K4B4G1646D-BCNB0 vs K4B4G1646D-BFMA Comparison
Detailed side-by-side comparison of K4B4G1646D-BCNB0 by Samsung Electronics and K4B4G1646D-BFMA by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4B4G1646D-BCNB0 | K4B4G1646D-BFMA |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Density | 4 Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 |
| Data Rate | 2133 Mbps/pin | 1866 Mbps |
| Supply Voltage | 1.35 V (DDR3L) | 1.5V |
| Package | 96-FBGA | 96-ball FBGA |
| Operating Temperature | 0°C to 85°C | — |
| Lead-Free | Yes | Yes |
| Halogen Free | Yes | Yes |
| RoHS Compliant | Yes | — |
| CAS Latency | [DATA_NEEDED: CAS Latency] | Programmable |
| Refresh | [DATA_NEEDED: Refresh rate] | — |
| Interface | DDR3L SDRAM | — |
| Mounting Type | Surface Mount | — |
| Number of Pins | 96 | — |
| Die | D-die | — |
| Memory Type | — | DDR3 SDRAM |
| Ball Pitch | — | 0.8mm |
| Number of Banks | — | 8 |
| Burst Length | — | 8 and 4 (with burst chop) |
| On-Die Termination | — | Yes |
| Temperature Range | — | 0°C to 95°C (case) |
| RoHS | — | Compliant |