I/O count per package, and a multi-volt core (3.3 V core / 1.8 V internal) compared with legacy MAX series.
Key features include 440 Logic Elements, 4.4 Kbits of user Flash memory, support for hot-socketing, JTAG boundary-scan testing (IEEE 1149.1), and MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfacing. The 100-FBGA package provides high-density board mounting while maintaining a 11 mm x 11 mm footprint, with commercial temperature grade (0C to +85C).
The EPM570F100C4N is built on a 0.18 um Flash-based process with an internal 3.3 V regulator. Its deterministic timing architecture delivers predictable pin-to-pin delays independent of routing, making it well-suited for control-plane glue logic where designers require guaranteed response times rather than statistical timing closure. The 80 user I/Os include support for PCI-compatible signaling at 3.3 V, Schmitt trigger inputs, and bus-hold circuitry.
Typical applications include bus interface bridging, I/O expansion for microcontrollers, address decoding and glue-logic replacement, LED display control, and power-up sequencing in multi-rail systems. The instant-on (less than 1 ms) configuration time makes it ideal as a boot-loader companion to FPGAs or microcontrollers.
When designing, ensure I/O bank supply voltages match the driven peripherals and place decoupling capacitors as close as possible to the VCCIO and VCCINT pins. Use Quartus II or the free Quartus Prime Lite for synthesis, fitting, and JTAG programming via the ByteBlaster II or USB-Blaster download cable.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with all data cross-referenced to the original Altera/Intel MAX II device handbook.
直接替換替代品，適用於 EPM570F100C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPM570F100C4N （相同外形與佔位） — 差異在於 Operating Temperature, Package, Programming Interface, Process Technology, Configuration Memory.
EPM570F100C5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570F100A5N
✅ 直接替換聯絡詢價
查看資料表 →EPM1270F100C4N
✅ 直接替換📋 參考替代品（不在目錄中）
EPM2210F100C4N
✅ 直接替換📋 參考替代品（不在目錄中）
EPM240F100C4N
✅ 直接替換聯絡詢價
查看資料表 →EPM570F100I4N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EPM570F100C4N 最大額定值與電氣特性
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements | 440 LE |
| Macrocells | 440 |
| Maximum User I/O | 80 |
| Pin-to-Pin Delay (tPD1) | 5.4 ns |
| User Flash Memory | 4.4 Kbits |
| Configuration Technology | Flash (non-volatile, instant-on) |
| Operating Voltage (Core) | 3.3 V (internal regulator) |
| I/O Voltage Support (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 封裝 | 100-FBGA (FineLine BGA) 11 mm x 11 mm |
| 工作溫度 | 0 C to +85 C (commercial) |
| 安裝類型 | Surface Mount (BGA) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Hot Socketing | Yes |
EPM570F100C4N 100-fbga (fineline bga) 11 mm x 11 mm 腳位配置指南
EPM570F100C4N（100-fbga (fineline bga) 11 mm x 11 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPM570F100C4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPM570F100C4N 適用於 6 應用s: Microcontroller I/O Expansion, Bus Interface Bridging, Address Decoding and Chip Select, LED Display and Signage Control, Power Sequencing and Supervisor, Industrial Control and Automation.
Microcontroller I/O Expansion
The EPM570F100C4N's 80 user I/Os and instant-on configuration make it ideal for expanding the limited I/O count of low-pin-count microcontrollers. With 440 logic elements, it can implement multi-port UART bridges, PWM generators, and GPIO expanders in a single chip, reducing BOM cost and PCB area. The deterministic 5.4 ns pin-to-pin delay ensures glitch-free response to time-critical interrupts.
推薦
Bus Interface Bridging
Use the EPM570F100C4N as a glue-logic bridge between microcontrollers and peripherals with mismatched bus protocols. The MultiVolt I/O (1.5 V to 3.3 V) enables level translation between legacy 5 V-tolerant signals and modern low-voltage rails, eliminating discrete translator ICs. The JTAG boundary-scan support simplifies board-level testing in production.
推薦
Address Decoding and Chip Select
The EPM570F100C4N excels at generating address-decoded chip-select signals for memory and peripheral banks in microprocessor systems. With 5.4 ns propagation delay, it meets the timing requirements of fast external memory interfaces while the 440 LEs can decode large address spaces. Hot-socketing allows live insertion in CompactPCI or VME backplane designs.
推薦
LED Display and Signage Control
In LED matrix and signage controllers, the EPM570F100C4N drives row/column multiplexing, PWM dimming, and refresh timing with deterministic latency. The 80 user I/Os can directly drive multiple 8-bit or 16-bit data buses to LED driver chips, while the 4.4 Kbits of user Flash can store lookup tables for gamma correction or color mapping in the device itself.
推薦
Power Sequencing and Supervisor
Program the EPM570F100C4N as a multi-rail power sequencer for FPGA, ASIC, or SoC-based systems. Its instant-on Flash configuration guarantees deterministic startup behavior, while logic elements implement watchdog timers, voltage monitoring, and reset distribution. The 1.5 V to 3.3 V I/O range interfaces directly to most supervisor ICs and PMBus controllers.
推薦
Industrial Control and Automation
With deterministic timing and instant-on operation, the EPM570F100C4N suits industrial PLC I/O modules, motor control interfaces, and sensor signal conditioning. The 100-FBGA package handles moderate vibration, while commercial temperature grade covers most factory-floor applications. Pair it with the EPM570F100I4N industrial variant for -40C to +100C operation in outdoor cabinets.
推薦
推薦產品摘要
工程參考資料，適用於 EPM570F100C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPM570F100C5N | EPM1270F100C4N | EPM2210F100C4N | EPM240F100C4N |
|---|---|---|---|---|---|
| Package | 100-FBGA (FineLine BGA) 11x11 mm | 100-FBGA (FineLine BGA) - same | 100-FBGA (FineLine BGA) - same | 100-FBGA (FineLine BGA) - same | 100-FBGA (FineLine BGA) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 440 LE | 440 LE | 1,270 LE | 2,210 LE | 192 LE |
| Pin-to-Pin Delay (tPD1) | 5.4 ns | 6.5 ns | 5.4 ns | 5.4 ns | 4.7 ns |
| Maximum User I/O | 80 | 80 | 100 | 100 | 80 |
| User Flash Memory | 4.4 Kbits | 4.4 Kbits | 8 Kbits | 8 Kbits | 2.0 Kbits |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Configuration Technology | Flash (non-volatile) | Flash | Flash | Flash | Flash |
主要差異化特點
- Highest density at lowest cost in 100-FBGA (對比EPM240F100C4N)
- Vertical migration path within the same package (對比EPM1270F100C4N / EPM2210F100C4N)
- Faster than C5 speed grade (對比EPM570F100C5N)
設計說明
The 100-FBGA package has a 1.0 mm ball pitch requiring 4-layer or 6-layer PCB with microvia-in-pad or standard via fan-out. Place VCCIO and VCCINT decoupling capacitors (0.1 uF ceramic + 10 uF bulk) within 5 mm of the respective power balls. Use multiple vias on power and ground pads to minimize inductance for the high-speed internal regulator switching.
Do not confuse the EPM570F100C4N (commercial) with the EPM570F100I4N (industrial -40C to +100C). The C suffix designates commercial 0C to +85C temperature range. Also note the speed grade: C4 = 5.4 ns, C5 = 6.5 ns, A5 = 5.0 ns. Always order the exact part number that matches your timing budget and environmental requirements.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 ohm controlled impedance and keep traces under 50 mm. Add 10 kohm pull-ups on TMS and TDI to ensure valid logic levels during configuration. For multi-device JTAG chains, daisy-chain TDI to TDO and connect TCK/TMS in parallel; consult AN 39 for boundary-scan chain ordering.
合規資訊
RoHS and REACH compliant per Intel/Altera product declaration. Lead-free BGA balls. Not AEC-Q100 qualified - choose EPM570F100I4N for industrial temperature, or a dedicated automotive CPLD for AEC-Q100 requirements.
