EPM570F100I5 - MAX II CPLD, 440 LE, 76 I/O, 100-FBGA | Intel
MPN： EPM570F100I5 ✓ 啟用中EPM570F100I5 概覽
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits in the hierarchy between simple glue-logic PAL/GAL chips and large FPGAs. CPLDs use a programmable AND/OR array with non-volatile configuration memory, providing deterministic, single-clock-cycle propagation delays and instant power-on behavior. MAX II devices specifically use a LUT-based architecture (rather than classic PLA) combined with on-chip Flash configuration to deliver FPGA-like density at CPLD-like simplicity - making them ideal for I/O expansion, bus bridging, interface protocol translation, and power-sequencing logic that must be active immediately at system power-up.
Key features of the EPM570F100I5 include 440 logic elements (LEs), 440 macrocells, 76 user I/O pins, and an internal operating frequency of 201.1 MHz. The device integrates 8 Kbits of user Flash memory (UFM) for storing non-volatile data such as serial numbers, calibration constants, or boot parameters. Multi-voltage I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, allowing direct connection to legacy 5 V-tolerant buses through proper external components. The JTAG-based in-system programmability (ISP) eliminates the need for a separate boot PROM and supports IEEE 1149.1 boundary-scan testing.
Architecturally, the MAX II device uses a uniform interconnect matrix that routes LUT outputs to I/O pins with predictable, fast timing. Every LE includes a 4-input LUT, a programmable register, and a carry chain. The integrated Flash configuration block is in-system programmable through JTAG and supports JTAG-based verification during production test. The UFM block provides a small non-volatile memory that can be accessed from user logic, eliminating the need for a separate EEPROM in many designs.
Typical applications of the EPM570F100I5 include I/O expansion and level translation in industrial control systems, bus protocol bridging (I2C-to-SPI, UART-to-PCI), LED display and lighting control sequencing, power-supply management and hot-swap control logic, JTAG-based test access port (TAP) multiplexing, and general glue-logic replacement in consumer and embedded designs. The instant-on, deterministic-timing characteristics make it especially valuable in power-rail sequencing for processor cores, memory subsystems, and complex SoCs that require controlled bring-up.
When designing with the EPM570F100I5, pay careful attention to the FBGA-100 PCB footprint - a 1.0 mm ball pitch requires precise land pattern design and reflow profile control. Use the Altera/Intel Quartus II design software (legacy) or Quartus Prime to develop, simulate, and program the device; the JTAG interface supports in-system programming after PCB assembly. Provide proper decoupling on each VCCINT and VCCIO bank and follow Intel's recommended BGA routing escape pattern to minimize via stubs and signal-integrity issues on high-speed outputs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical BGA-layout design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing and designing with the EPM570F100I5.
直接替換替代品，適用於 EPM570F100I5 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPM570F100I5 （相同外形與佔位） — 差異在於 Operating Temperature, Package, Process Technology, Programming Interface, Configuration Memory.
EPM570F100C5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570F100C4N
✅ 直接替換聯絡詢價
查看資料表 →EPM570F100A5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570M100I5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570GM100I5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570F100I5 最大額定值與電氣特性
| Family | MAX II |
| Device Series | EPM570 |
| Logic Elements (LEs) | 440 |
| Macrocells | 440 |
| User I/O Pins | 76 |
| Maximum Internal Frequency | 201.1 MHz |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 µm |
| Core Voltage (VCCINT) | 2.5 V / 3.3 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 封裝 | 100-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Configuration Memory | Non-volatile Flash (instant-on) |
| Programming Interface | JTAG (IEEE Std. 1149.1) |
| 工作溫度 | -40C to +100C (industrial grade, 'I') |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
EPM570F100I5 100-ball fbga (fineline bga), 1.0 mm pitch 腳位配置指南
EPM570F100I5（100-ball fbga (fineline bga), 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPM570F100I5.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPM570F100I5 適用於 6 應用s: Industrial I/O Expansion & Level Translation, Bus Protocol Bridging, Power Supply Sequencing & Hot-Swap Control, JTAG TAP Multiplexing & Boundary-Scan Test, LED Display & Lighting Control Sequencing, Glue Logic Replacement in Embedded Boards.
Industrial I/O Expansion & Level Translation
The EPM570F100I5 fits industrial I/O expansion and voltage-level translation because it provides 76 user I/Os with four independent multi-voltage banks (1.5/1.8/2.5/3.3 V VCCIO) and instant-on Flash configuration that eliminates external boot PROMs. In a typical PLC backplane design, the CPLD sits between a 3.3 V SoC and 1.8 V sensors, translating 24 signal lines in a single FBGA-100 footprint while adding deterministic glue logic for interrupt steering and latch-enable generation. The 201.1 MHz internal frequency comfortably handles 50 MHz SPI or 1 MHz industrial fieldbus toggling without timing closure issues.
推薦
Bus Protocol Bridging
The EPM570F100I5 is well suited for bus protocol bridging between asynchronous interfaces (I2C, SPI, UART, parallel GPIO) in embedded systems. Its 440 logic elements comfortably implement state-machine-based protocol converters - for example, SPI-to-I2C bridging or UART-to-Parallel - while the 8-Kbit User Flash Memory stores non-volatile configuration such as I2C slave addresses or bus timing parameters. Industrial temperature grade (-40C to +100C) makes it suitable for factory automation bridges that must operate reliably across unconditioned enclosures.
推薦
Power Supply Sequencing & Hot-Swap Control
The EPM570F100I5's instant-on non-volatile configuration makes it ideal for processor power-rail sequencing in multi-rail systems. With deterministic single-clock-cycle propagation delays, it generates precisely timed enable signals for DC-DC converters in the correct order to satisfy core, memory, and I/O rail-up requirements of SoCs and FPGAs. The 76 user I/Os allow monitoring of PG (power-good) feedback from 6-8 rails and driving 6-8 EN lines concurrently, while the JTAG interface allows in-system reconfiguration of sequencing logic during prototyping without rework.
推薦
JTAG TAP Multiplexing & Boundary-Scan Test
The EPM570F100I5 is commonly used to multiplex JTAG Test Access Ports (TAPs) across multiple devices on a board, allowing a single JTAG header to access several CPLDs, FPGAs, processors, and memory devices in series. Its IEEE 1149.1-compliant TAP controller and high I/O count make it ideal as a JTAG expander in production test fixtures. The non-volatile configuration ensures the multiplexer routing is set correctly from power-on, before any other device is out of reset.
推薦
LED Display & Lighting Control Sequencing
The EPM570F100I5 handles LED matrix refresh, brightness modulation (PWM generation), and panel-sequencing tasks in commercial lighting and signage systems. With 201.1 MHz internal frequency, it can drive dozens of PWM channels at kHz rates with sub-microsecond dead-time control, eliminating flicker in architectural lighting. The 440 logic elements accommodate state-machine-based DMX512 or DALI protocol parsing on the same chip, reducing BOM cost in stage lighting fixtures.
推薦
Glue Logic Replacement in Embedded Boards
The EPM570F100I5 consolidates 5-10 discrete 74-series glue-logic ICs into a single FBGA-100 device, reducing PCB area, BOM count, and assembly cost in complex embedded designs. Functions typically absorbed include address decoding, chip-select generation, interrupt prioritization, watchdog timers, and reset distribution. The 8-Kbit UFM stores board revision or serial number data, allowing boards to identify themselves at boot without a separate EEPROM IC.
推薦
推薦產品摘要
工程參考資料，適用於 EPM570F100I5 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPM570F100C5N | EPM570F100C4N | EPM570F100A5N | EPM570M100I5N | EPM570GM100I5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FBGA-100 (1.0 mm pitch) | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Logic Elements | 440 | 440 | 440 | 440 | 440 | 440 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O | 76 | 76 | 76 | 76 | 76 | 76 |
| Core Voltage (VCCINT) | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 1.8 V |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +125C (automotive/extended) | -40C to +100C (industrial) | -40C to +100C (industrial) |
主要差異化特點
- Industrial-grade temperature rating matched to extended-environment designs (對比EPM570F100C5N)
- Drop-in same-footprint alternative with only the designator letter changed (對比EPM570M100I5N)
- Instant-on Flash configuration with no external boot PROM required (對比EPM570GM100I5N)
設計說明
The FBGA-100 package has a 1.0 mm ball pitch requiring strict adherence to JEDEC BGA land pattern guidelines and Intel's recommended via escape pattern. Use microvias (laser-drilled, 0.1 mm diameter) in the inner layers for signal fan-out to avoid via stubs. The 4-6 layer stackup should allocate one continuous ground plane adjacent to the BGA signal layer to provide controlled impedance and minimize crosstalk on high-speed outputs (LVDS, SSTL).
All VCCINT pins must be tied to a single rail of either 2.5 V or 3.3 V - never a combination. For each VCCIO bank, connect decoupling capacitors (0.1 µF X7R plus 10 µF bulk) within 2 mm of the respective ball. For the EPM570GM100I5N drop-in variant, VCCINT must instead be 1.8 V, so verify core voltage before PCB swap. The flash programming supply (VCCPD) must ramp with VCCINT for reliable ISP.
Do not exceed the maximum junction temperature or operate outside the -40C to +100C industrial window. The FBGA-100 has no lead-free solder re-balling allowance - rework must follow JEDEC J-STD-020 reflow profile with peak temperature not exceeding 245C for lead-free assembly. The device requires Quartus II version 13.0 SP1 (the last MAX II-supported release); newer Quartus Prime versions drop MAX II support.
合規資訊
RoHS and REACH compliant per Intel/Altera product page. Not AEC-Q100 qualified - use EPM570F100A5N for automotive applications requiring extended temperature. Halogen-free status not explicitly stated in the verified data.
