FPGA & CPLD
Products (6352)
A3PE3000L-1FG896I - 3M-Gate Low-Power Flash FPGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-1FG896I is a low-power flash-based FPGA from the ProASIC3L family delivering 3,000,000 system gates, 75,264 logic cells, and up to 620 user I/Os in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package, built on 130 nm flash technology with a 1.2 V to 1.5 V core voltage and industrial temperature rating of -40C to +85C. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration PROM. Within the programmable logic hierarchy, the ProASIC3L sits under the broader FPGA and programmable logic device categories and is distinguished from SRAM FPGAs by its single-chip, instant-on, secure, reprogrammable architecture. Key differentiating features include Flash*Freeze technology, which allows near-zero static power consumption while retaining state; live reprogrammability; single-chip operation with no external boot device; weak pull-up/down options and Schmitt trigger inputs on single-ended I/Os (A3PE3000L); and IEEE 1149.1 (JTAG) boundary scan test support. Pin-compatible packages across the ProASIC3L family simplify migration between densities. Technically, the device uses a 130 nm CMOS flash process with a Sea-of-Tiles switch fabric. The low core voltage (1.2 V nominal) plus Flash*Freeze mode yields very low static power, making it suited to battery-sensitive and thermally constrained systems. The 896-ball FBGA offers a 1.00 mm ball pitch for surface mounting. Typical applications include industrial automation and control, portable and battery-powered instrumentation, secure military and communications systems, and bridge/interconnect logic where instant-on and configuration security matter. A key design consideration is power-rail sequencing: the ProASIC3L requires the 2.5 V I/O/auxiliary supply and 1.2 V core supply per datasheet recommendations, and Flash*Freeze entry/exit timing should be validated in system. This page synthesizes distributor availability data, drop-in alternatives within the same FG896 footprint, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-1FGG324 - 3M-Gate Low-Power Flash FPGA | Microchip
The Microchip Technology A3PE3000L-1FGG324 is a ProASIC3L low-power flash FPGA with 3 million system gates, 221 user I/Os, and a 1.2 V core voltage, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device that implements user-defined digital logic through a configurable fabric of logic elements, routing resources, and I/O cells. The ProASIC3L family belongs to the nonvolatile flash FPGA class within the broader power-management and programmable-logic hierarchy: flash FPGA -> FPGA -> programmable logic IC -> digital integrated circuit. Unlike SRAM-based FPGAs, its flash cells are nonvolatile, so the device powers up instantly without an external configuration PROM. Key features include the ProASIC3L low-power fabric with Flash*Freeze technology for dramatic dynamic power reduction, a 1.2 V to 1.5 V core voltage range, single-chip secure operation, and reprogrammability without boot-time configuration delay. The device targets total-cost-of-ownership-sensitive designs by removing the need for configuration flash and external power-cycling circuitry. Architecturally, the A3PE3000L uses a 130 nm CMOS flash process with 75264 logic cells organized in VersaTile clusters, allowing each tile to act as a logic function, registered logic, or small memory. The fabric supports high performance while the L-variant leverages low-power process and core operation for portable and power-constrained systems. Typical applications include industrial automation control, portable and battery-powered instrumentation, secure military and aerospace subsystems, and communications line-card glue logic, where nonvolatile instant-on configuration and low standby power are essential. Design consideration: the 324-ball FBGA requires careful PCB layout with appropriate via-in-pad or dog-bone fanout, and core voltage selection (1.2 V vs 1.5 V) must match speed-grade requirements. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-1FGG324I - 3M-Gate Flash FPGA, 324-FBGA | Microchip
The Microchip (Microsemi) A3PE3000L-1FGG324I is a ProASIC3L low-power flash-based FPGA delivering 3 million system gates, 75264 logic elements, 516096 bits of embedded SRAM, and 221 user I/Os in a 324-ball FBGA (19x19 mm) package, fabricated on a 130 nm flash process with a 1.2 V core voltage and industrial temperature rating of -40C to +125C. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers configure using a hardware description language such as Verilog or VHDL. FPGAs sit between fixed-function ASICs and software-programmable processors in the programmable logic hierarchy, offering ASIC-like integration without mask costs or NRE. The ProASIC3L family adds Flash*Freeze technology on top of the base ProASIC3 architecture for dramatic dynamic power reduction. Key features of the A3PE3000L-1FGG324I include nonvolatile flash programming, which makes the device Instant On and single-chip, requiring no external configuration PROM and providing inherent design security. The low-power L variant supports 1.2 V to 1.5 V core operation and Flash*Freeze mode, which preserves state while cutting dynamic power. Embedded SRAM blocks total 516096 bits, supporting FIFOs and dual-port memories. Technically, the device uses Microchip's flash switch fabric on a 130 nm CMOS process, with reprogrammable, secure, single-chip operation. The -1 speed grade balances performance with power, and the FGG 1.0 mm ball-pitch FBGA package supports fine-pitch surface-mount assembly. According to the Microsemi ProASIC3L datasheet, the family targets low total cost of ownership and high system performance. Typical applications include industrial automation controllers, battery-powered portable instrumentation, medical monitoring equipment, aerospace subsystems requiring secure instant-on logic, and communications line cards where power gating during idle periods saves energy. When designing with this FPGA, plan power rails for the 1.2 V core and I/O banks early, and exploit Flash*Freeze mode by gating the clock domain during idle intervals to maximize battery life. This page synthesizes distributor availability data, same-footprint drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
The Microchip Technology (formerly Microsemi) A3PE3000L-1FGG484 is a low-power ProASIC3L flash-based FPGA with 3,000,000 system gates, 75,264 logic cells, and 341 user I/Os, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) with a 1 mm ball pitch and commercial 0C to +70C temperature rating. It operates from a 1.2 V to 1.5 V core voltage with speed grade -1. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that implements custom digital logic through configurable logic blocks, routing fabric, and I/O cells. Unlike SRAM FPGAs, flash-based FPGAs such as the ProASIC3L family store their configuration in nonvolatile flash, making them single-chip, Instant-On solutions that need no external boot flash and are inherently more secure against bitstream interception. Key features include up to 504 kbits of true dual-port SRAM, up to 616 user I/Os across the family, and Flash*Freeze technology, which dramatically cuts dynamic and static power during idle periods without losing state. The 130-nm, 7-layer-metal (6 copper) flash CMOS process delivers a strong balance of density, performance, and low total cost of ownership. The ProASIC3L architecture provides live-at-power-up Level 0 support, enabling glueless integration in systems where the FPGA must be functional immediately at reset. Its reprogrammability supports in-field upgrades, while the single-chip design reduces BOM cost and board area compared to configuration-flash-based alternatives. Typical applications include industrial automation controllers, portable and battery-powered instrumentation, communications line cards, and medical diagnostic equipment where low standby power and instant-on behavior are required. A key design consideration: the 484-BGA requires careful PCB fanout and at minimum a 6-layer stack-up with dedicated power/ground planes; verify the 1 mm pitch footprint against the Microchip package drawing before layout release. This page synthesizes distributor availability data, drop-in alternatives within the ProASIC3/ProASIC3L family, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
The Microchip Technology A3PE3000L-1FGG484I is a ProASIC3L low-power flash FPGA with 3 million system gates, 341 user I/Os, and 516096 bits of total RAM, housed in a 484-ball Fine-Pitch Ball Grid Array (484-FPBGA, 23x23 mm) package rated for -40C to +100C junction temperature operation. A Field Programmable Gate Array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks and programmable interconnects that designers configure after manufacturing. FPGAs sit within the broader programmable logic hierarchy: FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. Unlike SRAM-based FPGAs, ProASIC3L devices use a flash-based fabric that is non-volatile, single-chip, and instantly-on at power-up with no external configuration device required. Key features of the A3PE3000L include a core supply range of 1.14V to 1.575V (1.2V nominal, up to 1.5V operation), FlashFreeze technology that dramatically reduces dynamic power by roughly 40% and static power by roughly 50% versus the standard ProASIC3 family, and reprogrammability supporting in-system updates. The low-power L variant targets battery-powered and thermally constrained systems where leakage and dynamic power dominate the power budget. Technically, the device is fabricated on a 130 nm flash process and belongs to the ProASIC3L family derived from Actel/Microsemi architecture. It integrates abundant advanced features such as embedded RAM blocks totaling 516096 bits and up to 341 user-accessible I/O pins, supporting both single-chip solutions and small-footprint designs with low total cost of ownership. Typical applications include portable and battery-operated instrumentation, industrial automation and control, communications line cards requiring power-gated standby modes, and medical monitoring equipment where the FlashFreeze mode preserves state while cutting power consumption. When designing with this device, verify core voltage sequencing and exploit FlashFreeze entry/exit timing in the power budget analysis; I/O bank voltage selection must match adjacent-board logic standards before PCB release. This page synthesizes distributor pricing, drop-in alternatives, design notes, and FAQ content not found in the manufacturer datasheet.
A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip
The Microchip Technology (Microsemi/Actel) A3PE3000L-1FGG484M is a low-power ProASIC3L flash-based FPGA with approximately 3 million system gates (35K logic elements), 341 user I/Os, and 516096 bits (504 kbits) of true dual-port SRAM, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure to implement custom digital circuits. Within the programmable logic hierarchy, the ProASIC3L family sits in the low-power, mid-density class of flash FPGAs, distinct from SRAM-based FPGAs because configuration is stored in non-volatile on-chip flash, enabling single-chip, live-at-power-up operation without an external boot flash. Key features of the A3PE3000L include a 1.2 V core voltage (the L suffix denotes low-power operation), I/O operation as low as 1.2 V, and Microchip's Flash*Freeze technology, which the datasheet states reduces dynamic power by 40% and static power by 50% versus the equivalent ProASIC3 device. The device is fabricated on a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process and is reprogrammable in-system. Architecturally, the ProASIC3L fabric consists of VersaTiles (logic modules), embedded SRAM blocks, and abundant routing resources, supporting system performance suited to glue logic consolidation, interface bridging, and control-path implementations. Level 0 support and true single-chip operation simplify board design and improve reliability versus multi-chip configuration schemes. Typical applications include industrial control and automation, portable and battery-powered instrumentation, aerospace/defense payloads requiring non-volatile, secure configuration, and communications line cards where the low static power of the flash fabric and the Flash*Freeze mode directly extend battery life or reduce thermal budget. A key design consideration: the -1 speed grade balances performance against the lowest dynamic power; verify I/O bank voltage assignment early since VCCI can be as low as 1.2 V per bank. Use Microchip Libero SoC design suite for synthesis and place-and-route. This page synthesizes distributor pricing and stock, drop-in alternatives within the same 484-BGA footprint, and practical design notes not found in the manufacturer datasheet alone.
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
The Microchip Technology A3PE3000L-1FGG896 is a ProASIC3L low-power flash FPGA delivering 3 million system gates, 75,264 logic cells, and up to 620 user I/Os in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package with a 1.2 V core voltage and -1 speed grade. A field-programmable gate array (FPGA) is an integrated circuit that engineers configure after manufacturing to implement custom digital logic. Within the power-management hierarchy of programmable logic, the ProASIC3L family sits in Microchip's (formerly Microsemi/Actel) flash FPGA lineup, distinguished from SRAM FPGAs by its nonvolatile flash configuration cells, which eliminate the external boot flash and enable true single-chip operation with instant-on power-up. Key features of the A3PE3000L-1FGG896 include Flash*Freeze technology, which dramatically cuts dynamic and static power while retaining SRAM state and running I/Os; 1.2 V to 1.5 V core and I/O operation with I/O rails as low as 1.2 V; 130 nm flash process technology; and reprogrammability with secure, live-at-power-up configuration. Compared with the equivalent ProASIC3 device, the ProASIC3L reduces dynamic power by roughly 40% and static power by about 50%. Technically, the fabric is built from Versatile logic elements organized into 75,264 cells, supporting both sequential and combinational designs, with embedded memory blocks and high-performance I/O structures supporting multiple single-ended and differential standards. The -1 speed grade balances performance against power for mainstream designs; FPGAkey lists the family clock-related figure of 892.86 MHz for the underlying technology parameters. Typical applications include portable and battery-powered instrumentation, industrial control, medical monitoring equipment, communications line cards, and aerospace subsystems where single-chip, low-static-power programmable logic is required. A key design consideration is thermal and power budgeting: although the Flash*Freeze mode minimizes consumption, designers must still verify I/O bank voltage assignments and ensure adequate decoupling on the multiple VCC/VCCI rails. This page synthesizes distributor pricing, drop-in alternatives, comparison data, and practical design notes not found in the manufacturer datasheet, providing a complete sourcing and engineering reference.
A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
The Microchip Technology A3PE3000L-1FGG896I is a ProASIC3L low-power flash-based FPGA delivering 3 million system gates, 504 kbits of true dual-port SRAM, and up to 620 user I/O in an 896-ball FBGA package rated for industrial operation from -40C to +85C. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. This places the ProASIC3L family in the power management-oriented branch of the FPGA taxonomy: unlike SRAM FPGAs, it is single-chip, Instant On at power-up, and inherently secure because the bitstream never leaves the device. Its hierarchy runs: A3PE3000L -> ProASIC3L family -> flash FPGA -> field-programmable gate array -> programmable logic device. Key features include 1.2 V to 1.5 V core voltage operation, Flash*Freeze technology that dramatically cuts dynamic and static power without losing register or SRAM state, six PLLs for clock management, and speed grade -1 performance up to approximately 272 MHz. The 130-nm, 7-layer metal (6 copper layers) flash-based CMOS process combines high logic density with live-at-power-up Level 0 support, eliminating the boot delay and configuration controller required by SRAM FPGAs. The low-power architecture makes this device well suited to battery-powered and thermally constrained systems. Flash*Freeze mode allows the fabric to be frozen in microseconds while I/O states are held, resuming full-speed operation just as quickly, which is valuable in duty-cycled instruments and portable data acquisition units. Typical applications include industrial automation controllers, portable medical and test instrumentation, aerospace and defense subsystems requiring secure single-chip configuration, and communication line-card glue logic. Designers should budget board space and stack-up for the 1 mm pitch 896-ball FBGA and verify power sequencing across the core and I/O banks; the industrial -40C to +85C rating of the I-suffix part must be observed in thermal analysis. This page synthesizes distributor availability data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-1FGG896M - 3M Gate ProASIC3L Low Power FPGA | Microchip
The Microchip Technology (Microsemi) A3PE3000L-1FGG896M is a low-power ProASIC3L flash FPGA with 3 million system gates, 620 user I/Os, and 1.2 V to 1.5 V core operation, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field. The ProASIC3L family sits within the broader hierarchy of flash-based FPGAs -> programmable logic devices -> programmable semiconductors. Unlike SRAM FPGAs, ProASIC3L devices use nonvolatile flash configuration cells, so they power up instantly without an external configuration PROM and offer inherently higher security against design theft. Key features include 40% lower dynamic power and 50% lower static power than the equivalent ProASIC3 device, the patented Flash*Freeze technology that freezes state while cutting core power during idle periods, and single-chip operation with no boot PROM. The 620 user I/Os support low-voltage operation down to 1.2 V, and the 130 nm flash process delivers a balance of density, performance, and low total cost of ownership. Architecturally, the device integrates versatile logic elements (approximately 35,000 LEs per the Mouser listing description), embedded SRAM blocks, and flash-based routing fabric. The Flash*Freeze pin allows the design to enter an ultra-low-power mode in microseconds while retaining SRAM and register state, an advantage over power-gating approaches that lose context. Typical applications include battery-powered portable instrumentation, industrial automation controllers, military and aerospace secure designs, and communications line cards where static power dominates the power budget. A key design consideration is power-supply sequencing across the 1.2 V, 1.5 V, and 2.5 V/3.3 V I/O rails, plus careful decoupling of the many BGA power balls; the Flash*Freeze entry/exit timing must also be validated in-system. This page synthesizes distributor pricing data, same-package drop-in ordering-code alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-1PQ208 - ProASIC3L Flash FPGA 208-PQFP | Microchip
The Microchip Technology (Microsemi) A3PE3000L-1PQ208 is a low-power ProASIC3L flash-based FPGA with approximately 3 million system gates (about 35,000 usable LEs), 147 user I/Os, and a 1.2V core voltage, housed in a 208-pin PQFP (BFQFP) package. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy, the A3PE3000L belongs to the ProASIC3L family (low-power branch of ProASIC3), which sits under the broader FPGA/PLD category and power-management-aware system-on-chip solutions. Because configuration is nonvolatile, the device is Instant On at power-up and requires no external boot flash. Key features include Flash*Freeze technology, which dramatically cuts dynamic power while retaining state, a single 1.2V to 1.5V core supply per the Microchip product page, 130nm flash process technology, and reprogrammability with secure single-chip operation. The verified distributor data reports a characteristic performance figure of 892.86 MHz for the family listing. Architecturally, the ProASIC3L fabric is built from VersaTiles, third-generation three-input LUT-equivalent logic cells that can also act as a D flip-flop or latch with enable, giving efficient mapping of sequential and combinational logic. The low-power flash approach removes the configuration element of SRAM FPGAs and reduces total cost of ownership in high-volume systems. Typical applications include portable and battery-powered industrial equipment, low-power embedded control and interface bridging, and space- or power-constrained communications hardware where 147 I/Os suffice. A key design consideration: the PQFP-208 package has larger lead inductance than ball-grid alternatives, so power-integrity and simultaneous-switching noise demand generous ground returns. This page synthesizes distributor listings, cross-reference data, and drop-in packaging-variant analysis not consolidated in the manufacturer datasheet.
A3PE3000L-1PQ208I - 3M-Gate Low-Power Flash FPGA | Microchip
The Microchip Technology A3PE3000L-1PQ208I is a ProASIC3L low-power flash FPGA with 3,000,000 system gates, 516,096 bits of embedded RAM, and 147 user I/Os, housed in a 208-pin fine-pitch PQFP (PQ208) package rated for the industrial temperature range of -40C to +100C junction temperature. It operates from a 1.14V to 1.575V core supply and is speed grade 1. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration ROM. In the programmable-logic hierarchy, the FPGA sits above CPLDs and below ASSPs/ASICs in density, and the ProASIC3L family further distinguishes itself as a single-chip, Instant-On solution that needs no boot device, improving security and board-level BOM cost. Key features include the low-power Flash*Freeze technology, which allows near-zero dynamic power consumption while retaining SRAM state and waking in microseconds; nonvolatile flash programming that eliminates external configuration flash and reduces tampering risk; and 1.2V-to-1.5V core operation for low static power. The 208-pin gull-wing QFP supports hand inspection and rework, which is valuable for industrial and defense programs with long service lives. Architecturally, the device is built on Microchip (formerly Actel/Microsemi) flash switch technology with 75,264 configurable logic blocks and distributed block RAM. Unlike SRAM FPGAs, no configuration bitstream is exposed at power-up, giving inherent single-chip security advantages. Typical applications include industrial automation controllers, portable and battery-powered instrumentation, communications line cards, and avionics/defense glue-logic consolidation where reprogrammability and low static power are decisive. Design consideration: the -1 speed grade and PQ208 package limit maximum system clock rates versus FG-family speed grades; verify timing closure in Libero SoC before committing the board layout, and budget supply sequencing for the 1.2V core rail. This page synthesizes distributor pricing, drop-in same-footprint alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-1PQG208 - ProASIC3L FPGA 147 I/O | Microchip
The Microchip Technology A3PE3000L-1PQG208 is a ProASIC3L low-power flash FPGA in the ProASIC3E family, offering 3 million system gates (approximately 35K logic elements) with 147 user I/O in a 208-pin BFQFP (PQFP-208) surface-mount package. A field-programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and interconnects that designers configure in the field, sitting within the broader programmable logic hierarchy that also includes CPLDs and PLDs. The ProASIC3L subfamily distinguishes itself by using flash-based configuration memory, so it is single-chip, instant-on, and inherently secure against bitstream interception compared with SRAM FPGAs that need external boot devices. Key features include a 1.2 V to 1.5 V core voltage, I/O operation down to 1.2 V, and Microchip's Flash*Freeze technology, which per the ProASIC3L datasheet cuts dynamic power by 40% and static power by 50% versus the equivalent standard ProASIC3 device. Fabricated on a 130 nm flash process, the device is reprogrammable and supports a maximum operating frequency of 892.86 MHz as listed by distributor data for this family member. The commercial temperature grade operates from 0C to +70C, and the part ships in a tray packag. Typical applications include battery-powered portable instrumentation, low-power industrial control, aerospace/defense data acquisition, and glue-logic consolidation in cost-sensitive systems where flash FPGAs provide secure, single-chip programmability. Design consideration: the PQFP-208 package has relatively long lead inductance compared with flip-chip BGA alternatives, so power-integrity planning and generous decoupling are important for high-speed I/O operation. This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet, with pricing data as of 2026-09-02.
A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip
The Microchip (Actel/Microsemi) A3PE3000L-FG324I is a ProASIC3L low-power flash-based FPGA with 3 million system gates, 221 user I/Os, and 516,096 bits of embedded dual-port SRAM, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package for industrial temperature ranges (-40C to +100C). A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory cells rather than volatile SRAM or an external configuration device. Within the programmable logic hierarchy, the A3PE3000L sits under the FPGA -> programmable logic device -> semiconductor taxonomy, and its nonvolatile flash fabric means the device is Instant On at power-up and needs no external boot flash, improving board reliability and security compared to SRAM FPGAs. Key features include the 130-nm 7-layer-metal flash CMOS process, a 1.2V core voltage (the L variant supports 1.2V to 1.5V core operation for low static power), up to 144 kbits of true dual-port SRAM in flexible blocks, and Flash*Freeze technology that cuts static power dramatically while preserving state. IEEE 1149.1 JTAG boundary scan and Schmitt-trigger input options on single-ended I/Os simplify board test and signal conditioning. The ProASIC3L architecture uses fine-grained Versatile logic elements and abundant routing, with the 3M-gate member suiting high-capacity glue logic, bus bridging, and control-plane designs. Clock frequencies in typical designs run well into the hundreds of megahertz range per family documentation. Typical applications include industrial automation controllers, battery-powered portable instrumentation, aerospace and defense control logic, and communications line-card bridging, where single-chip, nonvolatile, low-static-power programmable logic is valuable. Design consideration: the FG (standard ball) package variant contains lead and is RoHS non-compliant; for RoHS-compliant designs choose the FGG (lead-free ball) variant A3PE3000L-FGG324I, which is footprint-identical. This page adds value beyond the manufacturer datasheet by synthesizing drop-in alternatives, comparison tables, pricing tiers, and practical design notes in one AI-optimized reference.
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
The Microchip Technology A3PE3000L-FG484 is a low-power ProASIC3L flash FPGA with 3 million system gates (75,264 cells), up to 341 user I/Os, and 250 MHz system performance, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 23 x 23 mm with a 1 mm ball pitch. A Field Programmable Gate Array (FPGA) is a semiconductor device that implements user-defined digital logic through a programmable interconnect fabric and configurable logic blocks. Within the FPGA hierarchy, the ProASIC3L family sits in Microchip (formerly Actel/Microsemi) low-power flash FPGA portfolio: FPGA -> flash-based FPGA -> ProASIC3L family. Unlike SRAM-based FPGAs, ProASIC3L devices use nonvolatile flash technology, making them secure, single-chip, and Instant On - no external configuration PROM is required at power-up. Key features include a 1.2 V to 1.5 V core voltage operating range that lets designers trade speed against power, dramatic dynamic power savings, and Flash*Freeze technology for near-zero static power in standby modes. The 130 nm flash process stores the design on-chip, providing inherent security against bitstream interception and eliminating boot-time configuration delays. Technically, the A3PE3000L integrates 75,264 logic elements arranged in Versatile logic blocks, supporting single-ended and differential I/O standards with flexible banking for mixed-voltage systems. The low-power L variant is optimized for applications where standby current and dynamic power dominate the power budget, achieving power levels an order of magnitude below comparable SRAM FPGAs. Typical applications include portable and battery-powered instrumentation, industrial control and automation, secure military and communications equipment, and medical devices, where nonvolatile, low-power, single-chip programmable logic reduces board space and system cost. When designing with this device, budget the core voltage setting early: running the core at 1.2 V minimizes power, while 1.5 V unlocks the highest 250 MHz-class performance. Verify I/O banking rules before pin assignment to avoid conflicts in mixed-voltage designs. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design guidance not found in the manufacturer datasheet.
A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
The Microchip Technology A3PE3000L-FG484I is a ProASIC3L flash-based FPGA delivering 3 million system gates, 75264 logic cells, 504 kbit of true dual-port SRAM and up to 341 user I/O in a 484-ball FBGA (23x23 mm) package. It operates from a 1.14 V to 1.575 V core supply and is rated for -40C to +100C junction temperature (industrial grade). A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration PROM. Within the programmable logic hierarchy, it sits at the device level of the power management and digital logic system, alongside SRAM-based and antifuse FPGAs. Flash-based devices such as the ProASIC3L family power up instantly (Live-at-Power-Up Level 0 support) and provide a true single-chip solution without a boot sequence. Key features include the 130-nm, 7-layer-metal (6 copper) flash-based CMOS process, 1.2 V core operation for low static and dynamic power, and nonvolatile security via flash lock, which protects intellectual property without battery backfill or bitstream streaming. The L variant of the family adds low-power features versus the standard ProASIC3E A3PE3000. Technically, the device provides 504 kbits of true dual-port SRAM distributed in variable-aspect-ratio blocks, supporting FIFOs, buffers and embedded datapaths. VersaTiles form the fine-grained fabric, while I/O banks support multiple single-ended and differential standards with configurable drive and slew. Typical applications include industrial automation control, secure communications and military/aerospace systems requiring instant-on operation, single-chip integration and low static power. Design consideration: budget the 1.2 V core rail and 2.5 V/3.3 V I/O rails separately and follow Microchip's power-decoupling guidance; flash FPGAs tolerate hot-socketing but sequencing rules still apply. This page synthesizes distributor pricing, drop-in alternatives within the ProASIC3 family, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-FG484M is a low-power, flash-based ProASIC3L FPGA delivering 3 million system gates, 75264 logic elements, 504 kbits of true dual-port SRAM, and up to 341 user I/Os in a 484-ball FBGA package with 1 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a semiconductor device that implements user-defined digital logic through a configurable fabric of logic blocks, routing resources, and I/O cells. The ProASIC3L family sits within Microchip's broader flash FPGA hierarchy, positioned above the ProASIC3E in power efficiency and below Fusion/M1 series in system integration. Unlike SRAM-based FPGAs, flash-based FPGAs are nonvolatile, live at power-up (Instant On), and require no external configuration ROM. Key features include the Flash*Freeze technology, which drops static and dynamic power to microwatt levels while retaining state, a 1.2 V to 1.5 V core voltage, and a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. Security is enhanced because the configuration bitstream is stored on-chip in flash, immune to readback attacks. Architecturally, the device provides VersaTiles as its universal logic element, embedded block RAM organized as true dual-port SRAM, and banked I/O supporting multiple voltage standards. Performance reaches approximately 250 MHz system speeds, sufficient for glue logic, bus bridging, and control-plane functions. Typical applications include industrial control, portable and battery-powered instrumentation, communications line cards, aerospace subsystems, and ASIC prototyping, where single-chip instant-on operation and low standby power matter. Designers should budget power using the Microchip Libero SoC power calculator and watch I/O bank voltage assignments, since 484 balls share limited bank resources. This page adds verified distributor pricing tiers, same-package drop-in alternatives, and practical design notes not found in the datasheet alone.
A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip
The Microchip Technology A3PE3000L-FG896 is a ProASIC3L low-power, nonvolatile flash FPGA with 620 user I/Os, 3 million system gates, and a 1.2 V core voltage, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package. A field-programmable gate array (FPGA) is a semiconductor device that can be configured by the designer after manufacturing, sitting within the broader hierarchy of programmable logic devices that ranges from SPLDs and CPLDs up to high-density FPGAs. Unlike SRAM-based FPGAs, the ProASIC3L family uses nonvolatile flash technology, meaning the configuration is stored on-chip and no external boot flash is required, making it a secure, single-chip, Instant On solution. Key features of the A3PE3000L-FG896 include its low total cost of ownership, single-chip operation, reprogrammability, and the ProASIC3L family's Flash*Freeze technology, which dramatically reduces static and dynamic power consumption without losing SRAM state or I/O activity. The 1.2 V to 1.5 V core voltage range supports low-power system design. Technically, the device is fabricated on a 130 nm flash process and built around ProASIC3L VersaTile logic architecture, where each tile can act as a lookup table, flip-flop, or embedded memory. The 896-BGA package provides a large 620 I/O budget for wide bus interfaces, memory controllers, and glue logic consolidation in board designs that previously needed multiple ASICs or ASSPs. Typical applications include industrial control, portable and battery-powered instrumentation, secure single-chip logic, and power-sensitive embedded systems where FPGA reprogrammability and instant-on startup are essential. A key design consideration is power: while Flash*Freeze mode can substantially cut dynamic and static power, designers should budget I/O bank loading and configure unused I/Os appropriately to maximize savings. This page synthesizes distributor availability, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, with pricing and stock data verified as of 2026-09-02.
A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip
The Microchip Technology (Microsemi) A3PE3000L-FG896I is a ProASIC3L low-power flash FPGA with 620 user I/Os, approximately 3 million system gates (516096 logic capacity), housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA/896-BGA) package for the industrial temperature range. A flash FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> semiconductor), flash FPGAs such as the ProASIC3L family offer a true single-chip solution: no external boot device is required, configuration is instant-on at power-up, and the device is reprogrammable in-system. Key features of the ProASIC3L family include 1.2V to 1.5V core voltage operation, I/O operation as low as 1.2V, and Flash*Freeze technology that dramatically reduces dynamic power consumption by up to 40% and static power by 50% compared with the equivalent standard ProASIC3 device, according to the Microchip ProASIC3L datasheet (DS50003268). The low total cost of ownership, reprogrammability, and small-footprint packaging make the family attractive for cost- and power-sensitive designs. Architecturally, the A3PE3000L combines fine-grained Versatile logic elements with embedded flash and SRAM resources, supporting high-performance single-chip designs in industrial, communications, and aerospace/defense systems. The -FG896I designation indicates the industrial temperature variant in the 896-ball package with 620 available I/O. Typical applications include industrial automation and control, medical equipment, communications infrastructure, and military/aerospace systems where nonvolatile, secure, low-power programmable logic is required. Design consideration: because the -I suffix denotes the industrial temperature grade, verify soldering and assembly processes; this specific grade is listed by some sources as RoHS non-compliant and lead-containing, so confirm compliance requirements for your end market. This page synthesizes distributor availability, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet, with pricing referenced as of 2026-09-02.
A3PE3000L-FG896M - 3M-Gate Low-Power Flash FPGA | Microchip
The Microchip (formerly Microsemi/Actel) A3PE3000L-FG896M is a 3-million-gate ProASIC3L low-power flash FPGA with 75,264 logic cells and 620 user I/O, fabricated on a 130nm CMOS flash process and housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.2V/1.5V core supply. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology. Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O. Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework. Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential. Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
The Microchip Technology A3PE3000L-FGG324 is a ProASIC3L low-power Flash-based FPGA with 3,000,000 system gates, 221 user I/Os, and support for core voltages from 1.2V to 1.5V, housed in a 324-ball fine-pitch FBGA (324-BGA) surface-mount package. An FPGA (Field-Programmable Gate Array) is a semiconductor device that implements custom digital logic through a fabric of configurable logic blocks (CLBs) connected by programmable interconnects. Unlike SRAM-based FPGAs, the ProASIC3L family stores its configuration in on-chip nonvolatile Flash, giving a single-chip, instant-on solution with no external configuration device required - a key advantage in the programmable logic hierarchy spanning SPLDs, CPLDs, and FPGAs. Key features of the A3PE3000L include Flash*Freeze technology for ultra-low static power, up to 75,264 configurable logic cells, support for single-ended and differential I/O standards, Schmitt Trigger option on single-ended inputs (A3PE3000L), weak pull-up/pull-downs, and IEEE 1149.1 (JTAG) boundary scan test per the Microchip ProASIC3L datasheet (DS50003268). The device operates from a 1.5V operating supply (commercial range 0C to +70C for this speed grade) with pin-compatible packages across the ProASIC3L family. Architecturally, the fabric combines VersaTiles with embedded Flash technology built on a standard CMOS process, delivering reprogrammability with inherently low power and high security versus SRAM FPGAs. The low total cost of ownership (TOC) makes the family attractive for high-volume designs where an external boot Flash and power-up configuration time are undesirable. Typical applications include industrial automation controllers, portable and battery-powered instrumentation, communications line cards, and medical monitoring equipment where the Flash*Freeze mode cuts standby power dramatically. Designers should budget the 1.2V to 1.5V core rail carefully: lowering VCORE to 1.2V maximizes power savings, while 1.5V supports higher performance up to the 250MHz-class timing limits. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet. Pricing is referenced as of 2026-09-02.
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
The Microchip (Microsemi) A3PE3000L-FGG324I is a ProASIC3L low-power flash FPGA with 3 million system gates, 221 user I/Os, and 516,096 total RAM bits, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA, 19x19 mm) and rated for the industrial temperature range of -40C to +100C. A flash FPGA is a field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration PROM. Within the power-management hierarchy of programmable logic, ProASIC3L sits in the low-power segment: unlike SRAM FPGAs it is Instant On, single-chip, and secure, because no bitstream is loaded at power-up. Key features include the 130nm CMOS flash process, a 1.2 V to 1.5 V core voltage option, Flash*Freeze technology that dramatically cuts dynamic and static power, and reprogrammability without an external boot device. These attributes reduce total cost of ownership and board complexity. Architecturally, the device integrates flash-based logic elements plus embedded SRAM blocks totaling 516 kbit, supporting pipelined datapaths, FIFOs, and small soft-core processor systems. Performance is sufficient for glue logic consolidation, interface bridging, and control-plane designs at moderate clock rates. Typical applications include industrial automation controllers, portable and battery-powered instruments, communications line cards, and medical monitoring equipment where low standby power is decisive. Design consideration: exploit Flash*Freeze mode to hold state while cutting power during idle periods; plan I/O banking and 1.2 V core rail sequencing early in layout. This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing tiers, drop-in same-package alternatives, and practical design notes in one place.
A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-FGG484 is a ProASIC3L low-power nonvolatile flash FPGA with 3 million system gates (75,264 logic cells), 341 user I/Os, and 516,096 bits of embedded RAM, housed in a 484-ball fine-pitch BGA (FGG484, 23 x 23 mm, 1.0 mm ball pitch) package. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Unlike SRAM-based FPGAs, the ProASIC3L family uses nonvolatile flash technology, placing it in the flash-FPGA branch of the programmable logic hierarchy (FPGA -> flash FPGA -> ProASIC3L family), which means the configuration is stored on-chip and the device is Instant On at power-up with no external boot flash required. Key features include a 1.2 V to 1.5 V core voltage option for reduced dynamic power, the Flash*Freeze technology that dramatically cuts static and dynamic power during idle periods, single-chip secure operation immune to configuration readback, and reprogrammability without a host microcontroller. The FGG484 package supplies abundant I/O for wide parallel buses and memory interfaces. Architecturally, the device is built on a 130 nm flash process with VersaNet low-skew global networks for clock and high-fanout signal distribution, as documented in the ProASIC3E fabric user guide. Typical applications include industrial automation control, battery-powered portable instrumentation, aerospace and defense systems requiring secure nonvolatile configuration, and communications line cards. A key design consideration is that flash FPGAs trade some maximum fabric speed versus high-end SRAM FPGAs, so verify timing closure in Libero SoC before committing the design. This page adds value beyond the datasheet by consolidating distributor availability from Mouser, DigiKey, Arrow, and Newark, drop-in same-package alternatives, and practical design notes.
A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip
The Microchip Technology (Microsemi/Actel) A3PE3000L-FGG484M is a ProASIC3L low-power flash FPGA offering approximately 3 million system gates (75,264 cells) with 341 user I/Os and 516,096 bits of embedded flash memory, housed in a 484-ball FBGA (FGG484) package with military-grade temperature rating from -55C to +125C. A flash-based FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, it sits as an FPGA -> programmable logic device -> semiconductor. Unlike SRAM FPGAs, ProASIC3L devices are single-chip, instant-on, and inherently more secure because the bitstream is stored internally. Key features of the ProASIC3L family include 1.2V to 1.5V core voltage operation, Flash*Freeze technology that dramatically cuts static power while retaining state, and per the Microchip datasheet roughly 40% lower dynamic power and 50% lower static power than the equivalent ProASIC3 device. The non-volatile flash fabric eliminates configuration PROMs, reduces bill-of-material cost, and improves supply-chain security. The A3PE3000L fabric provides versatile logic elements, embedded SRAM, and supports soft-core processors and common IP cores. The 23 x 23 mm, 1.0 mm pitch FGG484 package with 2.23 mm height suits high-I/O-count designs where board area and solderable inspection matter. Typical applications include military and aerospace systems needing -55C to +125C operation, industrial automation controllers, communications line cards, and medical instrumentation where low static power extends battery or conduction-cooled system budgets. Design consideration: allocate adequate decoupling on the 1.2V/1.5V core rails and plan the power-up sequence early; Flash*Freeze pin usage should be fixed before layout freeze. This page synthesizes distributor pricing, same-footprint drop-in alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-02.
A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology
The Microchip Technology A3PE3000L-FGG896 is a 3,000,000-system-gate ProASIC3L low-power flash FPGA with 75,264 logic cells, 504 kbits of true dual-port SRAM, and 620 user I/Os, housed in an 896-ball FBGA (FGG896) package with 1.0 mm pitch. This device is part of Microchip's flash-based FPGA family that combines non-volatile configuration, instant-on operation, and low power consumption for high-reliability applications. An FPGA (Field Programmable Gate Array) is an integrated circuit whose logic fabric can be configured after manufacturing. The ProASIC3L family uses flash-based configuration cells, enabling non-volatile, live-at-power-up operation without an external boot device. FPGAs sit in the digital logic hierarchy between CPLDs and ASICs, balancing flexibility, density, and time-to-market. The A3PE3000L-FGG896 is a mid-density ProASIC3L device, positioned for applications that need substantial logic but not the complexity of the largest FPGA families. Key features of the A3PE3000L-FGG896 include Flash*Freeze technology, which reduces standby power by entering an ultra-low-power mode while retaining register states, 1.2V to 1.5V core operation, and up to 620 user I/Os. The device is manufactured on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process, making it inherently secure and resistant to configuration bitstream loss. It supports Level 0 live-at-power-up, meaning the FPGA is operational immediately after power rail stabilization. The ProASIC3L architecture provides true single-chip operation, with configuration stored in on-chip flash cells, eliminating the need for external configuration memory and reducing system component count. The device offers 504 kbits of true dual-port SRAM, which supports concurrent read/write accesses for FIFO and buffer applications. The 620 user I/Os are arranged in banks with flexible I/O standards, although the exact voltage and standard options are detailed in the manufacturer datasheet. Typical applications include industrial automation and control, communications infrastructure, defense and aerospace electronics, medical imaging, broadcast and machine vision, and secure IoT edge computing. The low static power and Flash*Freeze mode make the A3PE3000L-FGG896 particularly attractive for battery-powered and thermally constrained systems. When designing with the A3PE3000L-FGG896, pay close attention to core supply decoupling: place 100nF ceramic capacitors close to each core supply ball and a bulk capacitor on the board. The 1.2-1.5V core supply should be stable and clean; the Flash*Freeze input can be driven from a GPIO or power management IC to reduce standby current. Thermal vias under the BGA should be used to improve heat transfer. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for selection and design-in information.