K4B4G1646E-BYK0 vs K4B4G1646E-BCMA Comparison

Detailed side-by-side comparison of K4B4G1646E-BYK0 by Samsung Electronics and K4B4G1646E-BCMA by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4B4G1646E-BYK0 K4B4G1646E-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK0 ✓ Active
Samsung Electronics
K4B4G1646E-BCMA K4B4G1646E-BCMA - 4Gb DDR3 SDRAM 1066MHz FBGA-96 | Samsung

K4B4G1646E-BCMA - 4Gb DDR3 SDRAM 1066MHz FBGA-96 | Samsung

K4B4G1646E-BCMA ✓ Active

Specification Comparison

Parameter K4B4G1646E-BYK0 K4B4G1646E-BCMA
Brand Samsung Electronics Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status — In Stock
Unit Price (USD) — $3.77
Memory Type DDR3L SDRAM DDR3 SDRAM
Density 4 Gb 4 Gbit
Organization 256M x 16 256M x 16
Supply Voltage 1.35 V (1.283 V to 1.45 V) 1.425 V to 1.575 V (1.5 V nominal)
Data Rate DDR3-1600 (800 MHz) —
Package 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) FBGA-96 (7.5 x 13.3 mm)
Operating Temperature 0°C to +95°C (TC) 0C to +95C
CAS Latency 11 (CL-tRCD-tRP) —
Burst Length 8 (fixed), 4 (burst chop) —
On-Die Termination Yes (dynamic ODT) —
ZQ Calibration Yes Yes
Auto Precharge Yes Yes
Self-Refresh Yes —
Asynchronous Reset Yes Yes
Data Mask Yes —
RoHS Compliant —
Clock / Data Rate — 1066 MHz / 1066 Mbps per data pin
Operating Supply Current (IDD) — 55 mA
Standby Current — 2 mA
On-Die Termination (ODT) — Dynamic ODT supported
Data Mask Function — Yes
Mounting Type — Surface Mount (BGA)
RoHS Status — Compliant

Datasheets & Resources

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