FPGA & CPLD
Products (6352)
10AX115U2F45E2SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
The Intel (formerly Altera) 10AX115U2F45E2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) integrating approximately 1,150,000 logic elements with 68,857,560 bits of embedded memory and 480 user I/Os, housed in a 1932-ball Flip-Chip BGA (FCBGA) package. Speed grade 2, core voltage 0.9 V, and industrial-grade temperature screening (E2 suffix) position this device for mid-tier performance designs that need transceiver-rich DSP at moderate thermal headroom. An FPGA (Field-Programmable Gate Array) is a class of programmable logic IC whose function is configured by the user after manufacturing via a configuration bitstream. Architecturally, an FPGA sits between fixed-function ASICs and software-defined processors in the compute hierarchy: silicon-level parallelism + reconfigurable fabric. Arria 10 belongs to Intel's mid-range FPGA family, positioned below Stratix 10 and above Cyclone 10, targeting transceiver-rich applications like 10G/25G Ethernet, PCIe Gen3, and CPRI backhaul. Key features of the 10AX115U2F45E2SG include up to 24 transceivers supporting data rates up to 12.5 Gbps (GX variant), a hardened floating-point DSP block fabric, partial reconfiguration support, and built-in PCI Express Gen3 x8 hard IP. The 20nm process node combined with the FCBGA package enables high I/O density and signal-integrity margins required for memory interfaces such as DDR4 and QDR-IV. Typical applications include 10G Ethernet line cards, wireless baseband processing (4G/LTE small cells), high-speed serial bridging, and test & measurement equipment with parallel DSP pipelines. The E2 industrial temperature grade extends usability to harsh-environment deployments in factory automation and outdoor telecom gear. When designing with this device, allocate sufficient PCB layers for transceiver channels and route impedance-controlled differential pairs to within manufacturer reference design tolerances. Programming requires the Intel Quartus Prime design suite, which provides synthesis, place-and-route, and timing analysis tailored to the Arria 10 family.
10AX115U2F45I1SG - Arria 10 GX 1.15M LE FPGA | Intel
The Intel 10AX115U2F45I1SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) with 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 480 user I/O, housed in a 1932-ball FCBGA package measuring 45x45 mm. It is built on Intel's 20 nm Tri-Gate process and operates from a 0.87 V to 0.98 V core supply with an industrial -40C to +100C junction temperature grade. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that sits in the hierarchy between simple PLDs and fixed-function ASICs. It contains an array of configurable logic blocks (CLBs), programmable interconnect, block RAM, DSP slices, and high-speed transceivers, all of which the designer configures via HDL (Verilog or VHDL) and a vendor toolchain. FPGAs are used when time-to-market, hardware reconfigurability, or parallel processing throughput outweigh the unit-cost benefits of an ASIC. Key features of the Arria 10 GX family include up to 96 full-duplex transceivers supporting data rates up to 17.4 Gbps (chip-to-chip and backplane), hardened floating-point DSP blocks, hard PCIe Gen3 and Gen2 IP cores, hard memory controllers for DDR4 and DDR3, and up to 1.5 GHz ARM Cortex-A9 hard processor system options in the SoC variant. The 10AX115U2F45I1SG specifically targets mid- to high-density designs where high serial bandwidth and parallel DSP throughput are required simultaneously. From an architectural standpoint, the device integrates 96 transceiver channels, 1,518 DSP blocks, 3,026 M20K memory blocks, and 24 fractional PLLs in this die variant. Power management is enhanced via the SmartVID interface, allowing the FPGA to negotiate its Vcore with an external DC-DC controller for static and dynamic power savings. Typical applications include 100G/400G optical transport line cards, wireless baseband processing, military radar and electronic warfare, broadcast video processing, ASIC prototyping, and high-performance computing accelerators. The combination of hard transceivers plus floating-point DSP makes the part particularly attractive for data-plane workloads. When designing with this device, pay close attention to PCB BGA fan-out and signal-integrity for the 17.4 Gbps transceivers. The 45x45 mm FCBGA package requires a high-layer-count PCB (typically 16+ layers) with controlled-impedance routing and via-in-pad technology for the breakout region. This page synthesizes pricing, drop-in same-brand alternatives, and PCB-aware design notes beyond what the manufacturer datasheet alone provides.
10AX115U2F45I2LG - Arria 10 GX FPGA 1.15M LE | Intel | 1932-FCBGA
The Intel / Altera 10AX115U2F45I2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) with 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 480 user I/O, fabricated on a 20nm process and housed in a 1932-ball FCBGA package at industrial temperature grade. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O can be configured after manufacture to implement arbitrary digital circuits ranging from glue logic to complete system-on-chip subsystems. The Arria 10 GX family is part of Intel's mid-range, transceiver-rich FPGA portfolio, offering hard PCI Express Gen3 and Gen2 hard IP blocks, 10-Gbps and 12.5-Gbps transceivers, hardened floating-point DSP blocks, and an ARM Cortex-A9 hard processor subsystem option, placing the Arria 10 GX hierarchically between low-cost Cyclone/MAX families and high-end Stratix families within Intel's programmable logic portfolio. Key specifications include 1,150,000 logic elements, 68,857,856 bits of embedded SRAM distributed across M20K blocks and MLABs, 1,518 DSP blocks for fixed- and floating-point arithmetic, 24 transceivers supporting up to 12.5 Gbps data rates, 4 PCIe hard IP blocks up to Gen3 x8, 8 fractional PLLs, and 480 general-purpose user I/O pins distributed across 12 I/O banks. The 1932-ball FCBGA package uses Intel's flip-chip BGA technology with a 45mm body size and a 1.0mm ball pitch, providing high-density interconnect for high-pin-count designs. Architecturally, the Arria 10 GX uses Intel's Adaptive Logic Module (ALM) as its basic logic unit, an 8-input fracturable LUT that supports efficient implementation of wide combinational and arithmetic functions. The 20nm process enables higher integration and lower power than the previous 28nm Arria V family, while the hard IP blocks for PCIe, memory controllers, and DSP deliver deterministic latency without consuming soft logic resources. Typical applications include high-throughput digital signal processing (radar, beamforming, medical imaging), high-speed serial protocol bridging (PCIe Gen3, 10G Ethernet, CPRI, JESD204B/C), video broadcast and pro-AV processing, ASIC prototyping, and embedded vision. The combination of integrated transceivers, hardened PCIe, and abundant DSP makes the Arria 10 GX particularly well-suited to latency-sensitive systems where determinism matters more than absolute peak throughput. When designing with this device, engineers must plan for the substantial power and thermal envelope of a 1.15M-LE FPGA with 24 active transceivers. A multi-layer PCB with continuous ground and power planes, dedicated transceiver reference clock distribution, and a robust thermal solution (heatsink plus airflow) is mandatory. Designers should also use Intel Quartus Prime software for synthesis, place-and-route, and timing closure; signal integrity of the 12.5-Gbps links requires controlled-impedance PCB stackup and length-matched routing. This page synthesizes distributor inventory, real-time pricing, same-family drop-in alternatives from the Arria 10 GX lineup, and practical design considerations not consolidated on a single distributor or manufacturer page.
10AX115U2F45I2SG - Arria 10 GX FPGA, 1.15M LEs, 17.4G Transceivers | Altera
The Altera 10AX115U2F45I2SG is a member of the Arria 10 GX family of 20 nm field-programmable gate arrays (FPGAs) housed in a 1932-ball FC-FBGA package measuring 45 x 45 mm. The device integrates approximately 1,150,000 logic elements, 68,857,856 bits of embedded RAM, 480 user I/O pins, and a transceiver fabric supporting chip-to-chip rates up to 17.4 Gbps and backplane rates up to 12.5 Gbps. Core supply operates across 0.87 V to 0.98 V with the industrial -40C to +100C (TJ) temperature grade, making it suitable for harsh-environment embedded computing. An FPGA is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing via a configuration bitstream, allowing the same silicon to implement any digital circuit, signal-processing pipeline, or parallel datapath. FPGAs sit between fixed-function ASICs and software-defined processors: faster and more parallel than microcontrollers, more flexible than ASICs, and the only practical option when time-to-market or low-volume customization matters. The Arria 10 GX family targets mid-range high-bandwidth applications including 4K video processing, radar signal processing, wireless baseband, and high-speed serial protocol bridging. The 10AX115U2F45I2SG is differentiated by a fine-grained 20 nm process, hard PCI Express Gen3 and Gen2 IP blocks, hard memory controllers for DDR4/DDR3/QDRII+/RLDRAM3, and a hardened floating-point DSP block architecture. This combination delivers high logic density with deterministic timing closure, eliminating the soft-IP overhead that slows traditional FPGA implementations. The 12.5 Gbps backplane capability and 17.4 Gbps chip-to-chip serial links allow line-card designs that previously required custom ASICs. Typical high-value applications include 100G/400G optical transport line cards, 4K UHD broadcast video processing, military radar and electronic-warfare signal chains, medical imaging reconstruction pipelines, and 5G wireless fronthaul/backhaul aggregation. Designers also deploy the part in ASIC prototyping, software-defined radio (SDR) platforms, and high-frequency trading acceleration where deterministic latency is mandatory. When designing with the 10AX115U2F45I2SG, attention to PCB layout is critical: the 1932-ball FC-FBGA requires microvia stack-up, length-matched transceiver pairs, and a high-density power-delivery network with at least 12 decoupling values. Transceiver reference clocks demand ultra-low-jitter sources to meet the 17.4 Gbps eye mask, and thermal management should target at least 1500 LFM airflow with a heatsink, since the industrial -40C to +100C junction window is easily reached under sustained load.
10AX115U3F45E2LG - Arria 10 GX FPGA 1150K LE | Intel | 1932-FCBGA
The Intel / Altera 10AX115U3F45E2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) featuring 1,150,000 logic elements, 68,857,856 embedded memory bits, and 480 user I/Os, fabricated on TSMC's 20 nm process. The device is housed in a 1932-ball FCBGA package and operates across the industrial temperature range. The U3 speed grade balances timing closure margin against Fmax, while the F45 designation indicates the 45 mm × 45 mm package outline. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs differ from Application-Specific Integrated Circuits (ASICs) in that their function is defined after manufacturing, via a hardware description language (HDL) bitstream loaded into on-chip SRAM configuration memory. Modern high-end FPGAs like the Arria 10 family integrate hard IP blocks for transceivers, DSP, memory controllers, and processor cores, blurring the line between FPGA and SoC. The Arria 10 GX family targets mid-range, transceiver-rich applications. The 10AX115U3F45E2LG delivers up to 28.05 Gbps backplane-capable transceivers, a hardened ARM Cortex-A9 dual-core processor subsystem option (on SoC variants), and variable-precision DSP blocks capable of 1.5 TFLOPs of single-precision floating-point performance. The 20 nm process enables higher logic density at lower static power than the prior 28 nm Cyclone V / Stratix V generations. Typical applications for the 10AX115U3F45E2LG include 100G/400G optical line cards, high-performance test and measurement instrumentation, military radar signal processing, broadcast video processing engines, and PCIe Gen3 x8/x16 host acceleration cards. The combination of dense logic, abundant embedded SRAM, and high-speed serial I/O makes it well suited for data-plane acceleration where latency and throughput dominate design decisions. Designers should plan power delivery around the 20A peak core current and use the Quartus Prime PowerPlay early power estimator before PCB layout. The 1932-FCBGA requires multilayer PCB stack-up with buried vias, microvia stack-ups, or hybrid PCB construction; standard 4-layer boards are not feasible for this pin-count. This page synthesizes distributor pricing, Arria 10 family cross-references, and practical design notes not found in the manufacturer datasheet alone.
10AX115U3F45E2SG - Arria 10 GX FPGA 1.15M LE FCBGA-1932 | Intel
The Intel 10AX115U3F45E2SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) integrating 1,150,000 logic elements (LE) and 68,857,856 bits of embedded memory in a 1932-ball FineLine BGA (FCBGA) package. The device is part of the 20 nm Arria 10 GX family, the industry’s highest-bandwidth mid-range FPGA family, combining 28.05 Gbps transceivers with a hardened floating-point Digital Signal Processing (DSP) fabric. The U3 device-grade suffix designates an industrial/transceiver-optimized variant operating in the –2 speed grade. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and hardened IP blocks such as transceivers, DSP slices, and memory controllers. Within the programmable logic hierarchy, FPGAs sit between general-purpose CPUs (software-defined, sequential) and ASICs (fixed-function, lowest unit cost), offering hardware-level parallelism with the ability to be reconfigured after deployment. The Arria 10 family specifically targets mid-range applications that require both high transceiver bandwidth and substantial logic/memory capacity, bridging the gap between low-cost Cyclone devices and high-end Stratix parts. Key differentiating features of the 10AX115U3F45E2SG include up to 96 transceivers supporting data rates from 1.25 Gbps up to 17.4 Gbps backplane-capable rates, hardened Gen3 PCIe x8 IP blocks, two hard memory controllers supporting DDR4/DDR3/QDRII+/RLDRAM3, and a variable-precision DSP block architecture capable of delivering up to 1.5 TFLOPs of single-precision floating-point performance. The F45 package option provides a 45 mm × 45 mm body with 1932 balls on a 1.0 mm pitch. Typical application areas include 4K/8K video broadcast infrastructure, professional audio and video processing, 100G/400G line-card prototyping, military radar and electronic-warfare systems, medical imaging backplanes, and high-performance test-and-measurement equipment. The wide operating-temperature and dual-power-rail design also suits outdoor industrial installations. This page synthesizes distributor pricing, drop-in Arria 10 family alternatives, and practical design notes (PCB layout, power-rail sequencing, transceiver channel placement) that are not found in the raw datasheet. Information is curated for both procurement and hardware engineers evaluating high-end mid-range FPGAs.
10AX115U3F45I2LG - Arria 10 GX FPGA, 1.15M LE | Intel | 1932-BGA
The Intel (Altera) 10AX115U3F45I2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 480 DSP blocks in a 1932-ball flip-chip BGA (FCBGA) package rated for the industrial temperature range (-40C to +100C). Built on TSMC's 20nm process, this Arria 10 GX device delivers mid-range programmable logic fabric with up to 96 transceiver lanes operating up to 12.5 Gbps and a hardened floating-point DSP block architecture optimized for high-performance signal processing. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP resources. Unlike an ASIC, an FPGA's function is defined by user-loaded configuration data, enabling rapid hardware iteration, post-deployment upgrades, and hardware-level parallelism. Within the programmable logic hierarchy, FPGAs sit above CPLDs (which are smaller and non-volatile) and below structured ASICs in unit cost; Arria 10 GX specifically targets mid-range transceiver-heavy designs bridging Cyclone and Stratix families. Key differentiating features of the 10AX115U3F45I2LG include 1,150,000 logic elements (LEs), 427,200 adaptive logic modules (ALMs), 52.99 Mbit embedded memory, 480 DSP blocks, and 24 transceivers at the U3 speed grade (12.5 Gbps). The part ships in a 45mm FCBGA-1932 (F45) package suitable for high-pin-count designs requiring maximum I/O density, and is qualified to the industrial operating range. Arria 10 GX architecture combines a hard memory controller, PCIe hard IP blocks, and 10/12.5 Gbps transceivers on the same die, allowing deterministic latency and lower power than soft implementations. Compared with previous 28nm Arria V, Arria 10 GX achieves roughly 2x DSP throughput per watt, making it suitable for compute-intensive applications like 4K video processing and wireless baseband. Typical applications include 4K/8K video broadcast equipment, 100G/400G Ethernet line cards, wireless LTE/5G fronthaul, radar and electronic warfare signal processing, medical imaging accelerators, and high-performance compute offload cards. The U3 speed grade supports up to 12.5 Gbps backplane and chip-to-chip links. When designing with this device, plan for high-density PCB with 1.0mm BGA pitch, multi-layer PCB stack-up (12+ layers typical), and strict power integrity for the 0.95V core rail. Quartus Prime software provides synthesis, place-and-route, and timing analysis. This page synthesizes distributor pricing, drop-in Arria 10 alternatives, and practical board-design notes not found in the manufacturer datasheet.
10AX115U3F45I2SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
The Intel (formerly Altera) 10AX115U3F45I2SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) housed in a 1932-ball FCBGA (F45) package. Built on TSMC's 20 nm process, this device integrates 1,150,000 logic elements, 68,857,856 bits of embedded memory, 480 user I/Os, and up to 24 transceivers delivering up to 14.4 Gbps per channel for high-speed serial connectivity. It targets mid- to high-end applications requiring balanced logic density, memory bandwidth, and transceiver throughput. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that can be rewired after manufacturing to implement arbitrary digital functions. In the broader system hierarchy, an FPGA sits between general-purpose microcontrollers and fixed-function ASICs: unlike a microcontroller, an FPGA achieves true hardware parallelism and deterministic latency; unlike an ASIC, it is reprogrammable in the field. The Arria 10 family specifically targets transceiver-rich applications such as 4K video processing, wireless baseband, and 100G/400G datapath bridging. Key features of the 10AX115U3F45I2SG include 1,150,000 logic elements, 67.5 Mbits embedded M20K memory, 1,518 18x19 multipliers, and 24 high-speed transceivers up to 14.4 Gbps. The 14.4 Gbps transceiver rate makes the device a natural fit for PCIe Gen3 x8, 10GbE, CPRI, and 6G/12G SDI aggregation. Hardened floating-point DSP blocks accelerate FFT, FIR, and matrix-multiply kernels in radar and beamforming DSP pipelines. Architecturally, the device is built on TSMC's 20 nm process with a 14.4 Gbps hardened SerDes block, partial reconfiguration support, and a secure configuration scheme with AES-256 bitstream encryption. The transceiver PMA layer supports multiple protocols via soft PCS logic. The hard memory controller supports DDR4 up to 2666 Mbps in addition to DDR3 and QDRII+ SRAM interfaces. Power consumption is governed by an embedded Smart Voltage ID block that adapts core voltage to process and temperature corners. Typical applications for the 10AX115U3F45I2SG include 4K/8K broadcast video processing, wireless baseband digital up/down conversion, 100G Ethernet datapath bridging, military radar preprocessing, medical imaging front-ends, and high-performance computing (HPC) protocol offload cards. The industrial speed grade (-I2) targets -40C to +100C junction operation. A key design consideration is thermal management: at full transceiver and DSP utilization the FCBGA package can dissipate 25-35 W, requiring a heatsink and 8-layer or thicker PCB with microvia thermal vias under the lid. Power-on sequencing must follow Intel's Arria 10 Power Management User Guide to avoid latch-up of the 0.9 V core rail. This page synthesizes distributor pricing, same-family drop-in alternatives drawn from the Intel Site MPN list, and practical design notes that complement (rather than replace) the official Intel Arria 10 Device Datasheet and Device Overview.
10AX115U4F45E3LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
The Intel 10AX115U4F45E3LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) with 1,150,000 logic elements, 68,857,856 embedded memory bits, and 480 user I/Os, housed in a 1932-ball FCBGA package. Built on TSMC's 20 nm process, it integrates up to 96 full-duplex transceiver channels supporting data rates up to 17.4 Gbps, making it a leading mid-range FPGA for high-speed serial interfacing. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows hardware designers to configure digital logic, memory blocks, DSP slices, and high-speed transceivers after PCB fabrication. FPGAs sit within the programmable logic hierarchy under the broader category of digital semiconductors, and are widely used to implement custom datapath, protocol bridging, signal processing, and ASIC prototyping workloads. The Arria 10 GX family specifically targets applications requiring a balance of high logic density, embedded transceivers, and power efficiency. Key features include 1,150,000 logic elements (LEs), 68,857,856 bits of embedded memory, 1,518 variable-precision DSP blocks, and 96 transceiver channels supporting backplane, chip-to-chip, and optical-module interfacing. Hard memory controllers, PCIe Gen3 x8 IP cores, and an ARM-based Hard Processor System option further accelerate system integration for compute-intensive workloads. The architecture combines a programmable fabric with hard IP for PCI Express, memory controllers, and multi-gigabit transceivers, allowing designers to offload computationally heavy DSP and packet-processing tasks from general-purpose CPUs. The 20 nm process node delivers a meaningful power and performance advantage over the prior 28 nm Arria V generation while preserving Quartus Prime design-flow continuity. Typical applications include high-performance wireline and wireless infrastructure, broadcast video processing, radar and electronic-warfare signal processing, medical imaging, and ASIC prototyping. The combination of high-density logic, abundant transceivers, and hard PCIe cores suits line cards, baseband units, and test equipment. When designing with this part, carefully budget transceiver reference-clock quality, PCB stack-up loss budgets, and thermal management for the 1932-ball FCBGA. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure, and validate signal integrity with IBIS-AMI models for every high-speed link. This page synthesizes distributor stock, parametric alternatives, and practical design considerations not found in the manufacturer datasheet, giving engineers a single decision-ready view of the 10AX115U4F45E3LG.
10AX115U4F45E3SG - Arria 10 GX 1150K LE FPGA | Intel | 1932-FCBGA
The Intel 10AX115U4F45E3SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) with 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 480 user I/O, housed in a 1932-ball flip-chip BGA (FCBGA) package. It belongs to the 20nm Arria 10 GX family, which integrates up to 1.5 GHz ARM Cortex-A9 hard processor subsystem variants in some SKUs and delivers up to 96 transceiver channels at 17.4 Gbps, optimized for high-throughput mid-range FPGA designs in communications, broadcast, and defense segments. An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (LBs/ALMs), programmable interconnect, dedicated DSP blocks, block RAM (BRAM/M20K), high-speed transceivers, and clock management PLLs. FPGAs sit at the apex of digital IC complexity: above microcontrollers in raw parallel compute and below ASICs in per-unit cost at high volumes. They are widely used for hardware-accelerated signal processing, packet processing, video pipelines, and prototyping of ASICs. Key features of the 10AX115U4F45E3SG include 1,150K logic elements, 68.86 Mbits embedded memory (BRAM/M20K), 3,026 DSP blocks (estimated from family), 24 transceiver channels at up to 17.4 Gbps, 480 GPIO across the F45 (45mm flip-chip BGA) package, 1.0 V core (VCC) with 0.9 V internal linear regulation per the datasheet, and an enhanced 20nm process node. The 1932-ball FCBGA package supports high pin count and is suitable for high-bandwidth designs requiring many serial links and parallel I/O. From an architectural perspective, the device integrates hardened PCI Express Gen3 controllers, hard memory controllers (DDR4/DDR3 with ECC), and configurable fractional PLLs. This architectural blending reduces soft-logic utilization and lowers power per operation. Per the manufacturer datasheet, the operating temperature range of the E3 speed grade at 0.85V VCC is 0C to 100C (junction), and the device is built on TSMC's 20nm process. Typical applications include 100G/400G optical transport platforms, LTE/5G baseband processing, military radar and electronic warfare, medical imaging, and high-end video broadcast equipment. The mid-range Arria 10 GX is preferred over Cyclone V for transceiver-heavy designs and over Stratix 10 when cost-per-channel matters more than absolute density. When designing with the 10AX115U4F45E3SG, ensure multi-layer PCB stack-up (at least 12 layers for signal integrity on 17.4 Gbps links) and use Intel Quartus Prime Pro for synthesis, place-and-route, and timing closure. The 1932-BGA requires X-ray inspection or careful reflow profiling due to 1mm pitch. This page synthesizes distributor pricing, drop-in alternatives from the Arria 10 family, and practical design notes not found in the manufacturer datasheet.
10AX115U4F45I3LG - Arria 10 GX FPGA 1150K LE 1932-FCBGA | Intel
The Intel 10AX115U4F45I3LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) integrating 1,150,000 logic elements and 68,857,856 bits of embedded memory in a 1932-ball FCBGA package. The device is built on TSMC's 20 nm process, targets industrial temperature operation (-40C to +100C), and supports up to 96 transceivers at 14.4 Gbps for high-bandwidth serial I/O in communication, video broadcast, and high-performance computing systems. A Field-Programmable Gate Array is a semiconductor device whose digital logic fabric, interconnect, and I/O cells can be reconfigured after manufacture by loading a user-defined bitstream. FPGAs sit at the top of the programmable-logic hierarchy: simple programmable logic devices (SPLDs) and complex PLDs (CPLDs) sit below FPGAs in density, while ASICs and ASSPs sit above them as fixed-function alternatives. The Arria 10 GX family specifically targets mid-range applications that demand integrated high-speed transceivers and floating-point DSP blocks but at lower cost and power than the Stratix 10 flagship family. Key features of the 10AX115U4F45I3LG include 1,150,000 logic elements, 68,857,856 embedded memory bits, 3,036 embedded 18x18 multipliers, 1,518 variable-precision DSP blocks, 24 phase-locked loops, and 480 maximum user I/O pins. Core voltage is 0.9 V with separate transceiver and auxiliary supplies. The transceiver subsystem supports data rates up to 14.4 Gbps using a hardened PCIe Gen3 x8 and 100G Ethernet IP stack, while the hard floating-point DSP blocks deliver up to 1.5 TFLOPs of single-precision performance. The device architecture is built around a column-based HyperFlex-like routing fabric, adaptive logic modules (ALMs), and dedicated hard IP for PCIe Gen3, 10/25/40/100 Gigabit Ethernet, Interlaken, and CPRI. The hardened IP blocks offload common interface functions, freeing programmable logic for application-specific processing and dramatically reducing power relative to soft implementations. The part is supplied in a 45 mm x 45 mm 1932-ball FCBGA with 1.0 mm ball pitch, requiring high-density PCB design with HDI stackups and microvia technology. Typical applications include high-end wireless baseband processing, 4K/8K video broadcast infrastructure, radar and electronic-warfare signal processing, medical imaging accelerators, network packet processing, and high-performance compute (HPC) prototyping. The 14.4 Gbps transceivers make the device especially well-suited for 100G Ethernet line cards and CPRI-observed-radio front-haul aggregation. When designing with this device, plan the PCB stackup for the 1.0 mm BGA pitch early - at least an 8-layer HDI board with stacked microvias is recommended for power, ground, and signal escape routing. Power-rail sequencing must follow the Intel Arria 10 Power Management User Guide to avoid latch-up; use a dedicated PowerSoC or controller rather than discrete LDOs. Thermal design must handle up to approximately 40 W of typical board power, so a heatsink with 1 to 2 m/s airflow is generally required for industrial-temperature operation in sealed enclosures. This page synthesizes distributor pricing, same-package pin-compatible alternatives, comparison tables, and PCB-thermal design notes that go well beyond the manufacturer ordering/datasheet summary.
10AX115U4F45I3SG - Arria 10 GX 1.15M LE FPGA | Intel / Altera
The Intel (formerly Altera) 10AX115U4F45I3SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) built on TSMC's 20 nm process, delivering 1,150,000 logic elements (LEs) and 68,857,560 bits of embedded memory in a 1932-ball FC-FBGA package. The device supports up to 480 user I/O pins and integrates hardened protocol controllers for DDR4, PCIe Gen3, and 10G Ethernet, while offering up to 24 transceivers at data rates up to 17.4 Gbps. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines dense configurable logic blocks, programmable interconnect, and dedicated silicon IP into a single semiconductor IC. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic ICs -> integrated circuits (ICs) -> semiconductors, occupying the high-performance tier above CPLDs and below ASICs in cost vs flexibility tradeoff. Key differentiating features include 17.4 Gbps transceiver support, partial reconfiguration for live system updates, dedicated DSP blocks (up to 1,518 18x19 multipliers), and hardened floating-point units (FPUs) for IEEE 754 single-precision throughput. The -I3 speed/temperature grade denotes industrial temperature range (-40C to +100C) at the slowest speed grade, optimized for designs prioritizing thermal robustness over peak clock frequency. Architecturally, the Arria 10 GX family uses an Adaptive Logic Module (ALM) structure with 8-input fracturable look-up tables (LUTs), a multi-track routing interconnect, and tightly integrated hard IP such as PCIe Gen3 x8 EP/RP, 10/40/100G Ethernet MACs, and DDR4 controllers reaching 2,400 MT/s. The 20 nm process enables ~1.4x the logic density and ~2x the transceiver performance of the prior 28 nm Arria V family at comparable power per operation. Typical applications include 4K/8K video broadcast infrastructure, 10G/40G Ethernet aggregation switches, PCIe Gen3 accelerator cards, software-defined radio (SDR) baseband processing, and medical imaging pipelines. The hardened transceivers and floating-point DSP make it particularly well suited for low-latency DSP and protocol bridging workloads. Design considerations: the 1932-ball FC-FBGA package requires at least 12 PCB layers, microvia (HDI) construction, and ENIG or ENEPIG surface finish to ensure reliable solder joint reliability (SJR). Power estimation tools such as Intel's PowerPlay Early Power Estimator (EPE) should be used pre-layout to size rails and decoupling, as quiescent plus dynamic power can exceed 25 W under heavy transceiver utilization. This page synthesizes distributor pricing, drop-in same-package alternatives, comparison parameters, and design notes drawn from the manufacturer datasheet family - offering engineering value beyond the standalone datasheet.
10CL006YE144A7G - Cyclone 10 LP FPGA, 6K LEs, 144-LQFP | Intel
The Intel 10CL006YE144A7G is a low-power member of the Cyclone 10 LP Field-Programmable Gate Array (FPGA) family, integrating 6,272 logic elements and 276,480 bits of embedded memory in a 144-pin LQFP exposed-pad package (E144). It belongs to the 10CL006 density point, which is the smallest in the Cyclone 10 LP family, and is specified for industrial-grade temperature ranges with a -40C to +85C operating envelope. A Cyclone 10 LP FPGA is a SRAM-based programmable logic device that combines look-up tables (LUTs), embedded memory blocks, embedded multipliers (DSP blocks), and a programmable interconnect fabric in a single low-power silicon platform. Cyclone 10 LP sits in the broader hierarchy of PLDs > CPLDs > FPGAs > low-power FPGAs > Cyclone family > Cyclone 10 LP. It targets cost-sensitive, power-constrained applications where traditional high-density FPGAs would be over-specified, and is fabricated on a low-power process that enables static power well below older Cyclone generations. Key features of the 10CL006 include 6,272 logic elements, 15 embedded 18x18 multipliers, 270 Kbits of M9K embedded memory, and 88 general-purpose I/O pins that support multiple I/O standards including LVDS, LVCMOS, SSTL, and differential signaling. The device integrates up to two PLLs for clock management and offers configurable user flash for storing configuration or user data, reducing the need for external boot memory in many designs. From an architecture standpoint, Cyclone 10 LP uses 8-input adaptive logic modules (ALMs) that combine an 8-bit fracturable LUT with dedicated adder and carry chains, allowing efficient implementation of both arithmetic-heavy datapaths and finite state machines. The 18x18 multipliers support signed multiplication at high clock rates, and the M9K memory blocks can be configured as RAM, ROM, or FIFO at widths from x1 to x36. Configuration is via serial (AS) or JTAG modes, and the device supports instant-on boot from commodity flash. Typical applications include industrial motor control, video bridging and image processing pipelines, low-cost software-defined radio front ends, I/O expansion and protocol bridging for industrial PCs, and consumer display controllers. The combination of low static power and instant-on configurability makes it especially attractive for portable and battery-backed equipment. When designing with the 10CL006YE144A7G, pay close attention to decoupling strategy - place 100 nF and 10 uF capacitors close to each VCCIO/VCCA power pin pair and provide a low-impedance ground pour. Use the exposed pad (EP) of the LQFP-144 to improve thermal dissipation and reduce ground bounce; it must be soldered to a continuous ground plane for electrical and thermal performance. This page synthesizes distributor stock, same-family ordering part numbers, and practical board-level design notes not found in the manufacturer datasheet alone.
10CL006YE144C6G - Cyclone 10 LP 6K LEs FPGA | Intel | 144-EQFP
The Intel 10CL006YE144C6G is a low-power, low-cost Cyclone 10 LP FPGA featuring 6,272 logic elements, 276,480 bits of embedded memory, and 88 general-purpose user I/Os in a 144-pin EQFP (LQFP with exposed pad) package. Built on TSMC's low-power 60 nm process, this device targets cost-sensitive applications where power efficiency, small form factor, and abundant DSP/logic resources are critical. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and I/O cells that engineers can reconfigure post-manufacturing to implement custom digital circuits. Within the broader taxonomy, FPGAs sit alongside ASICs (Application-Specific Integrated Circuits), microcontrollers, and DSPs as reconfigurable compute platforms; the Cyclone 10 LP family specifically targets low-power, high-volume applications that previously required ASIC or CPLD implementations. Key features include 15 embedded 18x18 multipliers supporting up to 66 GMACS DSP throughput, 2 PLLs per device for flexible clock management, and support for external memory interfaces including DDR2/DDR3/LPDDR2 via soft IP cores. The device operates from a 1.0V core supply with separate 1.5V/1.8V/2.5V/3.3V I/O bank voltages, enabling mixed-voltage system integration without external level shifters. The Cyclone 10 LP architecture combines look-up-table (LUT) based logic blocks with embedded M9K memory blocks, hard IP for DSP operations, and a fine-grained clock network. This FPGA supports the Quartus Prime Lite/Standard toolchain and is suitable for parallel processing, custom peripheral interfacing, and glue-logic consolidation. Typical applications include industrial motor control and HMI panels, low-power video processing for surveillance and consumer displays, IoT edge nodes with custom sensor aggregation, automotive body electronics and infotainment subsystems, and portable/wearable medical monitoring equipment. When designing with the 10CL006YE144C6G, ensure the exposed pad on the underside of the EQFP package is soldered to a sufficient ground copper pour for thermal dissipation and electrical ground reference. The device's 1.0V core requires a properly sequenced power supply, and unused I/O banks should be powered to valid reference voltages to avoid I/O buffer leakage. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet alone, helping engineers shorten evaluation cycles and reduce supply-chain risk.
10CL006YE144C8G - Cyclone 10 LP FPGA 6K LE EQFP-144 | Intel / Altera
The Intel / Altera 10CL006YE144C8G is a low-power Cyclone 10 LP Field Programmable Gate Array (FPGA) integrating 6,272 logic elements, 276,480 bits of embedded memory, and 88 user I/O pins in a 144-pin EQFP (EQFP-144) package with exposed pad. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hardened IP such as memory blocks, multipliers, and phase-locked loops. Within the broader taxonomy, an FPGA belongs to the programmable logic device family, itself a category of digital ICs used to implement arbitrary digital logic that can be reconfigured post-manufacture. The Cyclone 10 LP series targets low-static-power and cost-sensitive applications, positioning the 10CL006 at the entry-tier of the family. Key differentiating features of the 10CL006YE144C8G include 6,272 logic elements (LEs), 392 logic array blocks (LABs), 270 kbit of embedded memory, 15 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and a 1.2 V core operating voltage. The device supports configuration via serial flash, JTAG, and AS modes. Operating junction temperature spans 0C to +85C (commercial grade, suffix 'C8G'). Architecturally, Cyclone 10 LP FPGAs are built on a low-power process and feature Adaptive Logic Modules (ALMs), a fine-grained interconnect fabric with multi-track routing, and embedded memory blocks (M9K) that can be configured as RAM, ROM, or FIFO. Hardened memory controllers and the variable-precision DSP block simplify common signal-processing workloads without consuming fabric resources. Typical applications include industrial motor control, video bridging and display controllers, low-cost protocol bridging (I2C, SPI, UART to Ethernet), portable medical device glue logic, and IoT edge nodes. The wide protocol support and low static power also make the device suitable for battery-powered or thermally constrained designs. When designing with this device, ensure JTAG chain integrity and use the Intel Quartus Prime Lite/Standard toolchain for synthesis, place-in, and bitstream generation. Designers migrating from the Cyclone IV family will find the same Quartus flow but should verify pinout against the EQFP-144 land pattern, as the Cyclone 10 LP pinout is not identical to legacy Cyclone IV footprints. This page synthesizes distributor pricing, parametric alternatives, and practical design notes that complement the manufacturer datasheet for engineers evaluating the 10CL006YE144C8G.
10CL006YE144I7G - Cyclone 10 LP FPGA 6K LE | Intel | 144-LQFP
The Intel 10CL006YE144I7G is a low-power, low-cost Cyclone 10 LP Field Programmable Gate Array (FPGA) delivering 6,272 logic elements (LEs) and 276,480 bits of embedded memory in a 144-pin LQFP exposed-pad (EQFP-144) package. It integrates 88 user I/O pins, six analog PLLs, and a 392-equivalent logic-element cluster fabric with up to 56 embedded 18x18 multipliers. The Cyclone 10 LP family is fabricated on a low-power 60 nm process, optimized for static power under 60 mW typical while supporting transceiver-free industrial, consumer, and automotive-assist designs. What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined after manufacture through a configuration bitstream loaded into on-chip SRAM. FPGAs belong to the broader programmable-logic-device (PLD) family and sit in the hierarchy alongside ASICs and CPLDs, occupying the role of mid-volume, mid-density glue logic that bridges microcontrollers and full-custom silicon. Cyclone 10 LP specifically targets cost-sensitive, power-constrained applications where designers need the parallelism of an FPGA without paying the static-power tax of larger families. Key features include 6,272 logic elements, 276,480 RAM bits, 15 Kbits of M9K block RAM, and 56 DSP blocks (18x18 multipliers). Core voltage is 1.2 V (VCCINT) and I/O voltage spans 1.2 V to 3.3 V (VCCIO) through eight I/O banks. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes, with on-chip configuration bitstream compression and CRC for fast, safe field updates. Cyclone 10 LP devices ship with hardened IP for DDR3/LPDDR2 external memory interfaces, PCIe Gen2 x1 soft IP, and the Nios II embedded soft processor. The 10CL006 is the entry-level member of the family, designed for logic consolidation, I/O expansion, and bridge functions where higher-density Cyclone 10 GX or Arria-class FPGAs are over-specified. Typical applications include industrial motor control (with Nios II for encoder processing), video bridging and image-sensor aggregation, low-volume IoT edge nodes, I/O expansion for SoCs lacking GPIO, and portable medical instrumentation. The 144-LQFP exposed-pad package is hand-solder-friendly and compatible with lead-free reflow at 260 C peak per JEDEC J-STD-020. When designing with this device, place eight-layer VCCINT/VCC_PLL/VCCA decoupling within 2 mm of each supply pin and stitch the exposed pad with at least 25 thermal vias to the inner power plane. Confirm the Quartus Prime version supports Cyclone 10 LP device family symbol support and that your power-rail budget uses the Intel Early Power Estimator (EPE) before PCB layout. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, including populated pin assignments and Quartus configuration-mode guidance.
10CL006YU256A7G - Cyclone 10 LP FPGA, 6K LE, 256-UBGA | Intel
The Intel / Altera 10CL006YU256A7G is a low-power Cyclone 10 LP field-programmable gate array (FPGA) featuring 6,272 logic elements, 176 maximum user I/O pins, and 276,480 bits of embedded memory, housed in a 256-ball Ultra FineLine BGA (UBGA) package. Built on a low-power 60 nm process, the Cyclone 10 LP family targets cost-sensitive, power-constrained applications across industrial, consumer, and communications markets. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect fabric, and I/O elements that engineers can configure after manufacture to implement custom digital circuits, signal-processing pipelines, or complete processor subsystems. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are distinguished from ASICs by their reconfigurability and from microcontrollers by hardware-parallel execution. Key features of the 10CL006YU256A7G include 6,272 logic elements, 176 maximum user I/Os supporting multiple I/O standards (LVCMOS, LVDS, LVTTL), 270 Kbits of embedded SRAM distributed across 9-bit M9K blocks, 2 PLLs for clock management, and Cyclone 10 LP's industry-leading low static and dynamic power. The 256-pin UBGA package exposes the device's full I/O bank count while keeping board footprint compact. Cyclone 10 LP devices use a TSMC 60 nm low-power process with on-chip voltage regulation, achieving low dynamic power without sacrificing performance. The architecture includes embedded multipliers, configuration memory (CRAM), and JTAG-based programming via Quartus Prime. The 10CL006 is the smallest density point in the Cyclone 10 LP family, suiting designs that previously would have used small CPLDs or low-end FPGAs. Typical applications include industrial motor control, video bridging and processing, I/O expansion and protocol translation, low-cost prototyping, and portable/handheld embedded designs. The 176 I/O count and 6K LE capacity comfortably supports bridging between parallel buses (EMIF, SRAM) and high-speed serial interfaces, plus glue logic and state-machine rich designs. When designing with the 10CL006YU256A7G, ensure your power rail budget accounts for both quiescent and dynamic ICC, and follow Intel's recommended decoupling network on each I/O bank supply. Quartus Prime Lite edition (free) is sufficient for this device, lowering non-recurring engineering cost. This page synthesizes distributor pricing, drop-in Cyclone 10 LP density alternatives, and practical design notes not found in the manufacturer datasheet alone.
10CL006YU256C6G - Cyclone 10 LP FPGA | Intel
The Intel (Altera) 10CL006YU256C6G is a Cyclone 10 LP field-programmable gate array (FPGA) containing 6,272 logic elements, 176 user I/O pins, and 276,480 RAM bits, delivered in a 256-ball fine-pitch LFBGA package. The C6G ordering suffix places it in the commercial-tuned operating family for the 10CL006 density, providing a programmable-logic solution for designers who need custom digital logic without a fixed ASIC or microcontroller. An FPGA is an integrated circuit whose logic fabric, routing, and I/O behavior can be configured after manufacturing. In this Cyclone 10 LP device, the programmable fabric is built around logic elements, embedded RAM bits, and flexible I/O banks. FPGAs sit above microcontrollers in design flexibility but below structured ASICs in unit-volume cost, making this device an ideal hardware-acceleration and interface-glue layer in industrial, video, communication, and test systems. The 10CL006YU256C6G is a mid-density, low-cost programmable logic device suitable for designs that need real-time parallel processing without a custom chip. The Cyclone 10 LP family is optimized for low static power and broad I/O compatibility. The 6,272 logic elements are sufficient for control logic, state machines, protocol bridging, and image-timing tasks. The 176 user I/Os provide generous parallel connectivity for DDR-style memories, LCD buses, motor-drive interfaces, and multi-port sensors. The 276,480 RAM bits can be configured as FIFOs, line buffers, small packet buffers, or lookup tables. The 256-LFBGA package balances board-area requirements with usable I/O count. Because this is a reliable low-cost FPGA family, bitstreams can be developed in Intel Quartus Prime software and loaded through JTAG or active serial configuration. Designers use Verilog or VHDL to synthesize logic into the 6,272-logic-element fabric, then verify timing with Intel’s timing models. The programmable nature enables in-field updates and reduces inventory risk compared with fixed-logic devices. The LFBGA package supports compact assembly, though thermal and power delivery require attention during PCB layout. Typical applications include industrial motor-control logic, machine-vision glue logic, communication bridging, test instrumentation, and IoT front-end preprocessing. The 176 user I/Os make this device especially useful when several parallel peripherals must be connected to one controller. The RAM bits support small packet queues and video line delays, while the logic fabric implements custom bus arbitration and protocol state machines. When using this FPGA, supply the appropriate core and I/O voltages to the correct pins, follow Intel’s pin connection guidelines, and add junction decoupling near the supply balls. Do not leave dedicated configuration pins floating, and verify power-supply sequencing if multiple voltage rails are used. The C6 speed/temperature suffix must match your timing closure and environmental requirements. This page assembles distributor links, pricing evidence, drop-in alternatives, and practical design notes for the 10CL006YU256C6G, information that complements the Intel/Altera datasheet and official product page.
10CL006YU256C8G - Cyclone 10 LP FPGA 6K LE, 256-UBGA | Intel
The Intel 10CL006YU256C8G is a low-power, low-cost Cyclone 10 LP field-programmable gate array (FPGA) from the Intel Programmable Solutions Group (formerly Altera). It integrates 6,272 logic elements, 276,480 bits of embedded memory, and 176 general-purpose user I/O in a 17 mm x 17 mm 256-ball Ultra FineLine BGA (UBGA) package. The device is built on a low-power 60 nm process and targets cost-sensitive, high-volume applications requiring moderate logic density. A Cyclone 10 LP FPGA is a reprogrammable digital logic device from Intel's Cyclone family, positioned within the broader hierarchy of programmable logic devices (PLD) -> FPGA -> low-power FPGA -> power-optimized FPGA. The Cyclone 10 LP family is the static-power-optimized successor to the Cyclone IV and Cyclone V families, designed for applications where low quiescent power and low total cost of ownership outweigh the need for high-speed transceivers or large amounts of on-chip memory. Key features of the 10CL006YU256C8G include 6,272 logic elements (LEs), 276,480 bits (approximately 27 Kbits) of embedded SRAM, 15 embedded 18 x 18 multipliers, two general-purpose PLLs, and a hard Nios II processor support path via the Quartus Prime design software. The 176 user I/O are organized into eight I/O banks that support single-ended standards (LVCMOS, LVTTL) and differential standards (LVDS, SSTL, HSTL) up to 3.3 V. Each I/O pin has an optional weak pull-up, optional bus-hold, and a programmable slew rate, enabling direct interfacing with common parallel buses, SDRAM, and popular sensor or display interfaces. The architectural emphasis of the Cyclone 10 LP family is reduced static power. Internal logic is implemented in 60 nm CMOS with carefully optimized clock networks and signal gating; this yields a substantially lower quiescent current than the Cyclone IV GX family at equivalent logic densities. The device supports configuration via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, and configuration bitstreams can be stored in low-cost EPCS or EPCQ serial flash devices. Typical applications include industrial motor control and human-machine interface (HMI) boards, video bridging and image-sensor aggregation in low-cost surveillance equipment, low-density protocol-bridging logic in telecom line cards, and any embedded board that requires programmable glue logic between a microprocessor and peripherals. The 256-ball UBGA package supports reflow-compatible SMT assembly and is pin-compatible with other 10CL006 U256 variants, allowing designers to drop in a higher-speed-grade part without board rework. When designing with this device, use Intel Quartus Prime Lite Edition for synthesis, place-and-route, and bitstream generation. Pay careful attention to the device's I/O bank VCCIO supply requirements and ensure all banks powered at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V meet the bank's reference voltage; mismatched bank voltages are a leading source of configuration failures and I/O damage in 256-UBGA Cyclone 10 LP designs. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet alone.
10CL006YU256I7G - Cyclone 10 LP FPGA, 6K LE, UFBGA-256 | Intel
The Intel 10CL006YU256I7G is a low-power member of the Cyclone 10 LP FPGA family, featuring 6,272 logic elements (LEs) in a 256-ball Ultra-Fine-Pitch Ball Grid Array (UBGA-256) package with 176 maximum user I/Os. According to verified distributor data, this device integrates 276,480 bits of embedded memory, 392 Configurable Logic Blocks (CLBs), and 6 fractional PLLs for clock management, targeting cost-sensitive, low-static-power applications. A Cyclone 10 LP FPGA is a reprogrammable integrated circuit based on an SRAM configuration cell architecture, sitting in the broader hierarchy of programmable logic device (PLD) -> field-programmable gate array (FPGA) -> low-power FPGA -> Intel Cyclone 10 LP family. Unlike microcontrollers, FPGAs implement logic through parallel look-up-table (LUT) resources that can be reconfigured in-circuit, making them ideal for custom interface bridging, glue logic, motor control, and video processing designs. Key features of the 10CL006YU256I7G include support for multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL) on the same I/O bank, an integrated 7th-generation transceiver-free architecture, hard memory controllers, and core static power roughly 50% lower than the previous Cyclone IV generation. The device supports commercial and industrial operating temperature grades and uses a 1.0V core supply with on-chip voltage regulation. From an architectural standpoint, the Cyclone 10 LP employs a logic-element fabric of 4-input LUTs paired with dedicated 18x18 multipliers and embedded M9K memory blocks. This combination enables efficient DSP, buffering, and state-machine implementation without external components, while the M9K blocks provide true dual-port operation for FIFO and ping-pong buffer designs. Typical applications include industrial machine vision and motor drives, IoT edge gateways, video surveillance with on-chip image pre-processing, low-cost PCIe-over-GPIO bridges, and protocol conversion (UART/SPI/I2C to Ethernet or USB). The U256 package provides high I/O density on a compact PCB footprint, well suited to space-constrained embedded designs. When designing with this part, use Intel Quartus Prime Lite Edition for synthesis, place-and-route, and timing analysis. Decoupling and PCB layout guidance follows the standard Intel Cyclone 10 LP hardware reference manual; proper configuration scheme selection (AS, PS, JTAG) is essential at board bring-up. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
10CL006ZE144I8G - 6,272-Cell FPGA | Altera | Embedded Logic
Altera 10CL006ZE144I8G is a Cyclone 10 LP field-programmable gate array containing 6,272 logic cells and 276,480 embedded memory bits, offered in a 144-pin LQFP exposed-pad package. The distributor listing also identifies 88 user I/O, making it suitable for compact, cost-sensitive embedded control and digital-interface designs. The I8G ordering suffix indicates the specified device variant, but operating grade, configuration details, and electrical limits require the manufacturer datasheet for confirmation. A field-programmable gate array is a programmable logic device whose configurable logic blocks, routing resources, memory, and I/O elements implement application-specific digital circuits. Within the semiconductor hierarchy, an FPGA belongs to programmable logic ICs and sits between fixed-function application-specific integrated circuits and software-driven processors. Engineers use FPGAs when parallel processing, custom interfaces, deterministic timing, hardware reconfiguration, or rapid design iteration justify their flexibility. The key verifiable features are 6,272 logic cells, 276,480 embedded memory bits, 88 user I/O, and a 144-pin LQFP exposed-pad package. These resources support moderate-complexity control logic, bridging, state machines, sensor aggregation, and communications preprocessing. Embedded memory can implement FIFOs, lookup tables, buffers, and command storage without requiring an external memory device for smaller data sets. Cyclone 10 LP is intended for low-power programmable logic applications, although exact static and dynamic power depend on configuration, clocking, toggle rate, I/O activity, and supply conditions. The exposed pad provides a thermal and electrical connection path, so PCB layout must follow the manufacturer's land pattern, ground recommendations, and thermal guidance. Logic capacity should be evaluated with synthesis utilization, timing constraints, memory inference, and routing margin rather than logic-cell count alone. Typical uses include industrial control, motor-control interfacing, test equipment, image-sensor front ends, communications glue logic, and educational or prototyping platforms. For a 10CL006ZE144I8G design, its 88 user I/O can connect multiple peripheral buses and parallel data sources, while its 276,480 memory bits support local buffering. Firmware engineers should use the appropriate Altera FPGA design software and the configuration interface specified for this device family. Before schematic release, confirm power rails, permitted I/O standards, configuration method, supported memory interfaces, clock constraints, exposed-pad requirements, and exposed-pad layout. Exact package dimensions, speed grade, temperature grade, jitter, power, and timing specifications were not provided in the verified data and must not be assumed. This product page combines verified device identity, resources, packaging, and sourcing information with explicit markers for unavailable engineering data, helping buyers and engineers distinguish documented facts from values that require manufacturer-document review.
10CL006ZU256I8G - Cyclone 10 LP FPGA 6K LE | Intel | UFBGA-256
The Intel 10CL006ZU256I8G is a low-power member of the Cyclone 10 LP field-programmable gate array (FPGA) family, integrating 6,272 logic elements, 176 user I/O pins, and 276,480 bits of embedded memory in a 256-ball Ultra Fine-Pitch Ball Grid Array (UBGA) package. The device is fabricated on a low-power 60 nm process, operates from a 1.0 V/1.2 V core supply plus 2.5 V/3.3 V I/O banks, and is rated for the industrial -40 C to +100 C junction range. The 6K LE density makes it a drop-in upgrade path for legacy Cyclone IV and Cyclone V 6K designs that need cost reduction or migration to Intel Quartus Prime-supported silicon. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as PLLs, memory blocks, and DSP slices. FPGAs sit at the top of the digital logic hierarchy: programmable logic device -> FPGA -> SRAM-based LUT FPGA -> programmable logic IC. Unlike microcontrollers that execute firmware sequentially, FPGAs implement parallel hardware described in HDLs (Verilog/VHDL) and are configured at every power-up via a flash or EPCQ configuration device. Key features of the 10CL006ZU256I8G include 6,272 logic elements (LEs), 176 maximum user I/O, 270 Kbits of embedded SRAM (M9K blocks), 15 dedicated 18 x 18 multipliers, 4 general-purpose PLLs, and support for external memory interfaces such as DDR2/DDR3. The device ships in the 256-ball UBGA package with a 0.8 mm ball pitch, giving designers a compact footprint suitable for industrial control boards, video processing, and motor drive subsystems. Architecturally, Cyclone 10 LP uses an SRAM-based 4-input LUT fabric with columnar M9K memory blocks, multiplier blocks, and PLL blocks arranged in a regular column-based layout. Compared with the older Cyclone IV E 6K, the 10CL006ZU256I8G delivers lower static power, supports modern configuration schemes (single passive serial, fast power-on), and is supported by the current Intel Quartus Prime Lite design software with periodic point-release updates. Configuration is typically loaded from an external EPCQ or EPCS flash at power-up via the active serial (AS) or JTAG mode. Typical applications include industrial machine vision cameras, low-cost video bridging and image aggregation panels, factory automation controllers, motor drive signal conditioning, and I/O expansion bridges in embedded SBCs. The combination of 176 I/O, 15 multipliers, and DDR controller support makes the 10CL006ZU256I8G well-suited to parallel data acquisition and high-channel-count sensor aggregation. When designing with this device, use the Cyclone 10 LP device family pin connection guidelines for power decoupling: place 100 nF X7R capacitors within 100 mil of every VCCINT/VCCA/VCCIO pin, plus bulk 47 uF tantalum and 220 uF aluminum polymer on the regulator outputs. Leave the nCONFIG, nSTATUS, CONF_DONE, and MSEL[3:0] configuration pins accessible for JTAG/AS programming. This page synthesizes current distributor pricing, drop-in and pin-compatible Cyclone 10 LP family alternatives, and practical Quartus Prime design notes not found in the datasheet alone.
10CL010YE144A7G - Cyclone 10 LP FPGA, 10K LE, EQFP-144 | Intel
The Intel (Altera) 10CL010YE144A7G is a Cyclone 10 LP field-programmable gate array (FPGA) with 10,320 logic elements, 423,936 bits of embedded RAM, and 88 user I/Os, housed in a 144-pin EQFP (LQFP with exposed pad) package. It is built on a low-power 60 nm process, operates from a 1.2 V core supply, and supports industrial-grade ambient temperatures from -40 C to +125 C. The device targets cost-sensitive, low-power, high-volume applications such as I/O expansion, bridge/interface conversion, motor control, and industrial automation. An FPGA (field-programmable gate array) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing by the end user. Within the programmable logic taxonomy, FPGAs sit above simple PLDs (PALs, GALs) and CPLDs in density and capability. The Cyclone 10 LP family is Intel's entry-level, low-power FPGA line, optimized for replacing ASICs and discrete glue logic in volume production where power and BOM cost matter more than absolute performance. It belongs to the broader power-management-aware device hierarchy: FPGA > programmable logic > semiconductor IC. Key features of the 10CL010YE144A7G include 10,320 logic elements arranged in adaptive logic modules (ALMs), 414 kbits of embedded memory (M9K blocks), up to 88 general-purpose I/O pins, support for DDR2/DDR3/LPDDR2 external memory interfaces via soft IP, and dedicated embedded multiplier blocks for DSP. The device integrates phase-locked loops (PLLs) for clock management, supports JTAG (IEEE 1149.1) boundary-scan configuration, and is programmable via the Intel Quartus Prime design suite over JTAG or serial configuration schemes. The 10CL010YE144A7G uses a TSMC 60 nm low-power CMOS process and a hard-wired, deterministic routing fabric. Power is managed through Intel's PowerPlay tools, which estimate and optimize both static and dynamic power across voltage and temperature. The exposed thermal pad on the EQFP-144 package provides a low-resistance thermal path, enabling industrial-temperature operation with minimal external heatsinking. Typical applications include industrial motor drives and servo control, machine vision interfaces, video bridging and image processing pipelines, IoT edge nodes, and human-machine interface (HMI) panels. The low unit cost (around USD 4.40 at LCSC as of 2026-09-05) and broad IP ecosystem make it suitable for production deployments. When designing with this part, ensure the Quartus Prime device selection matches the specific Ordering Part Number suffix (E144 = EQFP-144, Y = commercial/industrial temp, A7 = speed/lock grade), since I/O pin assignments, PLL count, and PCIe hard IP availability differ across the Cyclone 10 LP range. This page consolidates distributor pricing, verified drop-in alternatives, and design notes that go beyond what is published in the manufacturer datasheet alone.
10CL010YE144C6G - Cyclone 10 LP FPGA 10K LE, 144-LQFP | Altera/Intel
The Intel (formerly Altera) 10CL010YE144C6G is a low-power Cyclone 10 LP Field-Programmable Gate Array (FPGA) with 10,320 logic elements, 423,936 bits of embedded memory, and 88 user I/O pins, housed in a 144-pin LQFP exposed-pad (EQFP-144) package. The Cyclone 10 LP family is built on a low-power 60-nm process and is designed for cost-sensitive, low-static-power applications such as industrial control, motor drive, video bridging, and I/O expansion. This OPN is the commercial-grade speed-grade-6 variant, providing a balance between timing margin and cost for general-purpose designs. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LBs), programmable routing, and dedicated I/O, allowing designers to create custom digital circuits in silicon. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside CPLDs (Complex Programmable Logic Devices) and are themselves a subset of Application-Specific Integrated Circuits (ASICs) that the user can program in the field after manufacture. Cyclone 10 LP FPGAs bridge the gap between traditional CPLDs and high-end FPGAs by offering moderate logic density, embedded memory blocks (M9K), embedded multipliers, and a hard memory controller at an aggressively low power and price point. Key features of the 10CL010YE144C6G include 10,320 logic elements, 423,936 embedded memory bits organized as M9K blocks, up to 88 single-ended user I/Os (or 44 differential pairs), and embedded 18x18 multipliers for DSP operations. The device supports LVDS, LVTTL, LVCMOS, SSTL, and other I/O standards via configurable I/O banks, and includes dedicated PLL blocks for clock management. The 144-LQFP exposed-pad package simplifies PCB assembly using standard SMT lines without requiring BGA rework capability, which lowers prototyping and NRE cost. Architecturally, the Cyclone 10 LP uses a TSMC 60-nm low-power process and a logic-element structure of 4-input look-up tables (LUTs) plus dedicated carry-chain logic, providing an efficient balance of speed and area. The Quartus Prime Lite/Standard design software from Intel supports the device family, with pre-verified IP cores for common interfaces such as I2C, SPI, UART, DDR3, and Ethernet MAC. Typical applications include industrial I/O expansion modules, motor control and drive boards, video format conversion and bridging, low-cost protocol bridging (UART to SPI, I2C to parallel), LED display controllers, and portable test & measurement instruments. Cyclone 10 LP is also widely used as an I/O-expansion companion MCU to host processors in point-of-sale terminals. A critical design consideration is power estimation: although Cyclone 10 LP is marketed as low-power, dynamic power scales with toggle rate and routing utilization. Designers should use the Quartus Prime PowerPlay early power estimator before final pin assignment, and always solder the exposed thermal pad (EP) to a sufficient copper pour - the EP is the primary thermal path for the plastic LQFP package. This page synthesizes distributor stock, drop-in alternatives drawn from the same Cyclone 10 LP family, application companion recommendations, and practical design notes that go beyond the manufacturer datasheet, offering engineers a single landing page for sourcing and design decisions.