5CSXFC6D6F31I7N - Cyclone V SX SoC FPGA, 110K LE | Intel
Teilenummer: 5CSXFC6D6F31I7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $342.53 | $342,53 |
| 10 | $308.28 | $3.082,80 |
| 100 | $274.02 | $27.402,00 |
| 500 | $239.77 | $119.885,00 |
| 1.000 | $205.52 | $205.520,00 |
5CSXFC6D6F31I7N Übersicht
A System-on-Chip (SoC) FPGA is an integrated circuit that fuses a general-purpose processor subsystem with an FPGA fabric on a single die. Within the broader taxonomy, the 5CSXFC6D6F31I7N occupies the role of programmable logic device -> FPGA -> SoC FPGA -> heterogeneous compute IC. The HPS subsystem includes peripherals, memory controllers, and a coherent interconnect, allowing designers to partition tasks deterministically between software running on Cortex-A9 and hardware-accelerated datapaths in the FPGA fabric.
Key specifications include 110,000 logic elements, 224 (18x18) multipliers for DSP, embedded memory blocks totaling approximately 5.5 Mbits, and transceivers supporting multi-gigabit serial connectivity. The HPS delivers dual-core 800 MHz ARM Cortex-A9 with NEON media engine and single/double precision floating-point. The 896-FBGA package exposes 288 user I/Os and provides a substantial signal-breakout budget for memory, communication, and user-defined I/O. Industrial temperature grade (-40C to +100C) suits harsh-environment deployment.
The Cyclone V architecture leverages TSMC's 28nm low-power process to balance static and dynamic power, with features such as low-power transceivers, partial reconfiguration, and clock networks optimized for energy efficiency. The hard ARM cores offload routine control tasks from the fabric, freeing logic resources for parallel datapath acceleration such as video pipelines, motor control, or signal processing. The coherent ACE interface enables L2 cache coherency between HPS and FPGA accelerators, reducing software overhead for shared-memory applications.
Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive driver assistance and infotainment, software-defined radio (SDR), and medical imaging. The combination of deterministic ARM processing, programmable logic, and an extensive peripheral set makes this device especially attractive for systems requiring real-time response alongside high-throughput data manipulation.
When designing with this part, allocate FPGA fabric and HPS bandwidth budgets concurrently during architectural planning. Designers should follow Intel's recommended power sequencing and decouple each supply rail per the Cyclone V hardware reference manual, and verify pin assignments against the dedicated 896-FBGA package pin-out file before PCB layout fabrication. Quartus Prime is the supported design environment for synthesis, place-and-route, and HPS software configuration.
This page synthesizes distributor pricing, same-brand drop-in alternates from the Cyclone V SX family, and practical design considerations that complement (not duplicate) the official Cyclone V device datasheet and Cyclone V device overview PDF.
Drop-in-Alternativen für 5CSXFC6D6F31I7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSXFC6D6F31I7N (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Logic Elements, Mounting Type, HPS Maximum Frequency.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSXFC6D6F31I7
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →5CSXFC6D6F31C8N
✅ Drop-In✓ Auf Lager
$355 / Stück
Datenblatt ansehen →5CSXFC6D6F31C7N
✅ Drop-In✓ Auf Lager
$360 / Stück
Datenblatt ansehen →5CSXFC6D6F31C6N
✅ Drop-In✓ Auf Lager
$285 / Stück
Datenblatt ansehen →5CSXFC6D6F31A7N
✅ Drop-In✓ Auf Lager
$345.5 / Stück
Datenblatt ansehen →5CSXFC5D6F31I7N
✅ Drop-In✓ Auf Lager
$138.2 / Stück
Datenblatt ansehen →5CSXFC6D6F31I7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 110,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| DSP Blocks (18x18 Multipliers) | 224 |
| Embedded Memory | approximately 5.5 Mbits |
| Maximum User I/O | 288 |
| Gehäuse | 896-FBGA (31x31 mm) |
| Process Technology | 28 nm low-power |
| Core Voltage | 1.1 V |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Montageart | Surface Mount (FBGA) |
| RoHS-Status | Compliant |
| MSL-Level | 3 |
| Series | Cyclone V SX 5CSXC6 (F31) |
5CSXFC6D6F31I7N 896-fbga (31x31 mm) Pinbelegungsleitfaden
Pinbelegung für 5CSXFC6D6F31I7N (896-fbga (31x31 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSXFC6D6F31I7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSXFC6D6F31I7N ist geeignet für 8 Anwendungs: Industrial Motor Control and Factory Automation, Video Surveillance and Image Processing, Automotive Driver Assistance and Infotainment, Software Defined Radio (SDR) Baseband, Medical Imaging and Diagnostics, Military and Aerospace Ruggedized Systems, Industrial IoT Gateway and Edge Computing, Test and Measurement Instrumentation.
Industrial Motor Control and Factory Automation
The 5CSXFC6D6F31I7N's deterministic dual ARM Cortex-A9 HPS at 800 MHz combined with 110K logic elements makes it ideal for multi-axis motor control in factory automation. The fabric can implement time-critical PWM generators, encoder interfaces, and field-oriented control loops in parallel while the HPS runs Linux for OPC UA, EtherCAT, or PROFINET master stacks. 224 DSP blocks provide headroom for sensorless-FOC and Kalman-filter estimators, and the 288 user I/Os allow direct connection to multiple resolver or Hall-sensor channels. Industrial -40C to +100C rating ensures operation on the factory floor.
Empfohlen
Video Surveillance and Image Processing
In video surveillance designs the 5CSXFC6D6F31I7N delivers parallel pixel pipelines (Sobel, motion detection, H.264 pre-processing) in 110K logic elements while the dual ARM cores handle network streaming, ONVIF, and analytics at 800 MHz. The DDR controller in the HPS manages frame buffers without consuming fabric memory, and the 28nm low-power process keeps thermals manageable in sealed outdoor camera housings. Hardware CV-acceleration kernels in DSP blocks reduce CPU load for AI-driven intrusion detection.
Empfohlen
Automotive Driver Assistance and Infotainment
The 5CSXFC6D6F31I7N industrial temperature range and 800 MHz ARM cores support ADAS sensor fusion and infotainment HMI simultaneously. The FPGA fabric implements low-latency camera pre-processing (de-Bayering, lens correction) and CAN-FD gateways while the HPS runs QNX or Linux for HMI graphics, navigation, and over-the-air updates. Designers targeting AEC-Q100-qualified automotive builds should select the 'A7' speed-grade variant. 224 DSP blocks accelerate radar FFT preprocessing and lane-detection kernels.
Empfohlen
Software Defined Radio (SDR) Baseband
The 5CSXFC6D6F31I7N's 224 18x18 multipliers and ~5.5 Mbit embedded RAM are well suited to multi-channel SDR baseband processing - digital down-conversion, channelization, and demodulation can run in the FPGA at rates the Cortex-A9 HPS cannot match alone. The hard ARM cores then handle MAC-layer stacks, IP routing, and timing-sensitive control planes. Transceivers (where the SX device variant supports them) provide the multi-gigabit RF-to-digital interface, and the F31 896-FBGA breaks out ample LVDS pairs for ADC/DAC connections.
Empfohlen
Medical Imaging and Diagnostics
In ultrasound beamformers and portable patient monitors the 5CSXFC6D6F31I7N pairs parallel beamforming datapaths in fabric with deterministic ARM Cortex-A9 cores for DICOM networking, UI rendering, and signal processing supervision. The 288 user I/Os accept multiple analog front-end channels and high-speed ADC LVDS lanes, while 110K logic elements sustain real-time image reconstruction. Industrial temperature range and 28nm low-power process support fanless medical enclosures.
Empfohlen
Military and Aerospace Ruggedized Systems
With industrial -40C to +100C operating range, the 5CSXFC6D6F31I7N suits ruggedized man-portable radios, UAV flight controllers, and avionics datalinks. The dual ARM cores run flight management and crypto stacks while the FPGA fabric accelerates sensor fusion, MIL-STD-1553 bridges, and RS-422/485 links. The 896-FBGA F31 package provides extensive I/O for redundant sensor channels and the high pin density enables compact SWaP-optimized designs common in UAVs.
Empfohlen
Industrial IoT Gateway and Edge Computing
The 5CSXFC6D6F31I7N integrates networking, control, and analytic compute in a single chip for industrial IoT gateways. The ARM HPS runs Linux with containers for protocol translation (Modbus, OPC UA, MQTT), while 110K fabric logic elements accelerate edge-AI inference engines using the 224 DSP blocks. Multiple GbE, USB, and SD/eMMC interfaces in the HPS provide rich connectivity, and the 28nm process keeps thermal output low for sealed enclosures without forced cooling.
Empfohlen
Test and Measurement Instrumentation
In bench-top oscilloscopes, protocol analyzers, and arbitrary waveform generators the 5CSXFC6D6F31I7N's 800 MHz ARM cores manage UI, storage, and remote control while the FPGA fabric implements real-time DSP - FIR filtering, FFT, and trigger logic - at rates the processor cannot achieve alone. 288 user I/Os accept multiple high-speed ADC/DAC channels and the F31 896-FBGA breaks out sufficient LVDS for parallel data acquisition. Quartus Prime DSP Builder accelerates model-based design entry.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSXFC6D6F31I7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSXFC6D6F31I7 | 5CSXFC6D6F31C8N | 5CSXFC6D6F31C7N | 5CSXFC6D6F31C6N | 5CSXFC6D6F31A7N | 5CSXFC5D6F31I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (F31, 31x31 mm) | 896-FBGA (F31) - same | 896-FBGA (F31) - same | 896-FBGA (F31) - same | 896-FBGA (F31) - same | 896-FBGA (F31) - same | 896-FBGA (F31) - same |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | 110,000 | 110,000 | 85,000 |
| Hard Processor System | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz |
| DSP Blocks (18x18) | 224 | 224 | 224 | 224 | 224 | 224 | 174 |
| User I/Os | 288 | 288 | 288 | 288 | 288 | 288 | 288 |
| Speed Grade | I7 (industrial, fast) | I7 (industrial) | C8 (commercial) | C7 (commercial) | C6 (commercial, slowest) | A7 (automotive) | I7 (industrial) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (AEC-Q100) | Industrial |
Wichtigste Unterscheidungsmerkmale
- High density in the 896-FBGA F31 footprint (vs. 5CSXFC5D6F31I7N)
- Fastest industrial speed grade available (vs. 5CSXFC6D6F31C8N)
- Industrial temperature screening with hard ARM Cortex-A9 (vs. 5CSXFC6C6U23I7N)
- AES, JTAG, and partial reconfiguration support (vs. 5CEBA4F23C8N (non-SoC Cyclone V E))
Designhinweise
The 5CSXFC6D6F31I7N requires multiple supply rails (core 1.1V, HPS, transceiver, I/O, and PLL supplies) all sequenced per the Cyclone V device handbook. Use the dedicated Intel Enpirion or similar power management IC family that supports the prescribed power-up/power-down sequencing, and place decoupling capacitors within the package escape region for each rail. Estimated: a fully utilized C6 device can draw 3-5 W from the core rail alone, so plan thermal dissipation for industrial -40C to +100C operation.
For industrial deployments with sustained high fabric utilization, attach a heatsink or thermal interface material (TIM) to the top of the F31 896-FBGA package. The 28nm process reduces static power relative to prior 40/65 nm nodes but dynamic power at high toggle rates still drives junction temperature. Ensure airflow of at least 1 m/s in sealed enclosures, and verify with a thermal simulation using the actual toggle rate from your Quartus Prime power analyzer report. Estimated: junction-to-ambient theta_JA in still air is roughly 15-20 C/W for the F31 package - design for junction temperature below 100C in industrial environments.
The 896-FBGA F31 package requires a multilayer PCB with microvia (laser-drilled) stack-ups - it cannot be built on a 2-layer board because the 1.0 mm pitch BGA exceeds the manufacturability of through-hole vias. Use Intel's Cyclone V F31 package pin-out file to escape all 288 user I/Os and dedicate at least one inner layer to GND and another to a high-speed supply. Match DDR3 trace lengths to within 25 mils per the Cyclone V external memory interface guidelines.
Do not confuse F31 (896-FBGA 31x31 mm) with U23 (484-UBGA 23x23 mm) package codes when ordering - the speed and density suffixes are identical but the packages are not interchangeable and require different PCB layouts. Likewise, ensure your Quartus Prime device selection matches the exact ordering code including the 'N' (lead-free) suffix. Pin-compatible drop-in parts in this listing all use the F31 footprint, so swapping among them is safe.
Compliance-Informationen
RoHS compliant per DigiKey product listing. 'I' suffix indicates industrial temperature grade (-40C to +100C), not AEC-Q100. For AEC-Q100 automotive, choose 5CSXFC6D6F31A7N. Halogen-free status not explicitly stated in verified data.