10AS057K2F35E2SG - Arria 10 SX SoC FPGA 570K LE | Intel
MPN: 10AS057K2F35E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3811.48 | $3,811.48 |
| 10 | $3420.32 | $34,203.20 |
| 100 | $2918.94 | $291,894.00 |
| 500 | $2562.1 | $1,281,050.00 |
| 1,000 | $2304.55 | $2,304,550.00 |
Drop-in alternatives for 10AS057K2F35E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS057K2F35E1SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS057K2F35E2LG
✅ Drop-In✓ In Stock
$3450 / Unit
View Datasheet →10AS057K2F35I1HG
✅ Drop-In✓ In Stock
$3820 / Unit
View Datasheet →10AS057H4F34E3LG
✅ Drop-In✓ In Stock
$1820 / Unit
View Datasheet →10AS066K2F35E2SG
✅ Drop-In✓ In Stock
$2890 / Unit
View Datasheet →10AS057K2F35E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 |
| DSP Blocks (18x19 Multipliers) | 1,568 |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | 1.5 GHz |
| Maximum User I/O | 396 |
| Transceiver Count (GX/SX) | 24 |
| Transceiver Max Data Rate | 17.4 Gbps |
| Hard PCIe Blocks | Gen2/Gen3 x4/x8 IP |
| Package | 1152-FBGA, FC (35x35 mm) |
| Speed Grade | E2 (mid-tier) |
| Process Node | 20 nm (TSMC) |
| Mounting Type | Surface Mount (FCBGA) |
| RoHS Status | Compliant (lead-free) |
10AS057K2F35E2SG 1152-fbga, fc (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS057K2F35E2SG (1152-fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057K2F35E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057K2F35E2SG is suitable for 6 applications: 5G Baseband Pre-Processing, Radar and Electronic Warfare DSP, ASIC Prototyping, Broadcast Video Processing, Industrial Motion Controllers, Test and Measurement Instrumentation.
5G Baseband Pre-Processing
The 10AS057K2F35E2SG fits 5G baseband pre-processing because its 24 transceivers at 17.4 Gbps provide enough serial bandwidth for CPRI/eCPRI links, and its 570K logic elements sustain the parallel DSP required for crest-factor reduction, digital predistortion, and front-haul packetization. The 1.5 GHz dual ARM Cortex-A9 HPS runs the MAC scheduler and OAM stack while the FPGA fabric handles PHY-layer functions in deterministic latency. Industrial temperature variants (-40C to +100C) suit outdoor radio units and base-station chassis without active cooling.
Recommended
Radar and Electronic Warfare DSP
The 10AS057K2F35E2SG is well suited to radar and electronic-warfare DSP because its 1,568 hardened 18x19 multipliers execute FFTs, pulse compression, and beamforming kernels with predictable latency. Twenty-four 17.4 Gbps transceivers ingest multi-channel ADC streams directly into the FPGA fabric without external SERDES, simplifying receiver board design. The integrated ARM Cortex-A9 HPS runs the threat library and tracker, eliminating the need for a separate signal-processor card in size-constrained EW pods.
Recommended
ASIC Prototyping
The 10AS057K2F35E2SG is a workhorse ASIC prototyping platform because 570K logic elements plus the 1.5 GHz Cortex-A9 HPS lets engineers emulate complete SoC subsystems on a single device. The F35 1152-FCBGA exposes enough user I/O to break out hundreds of prototype signals, and Intel's Quartus Prime design flows support automatic partitioning of large ASIC RTL into multi-FPGA emulation boards. Industrial temperature variants support validation in environmental chambers for aerospace and automotive ASIC qualification.
Recommended
Broadcast Video Processing
The 10AS057K2F35E2SG fits broadcast video processing because 570K logic elements and the integrated HPS handle multi-stream SDI routing, HEVC/H.264 encode/decode assist, and on-screen graphics compositing on a single device. The Cortex-A9 cores run a Linux-based control plane for IP video streaming, while the FPGA fabric maintains deterministic pixel pipelines. Industrial temperature variants support outdoor broadcast head-end equipment where ambient temperatures swing widely.
Recommended
Industrial Motion Controllers
The 10AS057K2F35E2SG suits high-axis-count industrial motion controllers because 1,568 DSP blocks execute multi-axis PID loops, S-curve profiles, and vibration-suppression filters in hardware with sub-microsecond latency. Twenty-four transceivers drive distributed EtherCAT, Profinet IRT, or SERCOS III master links, and the Cortex-A9 HPS hosts a real-time Linux or VxWorks control stack. The F35 1152-FCBGA package supplies enough GPIO for encoder, limit-switch, and safety I/O across 16+ axes.
Recommended
Test and Measurement Instrumentation
The 10AS057K2F35E2SG fits high-end test and measurement instruments because the dual ARM Cortex-A9 HPS runs a Linux-based instrument control stack while the FPGA fabric executes real-time signal acquisition, DSP, and protocol-decoding functions. Twenty-four 17.4 Gbps transceivers handle multi-lane PCIe Gen3 host connectivity and high-speed serial instrument ports. The 570K logic-element capacity integrates waveform synthesis, FFT analysis, and trigger logic into one device, simplifying thermal management in benchtop or rack-mount form factors.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057K2F35E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057K2F35E1SG | 10AS057K2F35E2LG | 10AS057K2F35I1HG | 10AS057H4F34E3LG | 10AS066K2F35E2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x34) - same BGA family | 1152-FBGA, FC (35x35) - same |
| Logic Elements | 570K | 570K (same) | 570K (same) | 570K (same) | 570K (same) | 660K (+16%) |
| Speed Grade | E2 (mid-tier) | E1 (fastest) | E2 (same) | I1 (industrial) | E3 (slowest) | E2 (same) |
| Temperature Grade | Commercial (E2) | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| HPS Core | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Transceivers | 24 @ up to 17.4 Gbps | 24 @ up to 17.4 Gbps | 24 @ up to 17.4 Gbps | 24 @ up to 17.4 Gbps | 24 @ up to 17.4 Gbps | 24 @ up to 17.4 Gbps |
| Estimated Price (qty 1, as of 2026-09-05) | $3,811.48 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Mid-density sweet spot in Arria 10 SX family (vs 10AS048K2F35E2SG (480K LE))
- F35 1152-FCBGA delivers full 396 user I/O plus 24 transceivers (vs 10AS057K3F40E2SG (F40 package))
- E2 speed grade offers balanced power-vs-performance (vs 10AS057K2F35E1SG (E1 fastest))
- Integrated dual ARM Cortex-A9 HPS eliminates discrete CPU (vs 10AS057N2F35E2SG (non-SoC Arria 10 GX variant))
Design Notes
The F35 1152-FCBGA package has a 1.0 mm ball pitch and 35x35 mm body. Estimated: with a 1.0 mm pitch BGA on standard high-Tg FR-4, a 1+N+1 PCB stack-up with laser-drilled microvias is mandatory for the inner-row escape. Plan at least 8 PCB layers (4 routing + 2 GND + 2 PWR) to fan out the HPS dedicated pins (DDR3, Gigabit Ethernet, USB, NAND/SD) and the 24 transceiver channels without crosstalk above the Gen3 mask. Solid stitched ground pours under the BGA field are required for transceiver return paths.
Estimated: at full FPGA utilization (~85% logic toggle rate) plus active HPS, the 10AS057K2F35E2SG dissipates 12-18 W. The F35 package has a published theta_JA in the 8-12 C/W range (board-dependent), so junction-to-ambient delta is approximately 100-150 C above ambient with only the PCB. A heat-spreader or small heatsink with 200-300 LFM airflow is required to keep Tj below 100C for long-term reliability; in industrial temperature builds, design to ambient 85C with a 1.5x thermal margin.
Use Intel's PowerPlay Early Power Estimator (EPE) for the Arria 10 family to budget rails before PCB layout. The 10AS057K2F35E2SG requires at least 5 separate supplies (0.9 V core, 1.1 V HPS, 1.5/1.8 V transceiver, 1.8/2.5/3.3 V I/O, and HPS reference). Estimated: a 25 A 0.9 V DC-DC buck with 1% ripple is typical for the core rail; decoupling follows Intel's pin-decoupling spreadsheet, which calls for 0402/0201 capacitors inside the BGA field plus bulk capacitors on the underside.
Do not assume a 570K Arria 10 SX bitstream runs on a 660K (10AS066) device without recompiling - density IDs are encoded in the bitstream. Conversely, when migrating from a 480K (10AS048) to this 570K device, only the bitstream needs to be regenerated; the F35 PCB layout is identical. Avoid mixing E2 and E3 speed-grade parts in the same multi-FPGA design: timing closure on E3 will not match E2 margin and downstream debug becomes opaque.
The 24 transceiver channels at 17.4 Gbps require length-matched differential pairs within 150 um and a continuous reference ground plane under each lane. Use Intel's Arria 10 Transceiver Signal Integrity Kit as the starting point for via geometry and stack-up. Estimated: the HPS DDR3/4 interface needs write-leveling and read-DQ centering, with all address/command traces routed on inner stripline layers and 0.1 uF decoupling on every other byte lane.
Compliance Information
Lead-free and halogen-free build per Altera ordering information; RoHS compliant. AEC-Q100 not applicable for this FPGA family - contact Intel automotive business unit for AEC-qualified variants if required.
