FPGA & CPLD
Products (6352)
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
The Microchip (Microsemi) A3PE3000L-FGG896I is a 3-million-system-gate low-power flash-based FPGA from the ProASIC3L family, offering 620 user I/Os and 516096 bits (504 kbits) of embedded true dual-port SRAM in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package, with industrial-grade temperature rating and a 1.14V to 1.575V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and embedded memory that designers program to implement custom digital circuits. Within the programmable logic hierarchy, the A3PE3000L sits at the top of the ProASIC3L low-power family, positioned below the Fusion and Igloo families in the broader power management and embedded processing ecosystem. Unlike SRAM-based FPGAs, it uses nonvolatile flash cells for configuration. Key features include flash-based nonvolatile configuration enabling single-chip, Live-at-Power-Up (Level 0) operation with no external boot PROM, the Flash*Freeze technology unique to the ProASIC3L family that dramatically cuts static and dynamic power while retaining SRAM state, and 130-nm 7-layer-metal (6 copper) flash-based CMOS process technology. The device supports 1.2V to 1.5V core voltage operation for low total cost of ownership. Technically, the ProASIC3L fabric combines versatile logic elements with embedded block SRAM organized as true dual-port memories, supporting high-bandwidth pipelined designs. The flash switch architecture is inherently secure and immune to configuration readback, and the single-chip solution reduces board cost, boot time, and reliability risks compared with SRAM FPGA boot architectures. Typical applications include industrial automation controllers, portable and battery-powered instrumentation, secure communications equipment, and aerospace/defense systems where instant-on operation, low static power, and configuration security are mandatory. When designing with this device, budget core voltage within the 1.14V to 1.575V window and exploit Flash*Freeze mode to extend battery life; the 896-FBGA footprint requires careful ball-mapping to escape all 620 I/Os. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-FGG896M is a low-power flash-based FPGA from the ProASIC3L family, offering 3,000,000 system gates, up to 616 user I/Os, and 504 kbits of true dual-port SRAM, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package with 1 mm ball pitch. A field-programmable gate array (FPGA) is a semiconductor device that can be configured by the designer after manufacturing, sitting within the programmable logic hierarchy of FPGA -> programmable logic device -> digital logic IC. Unlike SRAM-based FPGAs, the ProASIC3L family uses a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process, giving it a non-volatile fabric. Key features include Flash*Freeze technology for near-zero-power standby, live-at-power-up (Level 0) operation for single-chip solutions without an external configuration device, and pin compatibility across the ProASIC3L family (except PQ208). The flash-based fabric eliminates configuration time and configuration-readout security concerns common to SRAM FPGAs. Technically, the device integrates 75,264 logic cells (DigiKey lists 516,096 block figures for the 896-ball option) on the 1.2 V/1.5 V core architecture. Weak pull-up/pull-down options and Schmitt-trigger inputs on single-ended I/Os (A3PE3000L) improve signal integrity, while IEEE 1149.1 (JTAG) boundary scan supports board-level test. The military ProASIC3/EL variant datasheet confirms the low-power focus of the L-suffix grade. Typical applications include low-power industrial control, portable and battery-operated instrumentation, military and avionic glue logic consolidation, communications line cards, and single-chip secure boot designs where an external configuration flash would be a liability. When designing with this device, keep core voltage rails tightly regulated and use the Flash*Freeze mode to exploit its static-power advantage; verify I/O banking rules before fixing the pinout. This page synthesizes distributor pricing, drop-in alternatives, FAQs, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-02.
A3PE3000L-PQ208 - 3M Gate Low-Power Flash FPGA | Microchip
The Microchip (Microsemi/Actel) A3PE3000L-PQ208 is a 3-million-system-gate ProASIC3L low-power flash-based FPGA with 504 kbits of true dual-port SRAM, 147 user I/Os in the 208-pin BFQFP (PQ208) package, a 1.2 V core voltage, and a maximum operating frequency of 781.25 MHz. A flash-based FPGA stores its configuration in on-chip flash memory cells rather than external configuration devices. Unlike SRAM FPGAs, flash FPGAs are live-at-power-up (Level 0 support), single-chip solutions that retain their configuration through power cycles. Within the programmable logic hierarchy, the A3PE3000L sits in the mid-density ProASIC3L family, a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. Key features include nonvolatile flash programming requiring no external boot PROM, low-power operation from a 1.2 V core rail, up to 504 kbits of embedded true dual-port SRAM for FIFOs and buffering, and IEEE 1149.1 (JTAG) boundary scan test support. Schmitt trigger options on single-ended inputs improve noise immunity in industrial environments. The ProASIC3L architecture provides Sea-of-Gates style fabric with versatile logic tiles, making it a cost-effective ASIC replacement in systems where NRE costs and mask charges are prohibitive. Typical applications include industrial automation control, networking and communications equipment, consumer electronics, and avionics subsystems where single-chip, instantly-on programmable logic simplifies the bill of materials and improves board reliability. A key design consideration is supply sequencing and power estimation: the 208-pin QFP has moderate thermal performance, so designers should estimate static plus dynamic power using Microchip Libero power tools before finalizing the power budget. This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not consolidated in the manufacturer datasheet.
A3PE3000L-PQ208I - 3M-Gate Low-Power Flash FPGA | Microchip
The Microchip Technology (Microsemi) A3PE3000L-PQ208I is a 3-million-system-gate ProASIC3L low-power flash-based FPGA with 516,096 bits (504 kbits) of true dual-port SRAM, 147 user I/Os, and a 1.14V to 1.575V supply range, housed in a 208-pin BFQFP (PQ208) surface-mount package with an industrial operating grade. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy - FPGA -> programmable logic device -> logic IC -> semiconductor - flash FPGAs occupy the single-chip, Instant-On niche: unlike SRAM FPGAs, they require no external boot flash and are live at power-up (Level 0 support). Key features include 3,000,000 system gates (75,264 logic cells/CLBs), 504 kbits of true dual-port SRAM, the Flash*Freeze low-power mode that dramatically cuts dynamic power, and a 1.2V core with 1.2V to 1.5V core voltage options. The 130-nm, 7-layer-metal (6 copper) flash-based CMOS process delivers a secure, reprogrammable, single-chip solution with a low total cost of ownership. Architecturally, the ProASIC3L fabric combines fine-grained Versatile logic elements with embedded true dual-port SRAM blocks, supporting clock rates into the hundreds of MHz range per family data. Because configuration is flash-based, the bitstream is inherently more resistant to cloning than SRAM FPGAs, supporting secure ASIC-replacement designs. Typical applications include industrial control and automation, networking and communications line cards, avionics and defense systems requiring single-chip instant-on logic, and portable or power-sensitive equipment exploiting Flash*Freeze dynamic power savings. Design consideration: budget I/O bank assignments early - the PQ208 package exposes 147 of the device's user I/Os, so confirm pin availability against your full I/O list before layout. This page synthesizes distributor pricing, drop-in PQ208 alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE3000L-PQG208I - ProASIC3L Flash FPGA 3M Gates | Microchip
The Microchip Technology (Microsemi) A3PE3000L-PQG208I is a ProASIC3L low-power flash FPGA delivering 3,000,000 system gates, 516,096 bits of embedded flash memory, and 147 user I/Os in a 208-pin PQFP (BFQFP, 28x28 mm) surface-mount package. It operates from a 1.14 V to 1.575 V supply with a 1.2 V core voltage option and supports junction temperatures from -40C to +100C for industrial applications. A flash FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the A3PE3000L sits in the ProASIC3L family of flash FPGAs, under the broader FPGA and programmable logic device category, and functions as a single-chip system logic solution for power-sensitive designs. Key features include FlashFreeze technology, which dynamically cuts dynamic and static power with no external components and near-instant wake-up; a 1.2 V core option that yields roughly 40% dynamic and 50% static power savings versus the standard ProASIC3 at equivalent density; single-chip operation requiring no boot PROM; and reprogrammability with security features inherent to flash-based configuration. Maximum operating frequency reaches 781.25 MHz in high-speed I/O contexts per distributor data. The device is fabricated on a 130 nm flash process and uses a fine-grained architecture of Versatile logic elements organized into Versatile tiles, with embedded flash blocks (516 kbits) usable as dual-port SRAM or flash ROM. The low-power core variant and Power Driven Layout support in Libero SoC can deliver up to 30% additional power reduction over standard timing-driven place-and-route. Typical applications include industrial automation controllers, portable and battery-powered instrumentation, medical monitoring equipment, and secure communications interfaces - anywhere non-volatile, single-chip logic with low static power is required. Flash configuration also eliminates configuration data readout, improving design security against cloning. A key design consideration is thermal management: at 208-BFQFP with a plastic thermal-enhanced body, verify junction temperature stays below +100C at maximum switching activity, using ground-plane copper pour under the exposed die-attach area. Also budget the 1.14 V to 1.575 V supply window against the chosen core voltage setting. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet, based on data verified as of 2026-09-01.
A3PE600-1FG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
The Microchip Technology (Microsemi) A3PE600-1FG256 is a 600,000-system-gate ProASIC3E flash-based FPGA with 110592 bits of configuration capacity, up to 165 user I/Os in the 256-ball FBGA (FG256) package, fabricated on a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process with a 1.5V core supply and a maximum system frequency of 272 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family stores its configuration in on-chip flash, which means it is live-at-power-up (Level 0 support) and requires no external boot configuration device - a true single-chip solution within the broader hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor. Key features include flash-based nonvolatile configuration enabling instant-on operation, up to 504 kbits of true dual-port SRAM for on-chip buffering, optional soft ARM support via Cortex-M1 compatible fabric, and reprogrammability without a configuration PROM. The low total cost of ownership (TOC) results from the single-chip, no-boot-device architecture, and system performance reaches 272 MHz on the -1 speed grade. The architecture uses 130-nm flash-based CMOS with metal interconnect routing. Logic is implemented in VersTile-compatible fabric elements, and embedded true dual-port SRAM blocks support FIFOs and data buffering. Because configuration is stored in flash cells, security is inherently higher than SRAM FPGAs - there is no bitstream to intercept at power-up. Typical applications include industrial control and automation, communications and networking line cards, aerospace and defense systems requiring instant-on secure boot, and portable instrumentation where a single-chip FPGA reduces board area and BOM count. A key design consideration: the -1 speed grade limits maximum system frequency to 272 MHz, so verify timing closure with Libero SoC before committing; the FG256 package provides 165 I/Os, versus 616 I/Os max in larger family packages. This page synthesizes distributor pricing, drop-in same-package alternatives, pinout resources, and practical design notes not found in the manufacturer datasheet.
A3PE600-1FG256I - ProASIC3E FPGA 600K Gates 256-FBGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE600-1FG256I is a ProASIC3E family flash-based FPGA with 600K gates, up to 165 user I/Os, and a 272 MHz system performance, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA/256-LBGA) package for industrial temperature operation. A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory cells rather than the SRAM cells used by most Xilinx or Intel (Altera) devices. Within the programmable logic hierarchy, the A3PE600 sits as a low-density member of the ProASIC3E family, which itself belongs to the broader category of nonvolatile FPGAs and programmable system-on-chip devices. Key features include single-chip operation with no external configuration PROM, instant-on power-up, live reprogrammability, and 130nm flash process technology. The 1.5V core supply and low total cost of ownership (TOC) make it attractive for cost-sensitive designs. The FG256 package provides fine-pitch ball interconnect for compact surface-mount assemblies. Architecturally, the ProASIC3E fabric is built from VersaTiles - fine-grained logic tiles that implement both combinational and sequential functions - complemented by embedded memory and optional high-performance I/O banks. Flash switching technology eliminates configuration loading time and gives inherent resistance to configuration upset from radiation or power glitches, a key reason these parts are used in aerospace-adjacent and industrial applications. Typical applications include industrial automation controllers, communications line cards, test and measurement instrumentation, medical equipment, and glue-logic consolidation where instant-on behavior and single-chip BOM simplicity matter. For design, confirm the -1 speed grade timing against your timing closure targets in Libero SoC before committing, since the -2 grade offers faster performance at higher cost. Verify supported I/O standards for the FG256 package in the datasheet. This page synthesizes distributor pricing, drop-in alternatives, design notes, and sourcing context not found in the manufacturer datasheet alone.
A3PE600-1FG484 - ProASIC3E FPGA 600K Gates 484-BGA | Microchip
The Microchip Technology A3PE600-1FG484 (originally Microsemi) is a ProASIC3E flash-based FPGA with 600,000 system gates (approximately 56,000 equivalent system gates, 7K LUT-based logic elements), 270 user I/Os, and 110,592 bits of embedded RAM, housed in a 484-ball FBGA (23 x 23 mm, 1 mm pitch) package operating from a 1.5V core supply (1.425V to 1.575V) at a junction temperature of 0C to +85C. A flash-based FPGA stores its configuration in on-chip flash memory rather than SRAM, so it boots instantly at power-up without an external configuration PROM and is inherently single-chip. Within the programmable logic hierarchy, the A3PE600 belongs to the ProASIC3E family -> flash FPGA -> field-programmable gate array -> programmable logic device, built on a 130nm CMOS flash process. Key features include reprogrammable flash fabric with a maximum operating frequency of about 231-272 MHz depending on speed grade, LiveSequence/instant-on capability, optional soft ARM Cortex-M1 support, low total cost of ownership through elimination of configuration devices, and abundant user I/O for system integration. Technically, the ProASIC3E fabric uses a sea-of-gates architecture of versatile VersaNets and buffered routing, with embedded block RAM (4,608-bit blocks totaling 110,592 bits). The '-1' speed grade targets cost-optimized, moderate-frequency designs, while the FG484 footprint provides high I/O count for bus-width interfaces. 130nm flash cells retain configuration across power cycles, supporting secure, tamper-resistant designs without bitstream loading. Typical applications include industrial automation controllers, communication line cards and bridge logic, medical instrument control, and aerospace/defense systems needing instant-on and high design security. Design consideration: the part is RoHS non-compliant (lead-bearing balls), so it is restricted from new RoHS-mandated designs; use A3PE600-1FGG484 (green) instead. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-1FG484I - 600K-Gate Flash FPGA, 270 I/O | Microchip
The Microchip Technology (Microsemi) A3PE600-1FG484I is a 600,000-system-gate flash-based FPGA from the ProASIC3E family with 270 user I/Os and 13,824 logic cells, housed in a 484-ball FBGA package with 1.0 mm ball pitch (23 x 23 mm body). An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. The ProASIC3E family belongs to the nonvolatile flash FPGA class within the broader FPGA -> programmable logic -> digital IC hierarchy, meaning configuration data is stored on-chip in flash cells rather than an external configuration PROM. Key features include Live-at-Power-Up (Level 0) operation for single-chip solutions, true dual-port SRAM of up to 504 kbits across the family, and a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. The -1 speed grade supports system performance up to 231 MHz, and the industrial-grade -I suffix supports extended temperature operation for harsh environments. Architecturally, the A3PE600 uses VersaTiles - fine-grained logic modules that implement both combinational and sequential functions - plus embedded block RAM and flash-based switch routing that eliminates the configuration time and volatility of SRAM FPGAs. The E variant of ProASIC3 adds a higher effective system-gate density and abundant embedded memory versus base ProASIC3. Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace/defense systems requiring instant-on operation, and test equipment glue-logic consolidation. A key design consideration: the FBGA-484 footprint requires careful PCB escape routing at 1.0 mm pitch, and core supply (1.5 V) versus I/O bank supplies must be decoupled per the Microchip power guidelines in the manufacturer datasheet. This page synthesizes distributor pricing, drop-in same-footprint alternatives, practical design notes, and comparison data not consolidated in the manufacturer datasheet.
A3PE600-1FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
The Microchip Technology (formerly Microsemi) A3PE600-1FGG256 is a 600,000-system-gate ProASIC3E flash-based FPGA with approximately 7K logic elements, 165 user I/Os, and a 272 MHz system performance ceiling, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA-256) package with commercial 0 C to +70 C operating range and a 1.5V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Unlike SRAM-based FPGAs, the ProASIC3E family stores its configuration in on-chip flash, making it a single-chip, live-at-power-up solution that needs no external boot PROM and offers high resistance to configuration tampering. Key features include flash-based, reprogrammable fabric on a 130-nm, 7-layer-metal (6 copper) CMOS process, true dual-port SRAM of up to 504 kbits across the family, single-chip operation with Live-At-Power-Up Level 0 support, and a low total cost of ownership as an ASIC replacement. The -1 speed grade balances performance with power, and FG256/FG484 packages are footprint-compatible, easing future migration. The ProASIC3E architecture combines programmable logic tiles with embedded flash switching, delivering deterministic, instant-on behavior suited to glue logic consolidation, bus bridging, and secure control functions. Differential I/O support reduces single-ended I/O counts by two per pair when used. Typical applications include consumer electronics, networking and communications equipment, computing platforms, industrial control, and avionics subsystems, where its instant-on flash fabric and single-chip footprint simplify power sequencing and board design. A key design consideration: each differential pair consumes two single-ended I/Os, so budget I/O accordingly; voltage-referenced standards require one VREF pin per I/O minibank. This page synthesizes distributor availability data, same-package drop-in variants, and practical design notes not found in the manufacturer datasheet.
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
The Microchip Technology A3PE600-1FGG256I is a 600,000-system-gate flash-based FPGA from the ProASIC3E family with 165 user I/Os, 110592 bits of embedded true dual-port SRAM (504 kbits family maximum density block option), and a 1.5 V core supply, housed in a 256-ball LBGA (FBGA-256, 1.0 mm ball pitch) industrial-grade package rated for -40C to +100C junction temperature. A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory cells rather than volatile SRAM or an external configuration device. Within the programmable logic hierarchy, the A3PE600-1FGG256I sits as a mid-density member of the ProASIC3E flash FPGA family, below the A3PE1500 and A3PE3000, and belongs to the broader class of power management system components used for glue logic, control, and data-path integration. Key differentiating features include single-chip, Live-at-Power-Up (Level 0) operation enabled by the 130-nm, 7-layer metal (6 copper) flash-based CMOS process, which removes the external boot PROM required by SRAM FPGAs and improves system security. The ProASIC3E fabric delivers system performance up to 272 MHz, abundant embedded SRAM, and reprogrammability without a configuration controller. Architecturally, the device combines VersaTiles (fine-grained logic tiles) with embedded true dual-port SRAM blocks and a flexible I/O structure supporting multiple single-ended and differential standards. The FlashFreeze-style low-power characteristics of the flash fabric reduce static power compared with SRAM FPGA alternatives, and the 1.425 V to 1.575 V core supply range accommodates typical 1.5 V rail tolerance. Typical applications include industrial automation control, communications line-card glue logic, medical instrumentation data-path bridging, aerospace/defense secure single-chip designs, and test-and-measurement subsystems where instant-on operation is required. A key design consideration is supply sequencing: the 1.5 V core and I/O rails should ramp within datasheet limits, and BGA fanout on a 1.0 mm pitch requires via-in-pad or dog-bone escape routing on at least 6 signal layers. This page synthesizes distributor pricing tiers, drop-in same-family alternatives, design guidance, and comparison data not consolidated in the manufacturer datasheet.
A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
The Microchip Technology (Microsemi) A3PE600-1FGG484 is a 600,000-system-gate ProASIC3E flash-based FPGA with 13,824 configurable logic blocks (CLBs), 270 user I/Os in the 484-ball FBGA package, and 1.5V core supply, fabricated on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than SRAM. This places the ProASIC3E family in the power-management and system-logic hierarchy as a single-chip, live-at-power-up solution: no external configuration PROM or boot flash is required, and the fabric is functional immediately after power application (Level 0 support). This distinguishes flash FPGAs from SRAM FPGAs such as Xilinx Virtex or Altera Stratix families. Key features include 600K system gates, up to 504 kbits of true dual-port SRAM (110592 bits per DigiKey listing), reprogrammability without an external controller, and a low total cost of ownership through single-chip integration. The -1 speed grade supports system performance suited to glue logic, control, and data-path applications. Architecturally, the A3PE600 uses a sea-of-vanilla-physics fabric with flash switch elements, giving inherently low static power and instant-on behavior. The 484-FPBGA (23 x 23 mm, 1 mm pitch) package exposes 270 user I/Os with configurable standards, and supply operation over 1.425V to 1.575V per the Microchip USA product listing. Operating range is 0C to +85C (TJ) for the commercial -1 grade. Typical applications include industrial control and automation, aerospace and defense subsystems, communications line cards, test instrumentation, and secure single-chip designs where configuration readback attacks are a concern because the bitstream resides in flash, not external SRAM. Design consideration: budget the 1.5V core rail and I/O bank rails independently, and confirm the -1 speed grade meets timing closure in Microchip Libero SoC before committing layout, since the -2 grade offers higher performance in the same package footprint. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
A3PE600-1FGG484I - ProASIC3E 600K-Gate Flash FPGA | Microchip
The Microchip (Microsemi) A3PE600-1FGG484I is a 600,000-system-gate ProASIC3E flash-based FPGA with up to 272 MHz system performance, 270 user I/Os, and 110592 bits of embedded dual-port SRAM, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package operating over the industrial temperature range denoted by the I suffix. It is fabricated on a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process and runs from a 1.5V core supply. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external SRAM configuration device. Within the programmable logic hierarchy, the FPGA sits above CPLDs and below ASSPs/ASICs in integration, and the ProASIC3E family occupies the nonvolatile, single-chip segment of that hierarchy, meaning the device is live-at-power-up (Level 0 support) with no external boot PROM required. Key differentiating features include true single-chip operation, reprogrammability without a configuration flash, optional soft ARM support per the family datasheet, up to 504 kbits of true dual-port SRAM across the family, and low total cost of ownership due to the elimination of the configuration device. The ProASIC3E fabric delivers system performance in the 231-272 MHz class depending on speed grade. Technically, the A3PE600 is built from VersaTiles, Microchip's fine-grain flash-based logic element, with embedded memory blocks distributed across the fabric. The 1.5V core and 130-nm process yield a balance of static power and logic density suited to glue logic consolidation, bus bridging, and control-plane functions. Typical applications include industrial automation control, communications line-card bridging, medical instrumentation control logic, and aerospace/defense systems that benefit from nonvolatile, single-chip, secure configuration. Design consideration: the 484-FBGA requires attention to power-plane segmentation for 1.5V core versus I/O banks, and BGA rework constraints make speed-grade and temperature-grade selection important before layout. This page synthesizes distributor pricing, verified drop-in alternatives within the ProASIC3E family, and practical design notes not found in the manufacturer datasheet.
A3PE600-1PQG208 - ProASIC3E FPGA 600K Gates | Microsemi
The Microsemi (Microchip) A3PE600-1PQG208 is a ProASIC3E family Field Programmable Gate Array (FPGA) offering 600,000 system gates, 147 user programmable I/O pins, and 110,592 bits of total embedded RAM, housed in a 208-pin BFQFP (PQFP, 28x28 mm) surface-mount package operating from a 1.5V core supply. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that the designer configures after manufacturing. Within the programmable logic hierarchy, it sits between fixed-function ASICs and software-programmed microcontrollers, offering hardware parallelism with post-production reconfigurability. The ProASIC3E family extends the base ProASIC3 architecture with embedded flash configuration and enhanced memory resources, making it a single-chip, non-volatile solution that requires no external configuration PROM. Key features of the A3PE600-1PQG208 include 600K gates of flash-based fabric, 272 MHz system-level performance on 130 nm flash technology, a tight 1.425V to 1.575V core supply window, and 147 usable I/Os for wide-bus interfacing. Its single-chip, live-at-power-up behavior eliminates the boot delay and configuration-stream vulnerability of SRAM FPGAs, improving system security and reliability. Technically, ProASIC3E uses a proven flash switch architecture with VersaTiles as the fundamental logic element, delivering deterministic, ASIC-like timing behavior. The -1 speed grade defines the timing bin, and the 28x28 mm PQFP package provides robust leads suitable for industrial environments and board-level rework. Typical applications include industrial automation control, communications bridging and protocol conversion, medical instrumentation glue logic, and aerospace/defense systems where non-volatile, secure, rad-tolerant-by-technology FPGAs are preferred. Design consideration: ensure the 1.5V core rail stays within 1.425V-1.575V under worst-case load transients, and follow Microchip power-decoupling guidance with multiple bulk and 0.1uF ceramic capacitors around the 208-pin package. This page synthesizes verified distributor data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-1PQG208I - 600K-Gate ProASIC3E Flash FPGA | Microsemi
The Microsemi (Microchip) A3PE600-1PQG208I is a 600,000-gate ProASIC3E flash-based FPGA with 110,592 bits of embedded RAM, 147 user I/O pins, and 130nm flash technology, housed in a 208-pin PQFP (BFQFP, 28x28 mm) industrial package rated for -40C to +100C junction temperature. It operates from a 1.425V to 1.575V core supply at a 1.5V nominal level. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration device. Within the programmable logic hierarchy, the ProASIC3E sits in the mid-density segment of Microsemi/Microchip's FPGA portfolio, positioning it above the low-density ProASIC3 (A3P) parts and below the ProASIC3L and Fusion families. Because configuration data is non-volatile, the device powers up instantly without a bootloader FPGA or external flash, a key differentiator versus SRAM FPGAs from Xilinx and Intel/Altera. Key features include single-chip, secure, non-volatile operation; reprogrammability for in-field upgrades; low total cost of ownership by eliminating the external configuration IC; and system performance up to 272 MHz in the -1 speed grade. The ProASIC3E architecture adds embedded memory (110,592 bits) suitable for FIFOs and small buffers, and abundant user I/O (147 pins in this package) with flexible I/O standards. Architecturally, the device uses a sea-of-vanilla-gates fabric built on 130nm flash process technology, with Versatile routing and clock-conditioning resources. The ProASIC3E family is positioned by Microsemi as a cost-effective ASIC replacement for consumer, networking/communications, computing, and avionics markets, per the official ProASIC3E datasheet. Typical applications include industrial control and automation, communications line cards, avionics and secure systems (benefiting from flash security), and ASIC prototyping or low-volume ASIC replacement. Design consideration: power the 1.5V core from a regulator meeting the 1.425V-1.575V window, and verify I/O bank voltage assignments early, since the 208-PQFP has a fixed pinout that constrains banking. This page adds value beyond the datasheet by synthesizing distributor sourcing data, same-package drop-in alternatives, and comparison tables in one place.
A3PE600-2FG256 - 600K-Gate Flash FPGA, 165 I/O | Microchip
The Microchip Technology A3PE600-2FG256 is a ProASIC3E flash-based FPGA with 600,000 system gates, 13,824 logic elements, 165 user I/Os, and 110,592 bits of embedded true dual-port SRAM, housed in a 256-ball fine-pitch BGA (FBGA) package with 1.0 mm ball pitch. A field-programmable gate array (FPGA) is a semiconductor device that implements user-defined digital logic through configurable logic blocks, interconnect routing, and I/O cells programmed after manufacturing. The ProASIC3E family sits within Microchip's broader FPGA hierarchy, below the ProASIC3L and Igloo2 families, and is distinguished by its flash-based programming technology rather than SRAM. Key features include flash-based, nonvolatile configuration that provides live-at-power-up (Level 0) operation without an external configuration device, enabling true single-chip solutions. The 130-nm, 7-layer metal (6 copper) flash-based CMOS process delivers low total cost of ownership. The -2 speed grade supports system-level performance suitable for glue logic, control, and interface bridging functions, and the device is reprogrammable in-system. Technically, the ProASIC3E architecture uses VersaTiles as its universal logic element, with embedded block SRAM organized as true dual-port memory for FIFOs and buffering. On-chip flash switching and routing remove the need for boot PROMs, improving board reliability and startup time compared with SRAM FPGAs. Supply voltage is a 1.5 V core, with commercial operating temperature of 0C to +70C for this standard (non-I) variant. Typical applications include industrial control, communication line cards, test and measurement instrumentation, motor control interfaces, and secure single-chip logic replacement of ASICs and gate arrays in low-to-medium volume production. Design consideration: because configuration is nonvolatile flash, no configuration SPI flash is required, but I/O bank voltage rules and 1.0 mm pitch BGA routing (typically requiring a minimum 6-layer PCB) must be respected in layout. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-2FG256I - ProASIC3E FPGA 600K Gates | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE600-2FG256I is a 600,000-gate ProASIC3E flash-based FPGA with 165 user I/Os, a system performance of up to 310 MHz, and a 1.5V core voltage, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA/FPBGA) package qualified for the industrial temperature range of -40C to +85C. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that the designer configures after manufacturing. The ProASIC3E family sits within the broader hierarchy of programmable logic devices: FPGA -> flash-based FPGA -> single-chip, non-volatile FPGA. Unlike SRAM FPGAs, ProASIC3E devices store their configuration in on-chip flash, so they power up instantly, require no external configuration ROM, and offer higher resistance to configuration tampering. Key features include the third-generation VersaTile architecture, where each tile functions as a three-input LUT, a D-flip-flop, or a latch with enable, enabling highly efficient fabric utilization. The -2 speed grade balances performance and cost, supporting designs up to 310 MHz. The flash fabric also delivers low total cost of ownership through single-chip integration and reprogrammability. Built on a 130nm flash process, the device integrates embedded memory (110,592 bits per distributor listing as fabric RAM capacity) and supports the ProASIC3E I/O features for interfacing with common single-ended and differential standards. Microchip's Libero SoC design suite supports synthesis, place-and-route, and simulation for this family. Typical applications include industrial automation control, communications line-card glue logic and bridging, aerospace/defense systems favoring non-volatile instant-on FPGAs, and medical instrumentation where configuration flash simplifies the power-up sequence. A key design consideration: distributor data (chipdig) lists this exact speed-grade/temperature suffix as RoHS non-compliant and containing lead. Designers with RoHS mandates should verify the -FGG256 lead-bump variant before finalizing the BOM. This page synthesizes distributor pricing tiers, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-2FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
The Microchip (Microsemi) A3PE600-2FG484 is a 600,000-gate ProASIC3E flash-based FPGA with 13,824 logic cells, 270 user I/Os, 110592 bits of embedded RAM, a maximum system frequency of 310 MHz, and 1.5V core operation, housed in a 484-ball FBGA (PBGA) package with 1.00 mm ball pitch. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field, sitting above CPLDs in the programmable-logic hierarchy and below ASICs in density. The ProASIC3E family is distinctive because it uses flash technology rather than SRAM: configuration data is stored in on-chip flash cells, so the device is single-chip, instantly starts at power-up, and needs no external configuration PROM. Key features include the 130 nm flash-based CMOS process, 600K system gates, speed grade -2, and reprogrammability without a boot device, which lowers total cost of ownership (TOC). The embedded 110592-bit RAM supports FIFOs and dual-port buffering in data-path designs. Architecturally, ProASIC3E combines VersaTiles (fine-grained logic tiles), flash switches that are inherently non-volatile and radiation-tolerant versus SRAM alternatives, and embedded block RAM, delivering system performance up to 310 MHz on a 1.5V core. Typical applications include industrial automation control, communications and networking line cards, aerospace/defense systems, and medical instrumentation, where instant-on, secure, non-volatile configuration and high I/O count are decisive. Design consideration: the 1.5V core and 484-ball BGA demand careful power-plane design and controlled-impedance PCB stack-up; use Microchip Libero SoC for synthesis, place-and-route, and timing sign-off at the -2 speed grade. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-2FG484I - 600K-Gate Flash FPGA 484-BGA | Microchip
The Microchip Technology A3PE600-2FG484I is a ProASIC3E flash-based FPGA with 600,000 system gates, 13,824 configurable logic blocks (CLBs), and 270 user I/Os, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package and rated for the industrial temperature range (-40C to +100C). A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that the designer wires together after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family uses nonvolatile flash cells to store the configuration, so it powers up instantly as a single-chip solution with no external boot PROM and no configuration bitstream to load. Key features include flash-based, live-at-power-up operation, reprogrammability in-system, 1.5V core operation on a 130nm flash process, system performance up to 310 MHz, and low total cost of ownership thanks to the single-chip architecture. The -2 speed grade offers the fastest timing grades available in the ProASIC3E family, supporting high-throughput datapath and interface designs. Technically, the ProASIC3E fabric combines VersaTiles (fine-grained logic tiles) with embedded block SRAM, supporting synchronous FIFOs and dual-port memories. The flash switch architecture also gives inherently lower static power and better SEU robustness than SRAM FPGAs, which matters in industrial and communications equipment. Typical applications include industrial automation control, communications and networking line cards, medical instrumentation, aerospace/defense subsystems, and test equipment glue logic consolidation, where instant-on and high I/O count matter. A key design consideration is power delivery: the 1.5V core rail must be well decoupled, and I/O bank voltages (1.5V to 3.3V) must be planned per bank before pin assignment. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
A3PE600-2FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE600-2FGG256 is a ProASIC3E family flash-based FPGA with 600,000 system gates, a system frequency up to 310 MHz, and 165 user I/O, fabricated on a 130nm process with a 1.5V core and housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA/LBGA) package. A flash-based FPGA is a field programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are non-volatile and single-chip: they configure instantly at power-up, require no external boot PROM, and are inherently more secure because the bitstream never needs to be loaded externally. Within the programmable logic hierarchy, the A3PE600 sits at the low-to-mid density tier of the ProASIC3E family, below the A3PE1500 and A3PE3000. Key differentiating features include live reprogrammability via on-chip flash, low total cost of ownership through single-chip integration, abundant embedded memory, and support for industrial temperature operation in a compact 17 x 17 mm footprint class package. The speed grade -2 suffix denotes a standard performance bin within the family, supporting system clock rates up to 310 MHz for typical designs. Architecturally, the device is built from a sea of versatile logic elements organized into tiles, with flash switches providing the routing configuration. The ProASIC3E variant adds embedded SRAM blocks, supporting FIFOs and dual-port memories commonly required in data path and interface designs. CMOS flash technology also yields low static power compared to comparable SRAM FPGA architectures. Typical applications include industrial automation controllers, communications and networking interface bridging, test and measurement instrumentation, medical equipment, and aerospace/defense subsystems requiring secure, instant-on programmable logic. When designing with this device, plan power sequencing for the 1.5V core and 3.3V I/O banks, and verify I/O standards and bank assignment against the package pinout in the manufacturer datasheet before board layout. Pricing as of 2026-09-02 starts at approximately $40.70 at LCSC (qty 1). This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-2FGG484 - 600K Gate ProASIC3E FPGA 484-BGA | Microchip
The Microchip Technology (Microsemi) A3PE600-2FGG484 is a 600,000-gate ProASIC3E flash-based FPGA built on 130nm CMOS flash technology, offering 270 user I/Os, 110592 bits of configuration resources in a 484-ball Fine-Pitch Ball Grid Array (FBGA, 23x23 mm) package. It operates from a 1.5V core supply (1.425V to 1.575V) with a commercial temperature range of 0C to +85C junction temperature and a speed grade of -2 (up to 310 MHz system performance per distributor data). A flash-based FPGA (Field-Programmable Gate Array) is a reprogrammable logic device that stores its configuration in non-volatile on-chip flash memory rather than an external configuration PROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital IC -> semiconductor), ProASIC3E devices differ from SRAM FPGAs by being single-chip, instantly-on, and inherently secure, since no bitstream is exposed at power-up. Key features of the A3PE600 include non-volatile flash configuration (no external boot device required), 600K system gates, 270 versatile user I/Os supporting multiple single-ended and differential standards, embedded SRAM blocks for on-chip buffering, and low total cost of ownership through single-chip integration and reprogrammability. The 484-ball FBGA package supports surface-mount assembly with a 1.000 mm ball pitch. Technically, the A3PE600 uses Microsemi's proven flash switch and 130nm seven-layer metal flash CMOS process. The VersaTile architecture allows each logic tile to be configured as a 3-input LUT, D-flip-flop, or memory element, delivering high logic utilization. The ProASIC3E variant adds embedded SRAM and supports bus-friendly interfaces typical of bridge and control applications. Typical applications include industrial automation control, motor drive interface logic, communication bridge functions, aerospace sub-systems, test equipment, and secure single-chip control logic where instant-on behavior and configuration security matter. For design-in, ensure the 1.5V core rail is within 1.425V to 1.575V under all load transients, and follow Microchip's power-up sequencing and decoupling guidance in the manufacturer datasheet. This page synthesizes verified distributor data from DigiKey, Mouser, Octopart, and Microchip product pages with drop-in alternatives, comparison tables, and design notes not found in the manufacturer datasheet.
A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip
The Microchip Technology (Microsemi) A3PE600-2FGG484I is a 600,000-gate ProASIC3E flash-based FPGA with 13,824 configurable logic blocks (CLBs), up to 270 user I/Os, and a -2 speed grade, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA-484, 23 x 23 mm, 1.0 mm ball pitch) in an industrial temperature grade (-40C to +100C). A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than SRAM. This places the A3PE600 within the FPGA hierarchy of programmable logic devices, sitting above CPLDs in gate count and below high-end SRAM FPGAs, and contrasts with SRAM FPGAs by needing no external configuration PROM: the single-chip solution boots instantly at power-up, which also reduces total bill-of-materials cost and improves system security. Key features of the A3PE600-2FGG484I include non-volatile FlashX3 processing on a 130 nm CMOS process, single 1.5V core operation, system performance up to approximately 231 MHz, and optional soft ARM support per the ProASIC3E family datasheet. The ProASIC3E family adds embedded flash memory (up to 270 Kbit in this density class, 110592 bits cited by distributors) and supports low-cost ASIC replacement in single-chip designs with reprogrammability. Architecturally, the device uses the Actel/Microchip ProASIC3E sea-of-von Neumann fabric with versatile logic elements, embedded SRAM blocks, and flash configuration cells. The -2 speed grade denotes the fastest commercial binning for this density, and the FG484 package provides 1.0 mm pitch balls for surface-mount assembly. Typical applications include networking and communications line cards, avionics and industrial control logic integration, and consumer or computing systems seeking ASIC-like integration without NRE masks. Design consideration: flash FPGAs cannot be reconfigured as frequently in-circuit as SRAM FPGAs, so plan design iterations through the Libero SoC toolchain and JTAG programming accordingly. This page synthesizes distributor pricing context, same-brand drop-in package variants, and practical design notes not found in the manufacturer datasheet, with pricing references as of 2026-09-02.
A3PE600-2PQ208I - 600K-Gate ProASIC3E Flash FPGA | Microchip
The Microchip (formerly Microsemi) A3PE600-2PQ208I is a ProASIC3E flash-based FPGA delivering 600,000 system gates, 147 user I/O pins, and 110,592 bits of on-chip RAM in a 208-pin BFQFP (PQFP) surface-mount package, with industrial temperature range operation. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field. The A3PE600 belongs to the flash-based FPGA hierarchy: ProASIC3E family -> ProASIC3 generation -> flash FPGA -> programmable logic device. Unlike SRAM FPGAs, flash-based FPGAs retain their configuration in non-volatile memory, so they power up instantly and need no external configuration PROM. Key features include the unique VersaTile architecture, where each tile operates as a three-input LUT, a D-flip-flop, or a latch with enable, maximizing fabric utilization. The single-chip, non-volatile flash fabric eliminates configuration loads, reduces board cost (low TOC), and improves security because the bitstream is stored on-chip. Speed grade -2 supports system performance suitable for glue logic, bus bridging, and control applications, and the family supports optional soft ARM Cortex-M1 implementations per the ProASIC3E datasheet. Technically, the device is built on a 130 nm flash process with a 1.5V core supply. On-chip RAM blocks provide distributed and block storage, while abundant I/O banks support common single-ended standards for board-level interfacing. The 208-pin BFQFP provides a 0.5 mm pitch gull-wing footprint that is straightforward to inspect and rework. Typical applications include industrial automation control, aerospace and defense subsystems, medical instrumentation, communications bridging, and test equipment, where single-chip instant-on programmable logic is valued. Design consideration: budget the 1.5V core and 3.3V I/O rails with clean decoupling, and confirm the industrial -40C to +125C rating matches your thermal environment before finalizing the BOM. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-2PQG208 - ProASIC3E 600K Gate Flash FPGA | Microchip
The Microchip (Microsemi) A3PE600-2PQG208 is a ProASIC3E family flash-based Field Programmable Gate Array (FPGA) offering 600,000 gates, 110,592 bits of embedded RAM, 147 user I/O pins, and up to 310 MHz system performance in a 208-pin PQFP (BFQFP, 28x28 mm) package. A flash-based FPGA stores its configuration in on-chip flash memory rather than an external configuration PROM. Unlike SRAM FPGAs, this single-chip approach means the device is live at power-up, requires no external boot device, and is inherently more secure because the bitstream never leaves the package. Within the programmable logic hierarchy, the A3PE600 sits in the mid-density tier of the ProASIC3E family, which spans from low-density consumer devices up to 3M-gate avionics-grade parts, built on a 130 nm flash process with a 1.5 V core supply. Key features include a low total cost of ownership thanks to single-chip operation, reprogrammable flash fabric, support for 1.425V to 1.575V core supply, industrial-relevant performance of up to 310 MHz, and 147 programmable I/Os supporting common single-ended standards. The -2 speed grade balances performance and cost within the family, while the commercial temperature range of 0C to +85C suits controlled-environment systems. The ProASIC3E architecture combines VersTiles (logic modules), embedded flash, and distributed RAM to implement glue logic, bus bridging, state machines, and control-plane functions. Embedded 110,592 bits of RAM support FIFOs and small buffers in networking and communications designs. As a cost-effective ASIC replacement, the family is documented for consumer, networking/communications, computing, and avionics markets per the Microchip ProASIC3E datasheet. Typical applications include industrial control and automation, communications bridging, battery-powered and power-sensitive computing platforms, and single-chip ASIC-replacement designs where instant-on operation and configuration security matter. Design consideration: budget the 1.5V core rail (1.425V to 1.575V tolerance) carefully and follow Microchip power-supply decoupling guidance in the ProASIC3E handbook; the 208-pin PQFP requires careful signal-integrity practice for fast edge rates. This page synthesizes distributor availability, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.