EP1S25F1020I6 - Stratix 25K LE FPGA, 706 I/O, FC-FBGA-1020 | Altera
料号： EP1S25F1020I6 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1752.77 | $1,752.77 |
| 10 | $1700 | $17,000.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1580 | $158,000.00 |
| 250 | $1530 | $382,500.00 |
EP1S25F1020I6 概述
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric is composed of programmable Look-Up Tables (LUTs), flip-flops, embedded memory, and routing channels that can be electrically rewired to implement arbitrary digital circuits. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs, distinguished by their higher logic density, embedded DSP blocks, high-speed transceivers, and on-chip memory. The Stratix family in particular targets ASIC-replacement applications where deterministic throughput, parallel processing, and rich I/O bandwidth outweigh the lower unit cost of a hard ASIC.
Key features of the EP1S25F1020I6 include 25,660 logic elements (LEs), 1,944,576 RAM bits (≈ 1.85 Mbits), 2,566 LABs, and up to 706 user I/Os. The device is built on Altera's 130 nm process and is supplied by a 1.5 V core rail. Per Altera's Stratix Family Data Sheet, the part supports configuration via passive serial, fast passive parallel, JTAG, and Altera's enhanced configuration devices, plus on-chip PLL-based clock management for high-speed timing closure.
The architecture combines LUT-based logic, embedded TriMatrix memory blocks, and dedicated DSP blocks optimized for multiply-accumulate operations. The 1.85 Mbit embedded memory is organised into M512, M4K, and MegaRAM blocks for flexible buffering of wide datapaths. Distributed routing and ALM-style adaptive logic ensure predictable timing closure at moderate clock frequencies reported by distributors in the 420 MHz to 450 MHz range.
Typical applications include telecommunications backplane bridging, high-speed serial protocol bridging (PCI Express, RapidIO), video and imaging pipelines, ASIC prototyping, and industrial control DSP blocks. The 706 user I/O pins comfortably interface to wide parallel buses, DDR memory controllers, and high-pin-count companion chips.
Design tip: Use Altera's Quartus II design software (the supported toolchain for this Stratix generation) for synthesis, place-and-route, and timing closure; modern Quartus Prime releases maintain legacy support for older Stratix silicon.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that are not consolidated in the original Altera datasheet, giving engineers a single reference for sourcing the EP1S25F1020I6 today.
直接替换替代料： EP1S25F1020I6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1S25F1020I6 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Mounting Type, DSP Blocks, Logic Cells.
快速对比工具——选择替代料号进行并排对比：
EP1S25F1020C7
✅ 直接替换✓ 有现货
$820 / 个
查看数据手册 →EP1S25F1020C6N
✅ 直接替换✓ 有现货
$450 / 个
查看数据手册 →EP1S25F1020C6
✅ 直接替换✓ 有现货
$425 / 个
查看数据手册 →EP1S25F1020C5N
✅ 直接替换✓ 有现货
$640 / 个
查看数据手册 →EP1S25F1020C5
✅ 直接替换✓ 有现货
$650 / 个
查看数据手册 →EP1S25F1020I6 最大额定值与电气特性
| Family | Stratix |
| Series | Stratix I |
| Logic Elements (LEs) | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory (RAM bits) | 1,944,576 bits (≈ 1.85 Mbits) |
| Maximum User I/O | 706 |
| Maximum Operating Frequency | 450 MHz (per datasheet reference) |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 封装 | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) |
| 安装类型 | Surface Mount (BGA) |
| 工作温度 | -40 °C to +85 °C (industrial) |
| Configuration | Passive serial, fast passive parallel, JTAG, enhanced configuration device |
| On-chip PLL | Yes |
| DSP Blocks | Yes (Stratix DSP blocks) |
EP1S25F1020I6 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) 引脚配置指南
EP1S25F1020I6（1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1S25F1020I6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1S25F1020I6 适用于 6 应用s: Telecommunications Backplane Bridging, High-Speed Protocol Bridging (PCI Express, RapidIO), Video and Imaging Pipeline Processing, ASIC Prototyping and Emulation, Industrial Control and DSP, Test and Measurement Instrumentation.
Telecommunications Backplane Bridging
The EP1S25F1020I6's 25,660 logic elements and 706 user I/O pins make it well suited to telecommunications backplane bridging, where a single FPGA aggregates multiple lower-speed serial links into a higher-speed uplink. With 1.85 Mbits of embedded TriMatrix memory, the device can buffer packets across clock-domain crossings without external SRAM. Per Altera's Stratix datasheet, on-chip PLLs and high-speed LVDS I/O support the multi-channel SERDES aggregation typical of SONET/SDH and OTN bridging designs. The industrial -40 °C to +85 °C grade tolerates outdoor cabinet deployments.
推荐
High-Speed Protocol Bridging (PCI Express, RapidIO)
The 1020-ball FC-FBGA package exposes enough I/O to implement multi-lane PCI Express or RapidIO endpoints with sideband signals and reference clocks, while the 25,660 LEs provide the throughput for protocol state machines, link-layer buffering, and DMA engines. According to Altera's Stratix Family Data Sheet, embedded DSP blocks accelerate encoding/decoding, and the 1.85 Mbit on-chip memory eliminates external FIFOs for typical 256-byte packet buffering. The 1.5 V core and industrial temperature grade support hot-plug PCIe add-in cards and industrial-embedded hosts.
推荐
Video and Imaging Pipeline Processing
The EP1S25F1020I6 is a strong fit for video and imaging pipelines that require pixel-rate processing at HD and 4K resolutions. Its 25,660 LEs sustain wide datapaths for color-space conversion, deinterlacing, and scaling, while 1.85 Mbits of embedded memory provide line buffers that would otherwise require external SRAM. Per Altera's datasheet, dedicated DSP blocks accelerate FIR filters and motion-estimation kernels common in broadcast and machine-vision designs. The 706 user I/Os accept parallel camera LVDS streams and drive HDMI/DVI transmitters directly.
推荐
ASIC Prototyping and Emulation
With 25,660 logic elements in 2,566 LABs, the EP1S25F1020I6 can host multi-million-gate ASIC prototypes for pre-silicon validation and firmware bring-up. Multiple devices can be chained via the dedicated configuration pins to prototype even larger ASICs. Per Altera's documentation, the TriMatrix memory blocks (M512, M4K, MegaRAM) map efficiently onto typical ASIC register files and SRAM macros. The industrial temperature grade supports in-vehicle and outdoor validation environments.
推荐
Industrial Control and DSP
The on-chip DSP blocks combined with 1.85 Mbits of memory make the EP1S25F1020I6 well suited to industrial control loops, motor-control algorithms, and real-time DSP. Its industrial -40 °C to +85 °C grade handles factory-floor ambient swings, while 706 I/O pins drive PWM channels, encoder inputs, and fieldbus interfaces in a single chip. Per the manufacturer datasheet, the 1.5 V core and 130 nm CMOS process balance performance against power dissipation typical of continuous industrial operation.
推荐
Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol testers, and arbitrary waveform generators benefit from the EP1S25F1020I6's deep logic capacity, wide I/O, and embedded memory for deep capture buffers. The 1020-ball FC-FBGA exposes high-speed LVDS pairs for direct ADC/DAC interfacing, while 25,660 LEs implement triggering, sequencing, and on-chip DSP for FFT-based analysis. According to the Stratix datasheet, the device's PLL count and skew control support the multi-channel timing alignment required in digitizer and ATE designs.
推荐
推荐产品汇总
工程参考数据： EP1S25F1020I6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S25F1020C7 | EP1S25F1020C6N | EP1S25F1020C6 | EP1S25F1020C5N | EP1S25F1020C5 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA (33x33 mm, 1 mm pitch) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements (LEs) | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Maximum User I/O | 706 | 706 | 706 | 706 | 706 | 706 |
| Operating Temperature Grade | Industrial -40 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C |
| Speed Grade | 6 (I6) | 7 (faster) | 6 (identical) | 6 (identical) | 5 (slower) | 5 (slower) |
| Lead-Free / N Suffix | Not specified (per lot) | Not specified | Yes (N suffix) | Not specified | Yes (N suffix) | Not specified |
关键差异点
- Industrial temperature grade with full Stratix I logic capacity （对比 EP1S25F1020C6)
- Speed grade 6 balances performance and yield for industrial sockets （对比 EP1S25F1020C5)
- 706 user I/O - the maximum density option in the Stratix I family （对比 EP1S25B672C6)
设计说明
The 1020-ball FC-FBGA package exposes a large thermal pad array but has no integrated heatsink. Estimated: at typical Stratix I utilization of 60-70% LE toggle rate with 1.5 V core, junction-to-ambient thermal resistance (θJA) on a JEDEC 4-layer test board is approximately 12-15 °C/W for 33 x 33 mm FC-FBGA, so a 5 W dissipation produces ~75 °C rise over ambient. Provide a full thermal-ball land pattern on the PCB with continuous copper pour and micro-via array; consider a small clip-on heatsink or 200 LFM airflow for industrial-temperature deployments at high duty cycle.
The 1 mm ball pitch FC-FBGA requires 4-6 layer PCB stack-up with sequential lamination for the micro-via fan-out. Per Altera's Stratix Hardware Reference, route all 706 user I/O through the outer two signal layers with 0.8 mm via-in-pad micro-vias, and dedicate the inner layers to GND and 1.5 V VCCINT planes for solid power integrity. Matched-length groups (within 25 mil) are mandatory for LVDS and DDR interfaces; use series-termination resistors near the FPGA balls per the Quartus II pin planner recommendations.
Do not mix 1.5 V VCCINT and 3.3 V VCCIO rails on the same regulator without proper sequencing - Stratix I devices require VCCINT to ramp before VCCIO. Per Altera's configuration handbook, hot-socketing is not supported on legacy Stratix I, so always sequence power rails via a power-good supervisor before driving I/O. Verify the configuration mode (passive serial, fast passive parallel, JTAG) via MSEL pins before generating the bitstream; mismatched MSEL settings prevent configuration without any visible error.
合规信息
RoHS/REACH/lead-free status for the EP1S25F1020I6 varies by manufacturing lot and distributor source. Lead-free N-suffixed variants (e.g., EP1S25F1020C6N) are RoHS-compliant; non-N variants may be tin-lead BGA. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC; Stratix automotive applications typically use the Cyclone or newer Intel FPGA families. Always request the lot-specific compliance certificate from the distributor (Heisener, Arrow, XAIPART) before release to manufacturing.