FPGA & CPLD
Products (6352)
10AX090S3F45E2LG - Arria 10 GX FPGA 900K LE, 1932-FCBGA | Intel
The Intel (formerly Altera) 10AX090S3F45E2LG is an Arria 10 GX field-programmable gate array (FPGA) with 900,000 logic elements, 59,234,304 bits of embedded memory, and 624 high-speed transceivers, housed in a 1932-ball flip-chip BGA (FCBGA) package. Built on TSMC's 20nm process and operating from a nominal 0.9V core supply, this device targets mid-range, transceiver-rich applications including 10G/25G/40G networking, radar signal processing, and high-performance DSP pipelines. The 'S3' speed grade and 'F45' package code indicate a -2 commercial temperature grade in the 45mm flip-chip BGA option. What is an FPGA? A Field-Programmable Gate Array is a reconfigurable integrated circuit whose logic, interconnect, and I/O behavior are defined by user-supplied configuration bitstreams rather than fixed mask layers. FPGAs sit at the apex of programmable logic alongside CPLDs and are commonly used for ASIC prototyping, hardware-accelerated compute, communications baseband, and any application demanding parallel, deterministic latency. The Arria 10 family belongs to Intel's mid-range portfolio between Cyclone (low-power) and Stratix (high-performance). Key features of this device include up to 24.33 Gbps transceivers for high-speed serial links, integrated hard IP for PCIe Gen3, 10/25/40/100 Gigabit Ethernet, Interlaken, and CPRI, plus a hardened Floating-Point DSP block. The chip integrates a dual-core ARM Cortex-A9 hard processor subsystem variant in some Arria 10 SKUs, and provides advanced power management with smart voltage ID (SmartVID) to reduce dynamic power. Memory interfaces support DDR4 up to 2666 MT/s with physical layer hard controllers. Typical applications include wireless baseband processing, military radar arrays, medical imaging pipelines, broadcast video processing, high-end test and measurement equipment, and high-performance computing accelerators. In these systems, the 10AX090S3F45E2LG provides the parallel DSP throughput and transceiver bandwidth needed for real-time data movement and processing. The dense logic fabric also enables multi-protocol bridging on a single device. When designing with this part, thermal management is critical. The flip-chip BGA package typically dissipates 20-40W depending on utilization, so a multi-layer PCB with thermal vias and, often, a heatsink is required. Designers must use Quartus Prime design software (Standard or Pro edition) and follow Intel's pinout guidelines for power, ground, and high-speed transceiver routing. Use IBIS or HSPICE models for signal-integrity closure on memory and transceiver channels. This page synthesizes distributor pricing, drop-in same-family alternatives, and PCB-aware design notes that go beyond the manufacturer's datasheet block diagrams to help engineers move from concept to prototype quickly.
10AX090S3F45E2SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel / Altera
The Intel (formerly Altera) 10AX090S3F45E2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) delivering 900,000 logic elements, 59,234,304 bits of embedded memory, and 624 user I/O in a 1932-ball FCBGA package. It integrates up to 12.5 Gbps transceivers, a hard floating-point DSP block fabric, and a 20 nm process technology node optimized for mid-range ASIC-prototyping, broadcast, and wireline backhaul workloads. The "S3" speed grade and "F45" package code identify this specific Ordering Part Number (OPN). An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that lets engineers implement arbitrary digital logic through configurable logic blocks (CLBs), routing, and hardened I/O. FPGAs sit hierarchically between ASICs (application-specific, high-NRE) and microcontrollers (fixed-instruction), enabling low-volume customization, hardware acceleration, and rapid design iteration. The Arria 10 family is Intel's mid-range line, bridging the lower-cost Cyclone series and the high-end Stratix series, with balanced logic, DSP, and transceiver resources. Key features of the 10AX090S3F45E2SG include 12.5 Gbps GX transceivers, dedicated variable-precision DSP blocks with hardened IEEE 754 single-precision floating-point support, hard PCI Express Gen3 IP blocks, and a 28 Gbps-capable die architecture (limited by speed grade/package). The integrated Hard Memory Controller and partial reconfiguration support allow runtime logic swapping without system halt. Architecturally, Arria 10 FPGAs use a 20 nm TSMC process with a heterogeneous fabric mixing MLABs, LABs, DSP blocks, M20K SRAM blocks, and 12.5 Gbps transceivers. The "S3" speed grade balances timing margin and power, while the F45 package (45 mm flip-chip BGA) provides the thermal headroom and signal-integrity escape routing required for 624 user I/O and high-pin-count transceivers. Typical applications include 4K video processing and broadcast equipment, wireline 100G/400G backhaul, military radar signal processing, ASIC prototyping, and high-performance industrial imaging. The device's PCI Express Gen3 hard IP also makes it a strong fit for host-accelerator card designs in PCIe-form-factor servers. When designing with the 10AX090S3F45E2SG, allocate at least two PCB layers to power delivery and provide a thermal solution sized for the device's TDP (consult Quartus PowerPlay for accurate estimates). Quartus Prime Pro is the official design toolchain, and a license is required for full synthesis. This page synthesizes distributor pricing, OPN-level alternatives, and Quartus-aware design notes that are not collected in a single place in the Intel Arria 10 datasheet.
10AX090S3F45I2LG - Arria 10 GX 900K LE FPGA, 1932-FCBGA | Intel / Altera
The Intel / Altera 10AX090S3F45I2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) integrating 900,000 logic elements, 59,234,304 bits of embedded memory, and 624 user I/Os into a 1932-ball Flip-Chip BGA (FCBGA) package. It operates at the industrial -I2 speed grade and supports up to 24.0 Gbps transceivers, making it a true SoC FPGA for high-throughput wireline, broadcast, and defense signal-processing pipelines. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as DSP blocks, M20K memory blocks, and high-speed transceivers. Arria 10 devices sit in the mid-to-high-end of Intel's FPGA portfolio, between the lower-cost Cyclone series and the higher-end Stratix series, and are widely deployed in 4K video processing, 100G/400G bridging, radar, and 5G fronthaul where deterministic latency and DSP density matter more than absolute LUT count. Key features of 10AX090S3F45I2LG include the 20nm Tri-Gate process, partial reconfiguration support, hard PCI Express Gen3 x8 IP blocks, hard memory controllers for DDR4/LPDDR4 up to 2666 Mbps, and a hardened floating-point DSP architecture. The integrated transceivers reach up to 24.0 Gbps with adaptive equalization and PLL-based clock-data recovery, eliminating external SerDes ICs on most line cards. The device also ships with a hard Secure Device Manager for bitstream AES-256 encryption and anti-tamper features. Architecturally, Arria 10 GX combines a fabric of 16-bit adaptive logic modules (ALMs), 1,518 18x19 multipliers (or 759 hardened 27x27 multipliers), 1,830 M20K blocks, and 24 PCIe Gen3 lanes. The Core Fabric and Hard Memory Interface run at up to 600 MHz core speed while the transceivers run from a separate clock domain, enabling simultaneous data movement and computation without contention. Typical applications include 4K UHD broadcast video encoding/decoding, 100G Ethernet MAC bridging, software-defined radio (SDR) baseband processing, radar front-end preprocessing, high-performance medical imaging, and military/aerospace DSP subsystems. The -I2 industrial speed grade guarantees operation from -40C to +100C junction and is the preferred choice for ruggedized line-replaceable modules. When designing with the 10AX090S3F45I2LG, plan your power budget early: at full transceiver utilization the device can exceed 40W, requiring a 1932-FCBGA with exposed-die heatsink, multi-zone parallel VRMs, and high-layer-count PCB (>=16 layers) with low-Dk laminates. Use the Altera PowerPlay Early Power Estimator before board layout to size your VCORE, VCCR, VCCT rails correctly. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical PCB design guidance not found in the manufacturer datasheet alone.
10AX090S3F45I2SG - Arria 10 GX 900K LE FPGA | Intel | F45 FCBGA
The Intel (Altera) 10AX090S3F45I2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) with 900,000 logic elements, 59,234,304 embedded memory bits, and 624 user I/Os, fabricated on a 20nm process and housed in a 1932-ball Fine-pitch Chip-Scale BGA (FCBGA, F45) package. It operates from a 0.9V core supply with industrial temperature grade and speed grade I2. The device belongs to the Arria 10 GX family, which integrates up to 96 transceivers, hard PCIe Gen3 and Gen2 IP blocks, and a 1.5 GHz dual-core ARM Cortex-A9 hard processor subsystem option. What is an FPGA? A Field-Programmable Gate Array is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP slices, and hardened IP blocks such as transceivers and PCIe interfaces. FPGAs sit between general-purpose microcontrollers (fixed function) and ASICs (custom-silicon performance) in the broader semiconductor taxonomy: FPGA -> programmable logic -> programmable logic device -> logic IC -> integrated circuit. Arria 10 GX FPGAs specifically target mid-range, transceiver-rich applications where Stratix-class performance is not required. Key features of the 10AX090S3F45I2SG include up to 96 full-duplex backplane-capable transceivers with data rates up to 12.5 Gbps (chip-to-chip) and 10.3125 Gbps (backplane), hardened PCI Express Gen3 x8 IP blocks, two hard memory controllers supporting DDR4/DDR3/QDRIV/RLDRAM3, and a 1.6 Gbps LVDS serializer/deserializer interface. The device integrates variable-precision DSP blocks supporting IEEE 754 single-precision floating-point at up to 1.5 TFLOPs. The Arria 10 architecture combines a unified fabric with hard IP for transceivers, PCIe, memory controllers, and a hard processor subsystem, reducing power by up to 40% versus previous generations while delivering up to 2x the performance. The 20nm process enables high logic density and on-die memory capacity. Industrial temperature grade and the I2 speed grade make this OPN well-suited to harsh-environment applications. Typical applications include high-throughput wireless baseband processing, radar and electronic warfare beamforming, broadcast and professional video processing, medical imaging backplanes, and high-speed test and measurement equipment. The 624 user I/Os and 96 transceivers also suit 100G/40G line-card designs and PCI Express Gen3 accelerator cards. When designing with this device, allocate sufficient PCB layer count (typically 12-18 layers) for the 1932-ball F45 FCBGA escape routing, use Enpirion PowerSoC or discrete DrMOS power stages for the 0.9V core, and follow Intel's pin-out guidelines for transceiver reference clock and decoupling placement to meet jitter budgets. This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet.
10AX090S4F45E3LG - Arria 10 GX FPGA 900K LE, 1932-FCBGA | Altera
The Intel / Altera 10AX090S4F45E3LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) featuring 900,000 logic elements and 59,234,304 bits of embedded memory, packaged in a 1932-ball flip-chip BGA (FCBGA). It is the enhanced-speed-grade, industrial-temperature variant of the 10AX090 family with 28.05 Gbps transceiver support. What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as transceivers, DSP slices, and block RAM. FPGAs sit within the broader category of programmable logic devices (PLDs) and bridge the gap between general-purpose processors and application-specific integrated circuits (ASICs). The Arria 10 family targets mid-range, transceiver-rich applications requiring a balance of logic density, DSP performance, and power efficiency. Key features of the 10AX090 include up to 900,000 logic elements, 59,234,304 bits of embedded memory (approximately 7.4 Mbytes), up to 28.05 Gbps serial transceivers supporting protocols such as PCIe Gen3, 10GbE, and Interlaken, and dedicated variable-precision DSP blocks. The -3 speed grade (E3) denotes an enhanced timing closure device, and the LG suffix marks an industrial lead-free package without a heat spreader. Architecturally, Arria 10 GX is built on a 20 nm process combining a hardened ARM-less core fabric with hardened PCIe Gen3 and memory controller IP. This heterogeneous integration enables significantly lower power consumption than competing FPGAs at similar logic densities, while the transceiver tiles allow line-rate operation for high-speed serial links. Typical applications include high-speed data acquisition systems, 100G/400G network infrastructure, 4K/8K video broadcast equipment, military radar and electronic warfare signal processing, ASIC prototyping, and high-performance compute acceleration. The combination of high logic density and high-speed transceivers makes it well suited to multi-protocol bridging and DSP-intensive workloads. When designing with this device, allocate at least one month for Quartus Prime compilation at full utilization, and ensure PCB layout supports the 1 mm-pitch FCBGA with matched-length serial links and proper power-rail decoupling per the Arria 10 pin connection guidelines. This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 family, and practical design notes not found in the manufacturer datasheet.
10AX090S4F45I3LG - Arria 10 GX FPGA 900K LE | Intel
The Intel 10AX090S4F45I3LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) with 900,000 logic elements, 59,234,304 bits of embedded memory, and 624 user I/Os in a 1932-ball FCBGA package. It belongs to Intel's 20nm Arria 10 family and includes up to 24 transceivers at up to 17.4 Gbps, hardened floating-point DSP blocks, and a dual-core ARM Cortex-A9 hard processor subsystem option on related part numbers. The device operates across an industrial temperature range of -40C to +100C, making it suitable for harsh-environment deployments. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, hardened IP blocks, and I/O cells that engineers can reconfigure post-manufacturing to implement custom digital logic, signal processing pipelines, or interface bridges. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and discrete glue logic, and serve as the silicon platform of choice for high-throughput parallel processing, hardware-accelerated compute, and rapid prototyping. Arria 10 specifically targets mid-range applications that need higher logic density and transceiver performance than Cyclone V/10 devices but at lower power and cost than Stratix 10. Key differentiating features of the 10AX090S4F45I3LG include 24 high-speed transceivers supporting protocols such as PCIe Gen3 x8, 10G Ethernet, Interlaken, JESD204B, and CPRI, plus hardened floating-point DSP blocks capable of up to 1.5 TFLOPS per device for compute-intensive workloads. The 20nm process technology delivers improved performance-per-watt versus prior 28nm Arria V devices, and the integrated variable-precision DSP blocks support both fixed- and floating-point operations natively. Embedded memory of 59 Mbit is distributed across the fabric in M20K blocks plus 642-bit MLABs. The 10AX090S4F45I3LG is well suited to applications including 4K/8K video processing and broadcast equipment, wireless baseband processing in LTE/5G fronthaul, high-performance ASIC prototyping, military radar and electronic warfare signal chains, and test-and-measurement instrumentation. PCIe Gen3 hard IP blocks enable direct root-complex or endpoint integration without external bridge chips. The 17.4 Gbps transceivers also support 100G Ethernet MACs through aggregation. When designing with this device, plan PCB layout carefully around the 1932-ball FCBGA - it requires high-density board technology (microvia or HDI stack-up) and matched-length routing for transceiver channels. Use the Quartus Prime design suite for synthesis, place-and-route, and timing closure; the SoC variants additionally require an HPS toolchain. Thermal management is critical at full transceiver utilization - plan for at least 15-20W of dissipation with a heatsink or thermal interface material in industrial airflow. This page synthesizes distributor pricing, same-family Arria 10 drop-in alternatives from the Site MPN list, and practical design considerations not consolidated on the manufacturer datasheet - including BGA escape routing density, transceiver channel placement, and Quartus Prime device-selection guidance.
10AX090S4F45I3SG - Arria 10 GX FPGA 900K LE, 1932-FCBGA
The Intel (Altera) 10AX090S4F45I3SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) delivering 900,000 logic elements, 59,234,304 bits of embedded memory, and 624 maximum user I/Os in a 1932-ball FCBGA package. Built on TSMC's 20nm process, this device targets mid- to high-end FPGA applications requiring high transponder density, substantial on-chip memory, and integrated transceivers for protocols such as PCIe Gen3, 10G Ethernet, and CPRI. An FPGA (Field Programmable Gate Array) is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Unlike fixed-function ASICs, FPGAs can be reconfigured post-manufacture to implement arbitrary digital logic, DSP functions, or memory interfaces. Arria 10 devices occupy the mid-range position in Intel's FPGA portfolio - above Cyclone V/10 and below Stratix 10 - delivering a balance of performance, power efficiency (~20W-40W typical), and cost for bandwidth-intensive applications. Key features of the 10AX090S4F45I3SG include the integrated Hard Processor System (HPS) option, hardened memory controllers supporting DDR4/DDR3/QDR-IV, and the Adaptive Logic Module (ALM) architecture. The -I3 speed grade combined with industrial temperature range (-40C to +100C) makes it suitable for harsh-environment deployments including industrial automation, military/aerospace prototypes, and outdoor wireless infrastructure. Architecture-wise, the Arria 10 family uses a monolithic die with 20nm Tri-Gate transistors, providing roughly 2x the density and 40% lower power versus the prior 28nm Arria V generation. The transceiver blocks support data rates from 1.5 Gbps up to 12.5 Gbps with internal PCS hardening for PCIe, Ethernet, and CPRI/OBSAI. Partial reconfiguration is supported, allowing live logic swapping in operational systems. Typical applications include wireless baseband processing, military secure communications, high-performance computing acceleration, video broadcast infrastructure, and 10G/40G Ethernet network interface cards. The integrated transceivers and substantial logic capacity make it a strong fit for systems where multiple parallel high-speed links must be aggregated alongside significant DSP or packet processing workloads. When designing with the 10AX090S4F45I3SG, careful attention must be paid to PCB layout for the 1932-ball FCBGA package. Ball pitch is 1.0mm with the F45 (45mm) body, requiring microvia or laser-drilled HDI stackups. Power delivery requires a multi-rail solution (typically 0.9V core, 1.2V/1.5V/2.5V/3.3V I/O) with high-frequency decoupling placed immediately adjacent to the BGA balls. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, pin-compatible Arria 10 drop-in variants, and practical design notes not consolidated on a single manufacturer page.
10AX090U1F45E1SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
The Intel 10AX090U1F45E1SG is an Arria 10 GX Field Programmable Gate Array (FPGA) delivering approximately 900,000 logic elements and 59,234,304 bits of embedded memory in a 1932-ball FCBGA package, built on TSMC's 20 nm process. The device integrates up to 48 fractional PLLs, 48 transceiver channels, and 480 user I/O pins, balancing high logic capacity with embedded transceiver bandwidth for mid-to-high throughput designs. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital circuits via a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy - alongside CPLDs - within the broader semiconductor taxonomy, often paired with external memory ICs, clock & timing devices, and high-speed interface ICs to form complete digital signal-processing subsystems. Key features include 480 user I/O pins, 24 transceiver channels (10.3125 Gbps), hard memory controllers, and PCIe Gen3 x8 hard IP blocks. The 0.9 V core VCC and -E1 (fastest) speed grade deliver high Fmax on DSP-intensive paths. 48 fractional PLLs and 48 global clock networks support fine-grained multi-domain clocking. Architecturally, the Arria 10 family uses a 20 nm fabric with hardened variable-precision DSP blocks (up to 1,518 18x19 multipliers), embedded 20 Mbit memory blocks, and a Hard Processor Subsystem-free architecture focused on parallel data-plane acceleration. Hardened PCIe Gen3 and 10 Gbps transceivers offload high-speed serial I/O from soft logic, freeing fabric resources for application logic. Typical applications include 100 Gbps network interface cards, high-performance digital signal processing, 4K/8K video broadcast equipment, ASIC prototyping, and wireless baseband processing. Engineers select this device when design entry complexity exceeds CPLD capacity but production volumes do not yet justify an ASIC. Design considerations include power budget planning (use the Arria 10 PowerPlay early estimator), proper decoupling of the 0.9 V core supply, and PCB layer stack-up to maintain signal-integrity on multi-GHz SERDES lanes. Thermal management is critical above ~25 W board dissipation. This page synthesizes distributor pricing, parameter comparison with Arria 10 and Arria V/GX variants, drop-in pin-compatible alternatives, and practical design notes not consolidated in the official Altera datasheet - giving procurement and hardware teams a one-stop reference for sourcing decisions.
10AX090U1F45I1SG - Arria 10 GX FPGA 900K LE 1932-FCBGA | Intel
The Intel (formerly Altera) 10AX090U1F45I1SG is a high-density Arria 10 GX field-programmable gate array (FPGA) delivering 900,000 logic elements and 47.32 Mbit of embedded memory in a 1932-ball fine-pitch BGA package, with industrial temperature grading. The part integrates 339,620 adaptive logic modules (ALMs), 480 user I/O pins, and a high-performance serial transceiver fabric typical of the Arria 10 GX family, all operating from sub-1V core supplies with auxiliary PLL and DSP blocks. An FPGA (field-programmable gate array) is a class of programmable logic device (PLD) within the broader semiconductor hierarchy (FPGA -> PLD -> programmable logic -> integrated circuit) that combines configurable logic blocks, routing interconnect, programmable I/O, and dedicated hard IP such as transceivers, DSP blocks, and memory controllers. Unlike ASICs, FPGAs can be reconfigured after manufacture, enabling rapid prototyping, design iteration, and field upgradability for applications where time-to-market and design flexibility outweigh per-unit cost optimization. Key features of the 10AX090U1F45I1SG include 28.05 Gbps-capable transceiver channels, hardened PCI Express Gen3 and Gen2 IP blocks, variable-precision DSP blocks for high-rate signal processing, dual ARM Cortex-A9 hard processor subsystem availability in select Arria 10 SoC variants, and industrial-grade temperature operation supporting -40C to +100C ambient. The 1932-ball FCBGA package uses a fine-pitch land-grid array optimized for high-speed signal integrity and multi-layer PCB routing. Architecturally, the Arria 10 GX employs Intel's 20 nm process with a 14.3 Gbps backplane-capable transceiver core, achieving significant power reduction versus prior Arria V generation while doubling logic density per watt. The part supports partial reconfiguration, hot-socketing, and bitstream encryption for secure in-field updates, with JTAG and passive/active serial configuration interfaces. Typical applications for the 10AX090U1F45I1SG span 100G/400G data center line cards, military radar and electronic warfare DSP front-ends, professional broadcast video processing, 5G baseband and fronthaul, and high-channel-count medical imaging systems. Its balance of high logic density, hardened transceiver IP, and large embedded memory suits applications where engineers need high throughput without the design risk and NRE cost of an equivalent ASIC. When designing with this 1932-BGA part, allocate adequate PCB layer count (typically 12+ layers) to maintain signal integrity on the transceiver channels; pair the FPGA with a matched-impedance DDR3/DDR4 memory topology, and provision a robust multi-rail power sequencing network with monotonic cold-start behavior. Use Intel's Quartus Prime design suite for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting faster sourcing and engineering decisions.
10AX090U2F45E1SG - Arria 10 GX 900K LE FPGA | Intel | 1932-FCBGA
The Intel 10AX090U2F45E1SG is a high-performance Arria 10 GX Field Programmable Gate Array from Intel's 20nm process family, delivering 900,000 logic elements, 59,234,304 bits of embedded memory, and 480 user I/O pins in a 1932-ball FCBGA package. The device integrates up to 24.0 Gbps transceivers and a hard floating-point DSP block architecture, targeting mid-to-high-end bandwidth applications including 4K video processing, wireless infrastructure, and high-performance compute. What is an Arria 10 GX FPGA? The Arria 10 GX family sits in Intel's mid-range FPGA portfolio between the lower-cost Cyclone/MAX series and the high-end Stratix family, optimized for transceiver-rich applications requiring a balance of logic density, DSP performance, and power efficiency. Arria 10 devices use a 20nm process and introduce features such as hardened floating-point DSP blocks, variable-precision DSP, and partial reconfiguration, making them suitable for DSP-intensive workloads. In the broader taxonomy: FPGA -> programmable logic device -> integrated circuit -> semiconductor. Key features of the 10AX090U2F45E1SG include 900K logic elements, 3,378 DSP blocks (typical for this density), 28.05 Mbit embedded memory, 24 transceiver channels with data rates up to 17.4 Gbps (chip-to-chip), 0.9V core voltage, and integrated PCI Express hard IP blocks. The F45 package designation indicates a 45x45 mm body with 1932 balls in an FCBGA (Flip-Chip Ball Grid Array) configuration supporting industrial-grade thermal envelopes. The architecture combines a heterogeneous fabric of adaptive logic modules (ALMs), M20K memory blocks, and DSP blocks with a serial transceiver subsystem hardened for backplane and chip-to-chip interconnect. The mid-range Arria 10 GX balances cost-per-logic-element with high-speed serial I/O, making it competitive with Xilinx Kintex-7/Kintex UltraScale for many mid-tier designs. Typical applications include 4K video broadcasting equipment, LTE/5G baseband processing, software-defined radio, military radar preprocessing, ASIC prototyping, medical imaging acceleration, and high-speed data acquisition systems. Industrial temperature grading and built-in PCIe Gen3 hard IP further suit it for embedded compute and test-and-measurement backplanes. When designing with this device, ensure the PCB has matched-length routing for the high-speed transceivers and a sufficient number of decoupling capacitors around the 0.9V core and 1.8V/2.5V/3.3V auxiliary rails. Thermal design must account for the FCBGA's high junction-to-ambient resistance; a heatsink is typically required for sustained operation. Intel's Quartus Prime software is required for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-family alternatives from the Arria 10 lineup, and practical PCB/thermal guidance beyond what the manufacturer datasheet alone provides for sourcing decisions.
10AX090U2F45E2LG - Arria 10 GX 900K LE FPGA | Intel | 1932-FCBGA
The Intel 10AX090U2F45E2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) with 900,000 logic elements, 59,234,304 embedded memory bits, and 480 user I/O pins, housed in a 1932-ball FCBGA package. It is fabricated on a 20nm process, operates at a 0.9V core supply, and supports transceiver rates suitable for high-bandwidth data path applications. A Field Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. FPGAs occupy the performance-and-flexibility tier between general-purpose microcontrollers and application-specific integrated circuits (ASICs), making them ideal for prototyping, low-volume production, and workloads requiring hardware-accelerated parallelism. The Arria 10 GX family is positioned in Intel's mid-range portfolio between Cyclone and Stratix devices, targeting transceiver-rich designs at lower power than equivalent Stratix 10 parts. Key specifications include 900,000 logic elements, 59,234,304 bits of embedded memory, 480 user I/Os, transceivers up to 14.1 Gbps, and 20nm process technology. The -2 speed grade balances timing margin and Fmax, while the E2 extended temperature range spans 0C to 100C case temperature. The LG suffix indicates a lead-free, RoHS-compliant 1932-ball FCBGA package. Architecturally, the device integrates hardened PCI Express Gen3 controllers, Gen2 hard memory controllers, partial reconfiguration support, and up to 96 transceiver channels. The transceiver fabric supports protocols including 10GbE, 40GbE, Interlaken, JESD204B, and CPRI, enabling single-chip implementation of wired communications, wireless baseband, and broadcast video pipelines. Typical applications include high-throughput data acquisition systems, 4K video processing and broadcast, wireless baseband and remote radio heads, defense radar and signal intelligence, medical imaging accelerators, and ASIC prototyping. The combination of high logic density and embedded transceivers makes it well suited for systems that require parallel DSP combined with multi-gigabit serial I/O. When designing with this part, allocate at least one full transceiver bank reference clock per quad, follow Intel's power-rail sequencing guidelines for the 0.9V core and 1.8V/2.5V/3.0V auxiliary rails, and respect the 1932-ball FCBGA PCB layout rules including microvia stackup, length-matched differential pairs, and thermal-via arrays under the lid for heat dissipation.
10AX090U2F45E2SG - Arria 10 GX FPGA 900K LE 1932-FCBGA | Intel
The Intel 10AX090U2F45E2SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) delivering approximately 900,000 logic elements, 59,234,304 bits of embedded memory, and 480 user I/O in a 1932-ball FC-FBGA package. It belongs to the 10AX090 logic-density tier of the Arria 10 family, manufactured on Intel's 20nm process, and is offered in the -E2 speed grade with industrial-grade temperature screening. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O cells can be configured after manufacture to implement arbitrary digital circuits, DSP pipelines, memory controllers, and high-speed serial interfaces. Within Intel's product hierarchy, the Arria 10 family sits in the mid-range transceiver-rich segment, between the lower-power Cyclone series and the high-end Stratix family, targeting applications that combine DSP throughput, high-speed transceivers, and moderate power budgets. Key features of the 10AX090U2F45E2SG include the Arria 10 adaptive logic module (ALM) fabric, on-chip variable-precision DSP blocks, embedded 20nm SRAM blocks supporting single-port, dual-port, and FIFO configurations, and dedicated high-speed serial transceivers. The 1932-ball FC-FBGA package provides a high pin-count matrix suitable for high-bandwidth memory interfaces and multi-gigabit transceiver I/O, while the 0.9V core voltage aligns with the Arria 10 family's power architecture. Architecturally, the Arria 10 device integrates hard IP for PCI Express Gen3, 10GbE and 40GbE MACs, external memory interfaces (DDR4, DDR3, QDR II+, RLDRAM III), and a high-performance core fabric with redundant logic for SEU mitigation. The E2 speed grade offers a balance between timing margin and power consumption suitable for production deployments. Typical applications include wireless baseband processing, radar signal processing, military and aerospace secure communications, medical imaging accelerators, broadcast video processing, high-performance computing (HPC) coprocessors, and test-and-measurement ASIC prototyping where the high logic density and integrated transceivers reduce external component count. When designing with the 10AX090U2F45E2SG, careful attention must be paid to PCB stack-up, power-rail sequencing, and thermal management. The FC-FBGA package requires microvia stack-up, and the high-density transceiver count demands controlled impedance routing. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in Arria 10 family alternatives, and practical design notes not found in the manufacturer datasheet alone.
10AX090U2F45I1SG - Arria 10 GX FPGA, 900K LE, FCBGA-1932 | Intel
The Intel 10AX090U2F45I1SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) with 900,000 logic elements, 59,234,304 bits of embedded memory, and 480 user I/Os, housed in a 1932-ball Flip-Chip BGA (FCBGA) package. It is fabricated on Intel's 20nm Tri-Gate process and targets mid-range applications requiring both high logic capacity and integrated transceivers. What is a high-end FPGA? A Field-Programmable Gate Array is a programmable logic device containing configurable logic blocks (LBs), programmable interconnect, embedded memory blocks, DSP blocks, and high-speed transceivers. The Arria 10 family sits between Intel's lower-cost Cyclone and high-end Stratix families, balancing performance, power, and cost. Arria 10 devices are part of the broader hierarchy: FPGA -> programmable logic -> digital integrated circuit -> semiconductor. Arria 10 GX specifically targets applications needing integrated 10 Gbps+ transceivers, hard memory controllers, and PCI Express Gen3 hard IP blocks. Key features of the 10AX090U2F45I1SG include 900K logic elements (LEs), 59,234,304 bits of embedded block RAM (e.g., M20K blocks), variable-precision DSP blocks, 24 backplane-capable transceivers supporting data rates up to 12.5 Gbps (per Arria 10 family datasheet), hard PCI Express Gen3 x8 IP blocks, and 12.5 Gbps transceivers supporting protocols such as 10GbE, Interlaken, and CPRI. The I1 temperature grade designates the industrial operating range from -40C to +100C junction, making the part suitable for industrial and ruggedized environments. The U2 speed grade indicates a mid-tier performance bin, the F45 suffix denotes the 45mm x 45mm FCBGA package with 1932 balls, the I grade indicates industrial temperature, 1 corresponds to the specific transceiver/feature combination, and SG indicates the standard lead-free / RoHS-compliant packaging. The combination delivers a balance of high logic density, transceiver count, and thermal envelope. Typical applications include 10G/40G Ethernet aggregation switches, radar signal processing for defense, medical imaging systems, test and measurement equipment, broadcast video processing, and protocol bridging ASICs. The hard PCIe Gen3 and high-speed transceivers make it well-suited for accelerator cards and high-throughput data acquisition backplanes. When designing with this part, allocate adequate PCB layer count for the 1932-ball FCBGA breakout, follow Intel's Arria 10 pin connection guidelines for unused transceivers, and ensure robust power delivery for the core and transceiver rails. Quartus Prime design software is required for synthesis, place-and-route, and configuration bitstream generation. This page synthesizes distributor pricing, family-level drop-in variants, design considerations, and application guidance not consolidated on any single distributor page, giving engineers a faster sourcing and selection decision.
10AX090U2F45I2LG - Arria 10 GX 900K LE FPGA | Intel / Altera
The Intel / Altera (formerly Altera) 10AX090U2F45I2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) delivering approximately 900,000 logic elements in a 1932-ball flip-chip BGA (FCBGA) package at industrial temperature grade (-40C to +100C). It pairs 59,234,304 bits of embedded memory with 480 user I/O pins and integrates up to 24 high-speed transceiver channels, positioning the device as a mid-to-high-range transceiver-rich FPGA for midrange applications. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect fabric that an engineer can configure after manufacture using a hardware description language (HDL). The Arria 10 family specifically targets mid-range transceiver applications, balancing logic density, memory, transceivers, and I/O for power-aware designs; it sits below the high-end Stratix 10 family and above the lower-cost Cyclone 10 family in the Intel FPGA portfolio. Key features of the 10AX090U2F45I2LG include 28nm process technology, a high-performance adaptive logic module (ALM) fabric, embedded hard IP for memory controllers and PCIe Gen3, and hard floating-point DSP blocks. The 1932-ball FCBGA package supports very high I/O count and multi-channel transceiver operation, while the F45 speed grade balances performance and power. Architecturally, the device combines a fine-grained ALM fabric with hard PCIe Gen3 IP, hard memory controllers, and hardened floating-point DSP, enabling systems to offload compute-intensive functions without soft IP overhead. The industrial temperature grade and the high transceiver count make it well suited to communications infrastructure, broadcast video, and test equipment. Typical applications include wireless baseband processing, 100G/400G networking line cards, broadcast video processing, ASIC prototyping, medical imaging, and high-performance industrial test equipment. When designing with the 10AX090U2F45I2LG, plan thermal management for the 1932-ball FCBGA: top-side heatsink, high-CTR PCB stack-up, and proper via arrays under the thermal balls are required for sustained high utilization. Quartus Prime Pro is the recommended design toolchain. This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 family, and practical design notes that are not consolidated in the manufacturer datasheet alone.
10AX090U2F45I2SG - Arria 10 GX FPGA 900K LE FCBGA-1932 | Intel
The Intel (formerly Altera) 10AX090U2F45I2SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) with 900,000 logic elements, 59,234,304 bits of embedded memory, and 480 user I/O pins in a 1932-ball FCBGA package. It is built on Intel's 20nm process, integrates up to 1.5 GHz ARM Cortex-A9 hard processor subsystem support via soft IP, and includes 24 transceivers at up to 14.1 Gbps for high-bandwidth serial I/O. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that lets designers configure billions of digital logic blocks, on-chip memory, DSP blocks, and high-speed transceivers after manufacture. FPGAs sit at the same hierarchy level as ASICs but offer reconfigurability: they belong to the family of programmable logic -> digital ICs -> integrated circuits -> semiconductors. Arria 10 GX devices in particular target mid-range applications requiring a balance of logic density, transceiver bandwidth, and lower power than high-end Stratix 10 parts. Key features include 24 backplane-capable transceivers (up to 14.1 Gbps), hard PCIe Gen3 x8 IP blocks, hard memory controllers for DDR4/DDR3/QDR IV, 3,377 18x19 multipliers for DSP, and fractional synthesis PLLs. The device supports partial reconfiguration and a secure configuration scheme via AES-256 bitstream encryption. Core voltage is 0.9V with separate PLL, transceiver, and auxiliary rails. The architecture combines a fabric of adaptive logic modules (ALMs), M20K embedded SRAM blocks, and variable-precision DSP blocks. The 20nm process enables higher logic density and lower static power vs prior 28nm Arria V parts. Hard IP blocks for PCIe, memory interfaces, and transceivers free up fabric for application logic, raising effective DSP throughput. Typical applications include 100G/400G optical line cards, wireless LTE baseband processing, military secure radios, broadcast video processing, ASIC prototyping, and high-performance computing accelerators. The 14.1 Gbps transceivers make it well suited for OTU4, 100GbE, and JESD204B/C data converter interfaces. Design considerations include power delivery for the 0.9V core rail (peak > 30A on dense designs), thermal management via the FCBGA heat-spreader lid, and PCB layout rules for 14 Gbps serial links. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure. This page synthesizes current distributor stock, parametric alternatives within the same Arria 10 GX family, and design notes not typically included on distributor datasheet summaries.
10AX090U3F45E2LG - Arria 10 GX 900K LE FPGA 1932-FCBGA | Intel
The Intel 10AX090U3F45E2LG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) from Intel's programmable solutions group, delivering 900,000 logic elements in a 1932-ball FCBGA package. It integrates 480 transceiver macro channels and 59,234,304 bits of embedded memory (approximately 7.4 Mbits), targeting mid- to high-end applications requiring both high logic capacity and high-speed serial I/O. The Arria 10 GX family is built on TSMC's 20nm process with a heterogeneous architecture that combines ARM Cortex-A9 hard processor system cores with hardened floating-point DSP blocks and variable-precision DSP support. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, interconnect, and I/O can be reconfigured after manufacturing by loading a user-defined bitstream. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic ICs -> integrated circuits -> semiconductors, and are differentiated from CPLDs (lower density, non-volatile) and ASICs (fixed function). The Arria 10 family targets applications that need ASIC-class performance-per-watt with FPGA flexibility, bridging between the lower-cost Cyclone series and the high-end Stratix series. Key features of the 10AX090U3F45E2LG include up to 28.05 Gbps backplane-capable transceivers, hardened PCI Express Gen3 x8 controllers, hardened 10 GbE and 100 GbE MACs, partial reconfiguration support, and advanced DSP blocks optimized for wireless baseband and video processing. The device also integrates high-speed external memory interfaces supporting DDR4, DDR3, QDR IV, and RLDRAM 3 with hardened PHY, enabling high-bandwidth data buffering without consuming FPGA fabric resources. Typical applications for this part span 4K/8K video broadcast equipment, 100G optical transport network line cards, LTE and 5G baseband processing, military radar signal processing, medical imaging accelerators, and high-performance computing (HPC) prototyping. The 1932-ball FCBGA package provides the high pin density required for hundreds of serial links and parallel memory interfaces while supporting the thermal envelope necessary for sustained operation at high toggle rates. When designing with this device, pay particular attention to PCB stackup and signal integrity at the BGA breakout - the FCBGA's 1.0 mm pitch (typical for this class) requires laser-drilled or sequential-lamination microvia HDI stackups. Power delivery must use a high-density core rail with hundreds of decoupling capacitors and a high-efficiency PoL converter stage capable of delivering the device's high transient current. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure.
10AX090U3F45E2SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
The Intel (formerly Altera) 10AX090U3F45E2SG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) from Intel's 20nm Arria 10 family, integrating 900,000 logic elements, 59,234,304 bits of embedded memory, and 480 user I/O in a 1932-ball FCBGA package with industrial temperature grade. The device targets mid-range transceiver-based applications requiring up to 28.05 Gbps transceivers, hardened floating-point DSP blocks, and a hard memory controller subsystem, all on a single monolithic die. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic functionality is defined after manufacturing by a hardware description language (HDL) bitstream. Arria 10 GX sits in the mid-range of Intel's FPGA portfolio: below Stratix 10 (high-end) and above Cyclone 10 (low-power), optimized for transceiver-rich applications such as 4K video processing, wireless baseband, and defense signal intelligence. Arria 10 is built on TSMC's 20nm process and uniquely combines ARM Cortex-A9 hard processor system options with traditional FPGA fabric, hardening common functions to reduce power and logic-element usage. Key specifications of the 10AX090U3F45E2SG include 900K logic elements (LEs), 59,234,304 bits of M20K block RAM (approximately 3,488 M20K blocks), 1,560 DSP blocks for fixed- and floating-point signal processing, and up to 28.05 Gbps backplane-capable transceivers. The 'U3' speed grade indicates an extended industrial speed bin, while 'F45' denotes the 1932-ball FCBGA package with 1.0 mm ball pitch designed for high-pin-count board designs. The 'E2' suffix places the part in the -40C to +100C extended industrial operating range. Architecturally, Arria 10 GX uses a heterogeneous fabric: 20nm logic tiles, 28.05 Gbps transceivers with hardened PCIe Gen3 and 10GbE MACs, partial reconfiguration support, and up to 17.4 Gbps external memory interfaces for DDR4 with ECC. Power is managed through the SmartVID voltage regulator interface, allowing dynamic voltage scaling between 0.85V and 0.95V core. The fabric includes embedded SECDED on all block RAM, configuration RAM, and memory interfaces for high-reliability operation. Typical applications for the 10AX090U3F45E2SG include 4K/UHD video broadcast infrastructure, 100G/400G networking line cards, radar and electronic-warfare DSP front-ends, medical imaging accelerators, and high-end test-and-measurement equipment. The combination of 28G transceivers, floating-point DSP, and substantial on-chip memory makes it a fit for signal-processing pipelines that would otherwise require an ASIC. Lower-density Arria 10 variants or Cyclone 10 parts are preferred for cost-sensitive designs without high-speed serial I/O. When designing with this FPGA, ensure the PCB supports 1.0 mm BGA fanout with appropriate via-in-pad or microvia technology for high-yield assembly. The FPGA configuration scheme (typically Active Serial x4 or JTAG) and external DDR4 memory topology should be planned early, as mid-board layout changes to a 1932-ball BGA are extremely costly. Power-rail sequencing must respect the SmartVID controller's I2C interface and the 0.85V-0.95V core tolerance. This page synthesizes distributor pricing, drop-in speed-grade and package variants, and practical design notes that supplement the manufacturer datasheet for engineering, sourcing, and BOM decisions.
10AX090U3F45I2LG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
The Intel (formerly Altera) 10AX090U3F45I2LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) integrating 900,000 logic elements, 59,234,304 bits of embedded memory, and 480 user I/Os in a 1932-ball FCBGA package, fabricated on a 20 nm process node. It belongs to the GX transceiver-equipped Arria 10 family and is specified for industrial-grade temperature operation. The part is part of the broader Arria 10 mid-range, transceiver-rich FPGA portfolio that balances logic capacity, memory bandwidth, and power efficiency. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and hardened IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit at the top of the programmable-logic hierarchy: FPGA β programmable logic device β digital IC β semiconductor. Unlike ASICs, FPGAs are reprogrammable in the field, making them suitable for prototyping, low-volume production, and applications requiring post-deployment updates. The Arria 10 GX family in particular targets applications that need multi-gigabit transceivers and high memory throughput at moderate power budgets. Key features of the 10AX090U3F45I2LG include 900K logic elements, 59,234,304 bits (approximately 7.4 MB) of embedded memory, integrated PCI Express Gen3 hard IP, up to 96 transceiver channels supporting data rates into the multi-Gbps range, and hard memory controllers for DDR4/DDR3 interfaces. The 1932-ball FCBGA package provides the high-pin-count interconnect required for 480 user I/Os and multiple high-speed serial links. Architecturally, the device leverages Intel's 20 nm process with an Adaptive Logic Module (ALM) fabric, 20 Kbit M20K memory blocks, variable-precision DSP blocks, and hardened floating-point operators that accelerate signal-processing workloads. The integrated transceivers support protocols such as PCIe Gen3, 10 GbE, CPRI, and Serial RapidIO, making the device a complete SoC-equivalent programmable platform on a single die. Typical applications include high-performance digital signal processing in wireless baseband and remote-radio units, broadcast video processing, high-speed data acquisition for test and measurement, prototype ASIC validation, military radar preprocessing, and PCI Express Gen3 acceleration cards for servers. The industrial temperature grade extends suitability to harsh-environment embedded systems. Design considerations for the 10AX090U3F45I2LG center on PCB layout for high-speed serial channels (controlled-impedance routing, length matching, and AC-coupling capacitor placement), power-rail sequencing for the 0.9 V core and 1.8 V/2.5 V/3.3 V auxiliary rails, and thermal management via the exposed-die FCBGA land pattern. A multi-rail decoupling network and a heatsink or chassis thermal path are mandatory at full transceiver utilization. This page synthesizes distributor pricing, verified Arria 10 GX drop-in alternatives, and practical PCB/design notes that are not consolidated on any single manufacturer datasheet.
10AX090U3F45I2SG - Arria 10 GX FPGA 900K LE | Intel | 1932-BGA
The Intel (formerly Altera) 10AX090U3F45I2SG is a high-density Arria 10 GX field-programmable gate array (FPGA) built on 20nm process technology, integrating approximately 900,000 logic elements, 59,234,304 bits of embedded memory, and 480 user I/O pins in a 1932-ball FCBGA (F45) package with industrial temperature grading. Key features include 28.05 Gbps transceivers, 3,733 18x19 multipliers (variable-precision DSP blocks), 1,518 LVDS-capable user I/O, integrated hard memory controllers, and partial reconfiguration support. The device targets mid- to high-performance transceiver-based designs where high logic density, abundant DSP, and high-speed serial connectivity must coexist in a single FPGA. A field-programmable gate array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as DSP slices, block RAM, PLLs, and high-speed transceivers. FPGAs sit within the broader category of programmable logic devices (PLDs) and, in modern system hierarchies, are often co-classified with processors as parallel computing fabrics. Arria 10 specifically targets transceiver-rich applications in the wireless, broadcast, and high-performance computing segments. The 10AX090U3F45I2SG utilizes TSMC's 20nm process with a hard-core PCIe Gen2/Gen3 controller, multi-protocol memory interface support (DDR3, DDR4, QDR II+, RLDRAM 3), and 28.05 Gbps backplane-capable transceivers. The F45 package designation indicates a 45mm body FCBGA optimized for high-pin-count line cards. Typical applications include 4K video processing and broadcast equipment, 100G/400G Ethernet line cards, wireless baseband processing, military radar prototyping, and test and measurement ASIC prototyping. The industrial temperature grade (-40C to +100C) supports deployment in non-extreme environments including outdoor telecom and industrial imaging. When designing with this device, ensure that Quartus Prime software targeting the 20nm node is used, verify transceiver reference clock architecture against the relevant Arria 10 Transceiver PHY User Guide, and confirm power delivery supports up to approximately 40W peak dissipation with proper heatsinking. This page synthesizes distributor pricing, drop-in same-package speed-grade and logic-density variants, and practical design considerations drawn from Intel/Altera documentation not aggregated on standard distributor listings.
10AX090U4F45E3LG - 900K Logic Elements Arria 10 FPGA | Intel
Intel 10AX090U4F45E3LG is an Arria 10 GX field-programmable gate array (FPGA) with 900,000 logic elements, 480 user I/O, and 59,234,304 bits of embedded memory, supplied in a 1932-ball FCBGA package. It belongs to Intel's high-density programmable-logic portfolio, combining configurable logic, embedded memory, digital-signal-processing resources, and high-speed I/O in one device. The large logic capacity supports complex datapaths, communications infrastructure, industrial imaging, and protocol processing while retaining the flexibility of FPGA-based development. An FPGA is a semiconductor device containing configurable logic blocks, programmable interconnects, embedded memories, and I/O resources that can be configured after manufacturing. In the system hierarchy, an FPGA sits between a general-purpose processor and fixed-function application-specific integrated circuits: it provides more parallel processing capability and hardware-timer predictability than software execution, while offering more design flexibility than a custom ASIC. The Arria 10 GX family is designed for bandwidth-intensive and compute-oriented digital systems. The key verified resource figures are 900,000 logic elements, 480 I/O, and 59,234,304 memory bits. A 1932-ball FCBGA package provides the interconnect and thermal/mechanical interface required by this high-pin-count device. The part is listed by distributors as an FPGA IC with ball-grid-array terminals and a square BGA package designation. These characteristics make the device suitable for designs that need substantial configurable logic and many external interfaces. The configurable architecture allows designers to implement parallel pipelines, packet-processing engines, control logic, and interface bridging without waiting for a custom mask set. Embedded memory can support buffering, lookup tables, FIFOs, and local data storage close to the logic. The device should be evaluated with the complete manufacturer device documentation because the verified search data does not expose operating voltage, transceiver count, transceiver speed, DSP count, temperature grade, package dimensions, or speed grade details. Typical applications include communications and networking equipment, industrial automation, high-performance test and measurement, video and image processing, and accelerator or protocol-processing systems. Its 480 I/O count is particularly relevant when a design must connect to many memory devices, converters, backplanes, or high-speed interfaces. The 900,000-logic-element capacity supports partitioning complex functions across parallel hardware blocks. PCB design must use the exact 1932-ball land pattern, manufacturer pin map, and recommended stack-up from the Altera/Intel device documentation. Power integrity, simultaneous-switching-noise control, decoupling, thermal analysis, and high-speed routing are critical. Designers should also confirm configuration memory, clocking, transceiver support, and software-tool compatibility before release. This product data synthesizes the exact distributor and manufacturer search values, while clearly identifying unavailable electrical and mechanical details with data-needed markers. It also avoids treating generic cross-reference search pages as proof of a pin-compatible replacement.
10AX090U4F45I3LG - Arria 10 GX FPGA 900K LE | Intel
The Intel (formerly Altera) 10AX090U4F45I3LG is a high-density Arria 10 GX Field-Programmable Gate Array (FPGA) built on 20 nm process technology, featuring 900,000 logic elements, 59,234,304 bits of embedded memory, and a 1932-ball FCBGA package operating at 0.9 V core. The device targets mid-to-high performance programmable logic designs requiring integrated transceivers and a hardened floating-point DSP block fabric. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hardened IP such as block RAM, DSP slices, high-speed transceivers, and external memory controllers. Modern FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor) and are used as glue logic, accelerators, and full SoC replacements where ASIC NRE cost is unjustified. The Arria 10 GX family specifically targets 10 Gbps backplane, 25 Gbps backplane-ready, video processing, and DSP-intensive applications with hard PCIe Gen3 and 100G Ethernet IP. Key features of the 10AX090U4F45I3LG include 480 user I/O pins, 20 nm TSMC process, industrial temperature grade (-40C to +100C), industrial speed grade, and 28 Gbps-capable transceivers (per Arria 10 GX family capability). The -I3 speed/power bin denotes a mid-power balance suitable for fan-cooled line cards and modular embedded systems. The 1932-ball FCBGA (F45 package code) uses a 45 mm body with fine-pitch BGA balls to deliver the 480 user I/O bandwidth while providing mechanical rigidity for high-layer-count PCB stackups. The architecture pairs a programmable logic fabric with hard memory controllers, hard PCIe Gen3 x8 IP, hard 10/25/100G Ethernet MACs, and hardened floating-point DSP blocks. This heterogeneous integration removes soft-IP area overhead and lets the FPGA sustain multi-gigasample DSP throughput while keeping core voltage at 0.9 V for power-efficient operation in dense line-card designs. The Arria 10 family is widely deployed in 4K/8K video broadcast, medical imaging, and defense signal-processing platforms. Typical applications include 4K/8K video broadcast and processing, 100G Ethernet line cards, software-defined radio (SDR) baseband, radar signal processing, ASIC prototyping, and high-performance DSP co-processing. The 20 nm process node gives a good power/performance trade-off for thermally constrained chassis compared with 28 nm predecessors. When designing with this FPGA, plan PCB stackup with the BGA escape pattern, allocate sufficient decoupling, and verify Quartus Prime software version compatibility for the -I3 device variant. Thermal management is critical at 0.9 V core due to static plus dynamic power; a heat spreader or heatsink with adequate airflow is recommended for sustained operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and engineering teams make informed sourcing and design decisions.
10AX090U4F45I3SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
The Intel (formerly Altera) 10AX090U4F45I3SG is a high-density Arria 10 GX Field Programmable Gate Array built on a 20nm process, integrating 900,000 logic elements, 59,234,304 bits of embedded memory, and 480 user I/O pins in a 1932-ball FCBGA (F45) package. The 'U4' designator marks the device with the highest performance and logic-density tier of the Arria 10 GX family, while 'F45' designates the 45x45 mm FCBGA package and 'I3' indicates the industrial temperature grade (-40C to +100C). An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit within the broader taxonomy of programmable logic devices, alongside CPLDs and structured ASICs, and are widely used for high-throughput data processing, hardware acceleration, and protocol bridging. The Arria 10 GX family specifically targets mid-range applications that require high transceiver bandwidth, signal processing capability, and on-chip memory without the power envelope of Stratix-class devices. Key features of the 10AX090U4F45I3SG include up to 48 transceivers supporting data rates from 1 Gbps to 14.1 Gbps, hardened floating-point DSP blocks, variable-precision DSP architecture, and high-bandwidth memory interfaces such as DDR4, DDR3, and QDR-IV support through the hardened memory controllers. The device also includes embedded HardCopy blocks for partial reconfiguration and supports the PCI Express Gen3 hard IP block. Architecturally, the Arria 10 GX fabric is built on TSMC's 20nm process with a high-performance core fabric at 0.9V operation. Compared with prior-generation Arria V and Stratix V devices, the Arria 10 GX delivers up to 4x higher system-level performance at half the power by combining a tightly integrated Hard Processor System option with hardened floating-point arithmetic in DSP blocks, eliminating many of the FPGA fabric inefficiencies of older architectures. Typical applications include 4K video broadcast and professional AV signal processing, 100G/400G Ethernet line-card packet processing, military radar and electronic warfare baseband, test and measurement instrumentation, and ASIC prototyping. The high transceiver count and DSP density make the device particularly suited to applications requiring dense parallel DSP computation alongside multi-gigabit serial I/O. When designing with this device, plan PCB layout for the 1932-ball FCBGA package early - the 1 mm ball pitch demands controlled-impedance routing, microvia stack-ups, and a minimum 8-layer PCB stack-up with continuous ground and power planes beneath the device. Thermal management must account for the industrial temperature envelope, and the transceiver reference clocks require dedicated jitter-cleaner PLLs per Arria 10 GX design guidelines. This page synthesizes distributor inventory across six channels, same-brand alternative ordering codes, and PCB-layout design notes that are not consolidated in the manufacturer datasheet, providing a one-stop BOM and selection reference for engineering teams evaluating the 10AX090U4F45I3SG.
10AX115H1F34E1SG - Arria 10 GX 1.15M LEs FPGA | Intel | 1152-FCBGA
The Intel 10AX115H1F34E1SG is a high-density Arria 10 GX Field Programmable Gate Array (FPGA) integrating 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 504 user I/Os in a 1152-ball Flip-Chip BGA (FCBGA) package. The device is built on Intel's 20nm process and targets mid- to high-performance transceiver-based applications with up to 24.0 Gbps transceiver data rates. The 10AX115H1F34E1SG ordering code decodes as: 10AX = Arria 10 GX family, 115 = 1,150K LEs, H = high-transceiver variant, 1 = 17 Gbps/24 Gbps transceiver speed grade, F34 = 1152-pin FCBGA, E1 = enhanced speed grade 1, SG = lead-free RoHS-compliant package. An FPGA (Field Programmable Gate Array) is a programmable logic device that engineers can configure post-manufacturing to implement custom digital logic functions, parallel processing pipelines, and high-speed serial interfaces. FPGAs sit hierarchically below ASICs in design flexibility and above microcontrollers in raw logic density. The Arria 10 family is a mid-range, transceiver-rich family positioned between the lower-cost Cyclone series and the high-performance Stratix series, making it well-suited for applications requiring 10-25 Gbps serial links, DSP-intensive signal processing, and PCIe Gen3 system integration. Key features of the 10AX115H1F34E1SG include 1,150,000 logic elements, 68.86 Mbits embedded memory, integrated transceivers supporting up to 17 Gbps (speed grade 1) with 24 Gbps capability in higher speed grades, hardened PCIe Gen3 x8 IP blocks, and 504 user I/Os distributed across 12 I/O banks. The device also integrates variable-precision DSP blocks, hard memory controllers, and an SoC subsystem option in related Arria 10 SX variants. The F34 package (1152-ball FCBGA) provides high signal density and supports high-performance signaling for memory and serial interfaces. Typical applications include high-speed data acquisition, test and measurement equipment, medical imaging systems, military/aerospace signal processing, broadcast video processing, 10/25/40/100G Ethernet aggregation, and PCIe Gen3-based accelerators. The high logic count and transceiver bandwidth make this device especially appropriate for multi-channel waveform generation, radar processing, and high-speed protocol bridging. Designers should pay close attention to the F34 PCB footprint, transceiver reference clocking topology, and decoupling strategy. Power estimation using Intel's Early Power Estimator (EPE) is strongly recommended before PCB commitment, as a fully populated 10AX115 device can exceed 25W under typical workloads. Thermal management requires a 6-8 layer PCB with internal copper planes for heat spreading.
10AX115H1F34I1SG - Arria 10 GX FPGA, 1150K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) 10AX115H1F34I1SG is an Arria 10 GX Field-Programmable Gate Array (FPGA) delivering up to 1,150,000 logic elements, 68,857,856 bits of embedded memory, and 504 user I/O pins in a 1152-ball Flip-Chip BGA (FCBGA) package. The device is built on TSMC's 20 nm process and targets mid- to high-density mid-range applications requiring high transceiver throughput and DSP compute density. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing, occupying a unique position between fixed-function ASICs and software-programmable processors. FPGAs contain an array of programmable logic blocks, configurable interconnects, dedicated DSP blocks, embedded SRAM, and high-speed transceivers. They sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital logic IC -> semiconductor. Arria 10 specifically belongs to Intel's mid-range / mid-density FPGA portfolio, between low-cost Cyclone and high-end Stratix families. Key differentiating specifications include up to 1,150K logic elements, 68.85 Mbit embedded memory, integrated transceivers supporting up to 14.1 Gbps data rates, 28 modular fractional PLLs, 19.4 Gbps serial transceivers for chip-to-chip and backplane links, and an industrial temperature grade operating range of -40C to +100C. The F34 package designation denotes a 1152-ball FCBGA optimized for high-speed signal integrity with controlled-impedance routing. Architecturally, the Arria 10 GX combines hardened floating-point DSP blocks, partial reconfiguration support, and integrated PCI Express Gen3 hard IP blocks. The 20 nm process node delivers superior power efficiency compared to older 28 nm Arria V and Stratix V devices, enabling higher logic density at lower thermal envelopes for compute-intensive workloads. Typical applications include high-performance digital signal processing (wireless baseband, radar), ASIC prototyping and emulation, high-speed serial protocol bridging (PCIe Gen3, 10GbE, JESD204B/C), broadcast video processing, and test and measurement equipment. The transceiver throughput makes it particularly suitable for backhaul and fronthaul infrastructure. When designing with this FPGA, ensure PCB layout meets Intel's FCBGA BGA escape routing and decoupling requirements. Use Quartus Prime design software for synthesis, place-and-route, and timing closure; consult Intel's Arria 10 Device Datasheet and Pin Connection Guidelines for the F34 package. This page synthesizes distributor pricing, drop-in alternatives, application contexts, and engineering design notes not aggregated on the manufacturer datasheet or single distributor page.