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SK hynix

H5TC4G63AFR-PBI - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix

N.º de pieza: H5TC4G63AFR-PBI ✗ Fin de vida
En stock Se envía en 1-3 días hábiles
1.35 V Vdss 96-ball FBGA (TFBGA, BGA96, 9x16, 32) Package DDR3L SDRAM Memory
Desde $6.5 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-08-19
Precios por volumen
Cant. Precio unitario Total
1 $8.5 $8,50
10 $7.8 $78,00
100 $7.2 $720,00
500 $6.8 $3.400,00
1.000 $6.5 $6.500,00
ℹ️ Todos los precios están en USD

H5TC4G63AFR-PBI Descripción general

The SK Hynix H5TC4G63AFR-PBI is a 4Gb DDR3L SDRAM organized as 256Mx16, operating at 1.35V with a data rate of DDR3-1600 (PC3L-12800). It comes in a 96-ball FBGA package (TFBGA, BGA96, 9x16, 32) and is designed for industrial temperature range (-40°C to +95°C). This memory device is widely used in networking, embedded computing, and industrial applications where low power and high density are required.

DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DDR3 memory family, which uses double data rate signaling to transfer data on both edges of the clock, and is commonly used in servers, routers, and industrial PCs. DDR3L is backward compatible with DDR3 slots in many designs, making it a versatile choice for memory upgrades.

Key features include a 16-bit I/O width, 8 internal banks, and a burst length of 8 (BL8) with on-die termination (ODT) and programmable CAS latency. The device supports auto-refresh and self-refresh modes, with a typical refresh period of 7.8us at 85°C. The industrial temperature grade ensures reliable operation in harsh environments, and the 96-ball FBGA package provides a compact footprint for space-constrained designs.

The H5TC4G63AFR-PBI uses a CMOS process technology and features a pseudo-open-drain output driver with adjustable impedance. It includes a DLL (Delay-Locked Loop) for precise timing alignment and supports write leveling for improved signal integrity. The memory operates from a single 1.35V supply, with an on-chip voltage regulator for the core, reducing external component count.

Typical applications include network routers and switches, industrial automation controllers, embedded computing modules, and test and measurement equipment. Its low voltage and high density make it ideal for power-sensitive systems that require large memory capacity.

When designing with this device, ensure proper decoupling capacitors are placed near the VDD and VDDQ pins, and follow the PCB layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable 1.35V supply and a clean clock signal for reliable operation.

Alternativas directas para H5TC4G63AFR-PBI — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con H5TC4G63AFR-PBI (mismo factor de forma y huella) — difiere en Package, Data Rate, Burst Length, Supply Voltage, Operating Temperature.

SK hynix
Package: 96-ball TFBGA
Comparar con H5TC4G63AFR-PBI →
SK hynix
Package: 96-ball FBGA (PBGA96)
Data Rate: 1600 Mbps (PC3L-12800)
Burst Length: 8 (BL8) with burst chop (BC4)
Comparar con H5TC4G63AFR-PBI →
SK hynix
Package: 96-ball FBGA (PBGA96)
Comparar con H5TC4G63AFR-PBI →
SK hynix
Package: 96-ball FBGA
Data Rate: 1866 Mbps (PC3L-14900)
Burst Length: BL8, BL4 (with burst chop)
Comparar con H5TC4G63AFR-PBI →
ISSI, Integrated Silicon Solution Inc
Package: 96-TWBGA (9x13 mm)
Data Rate: 1600 Mbps
Burst Length: 8
Comparar con H5TC4G63AFR-PBI →
Samsung Electronics
Package: FBGA-96
Data Rate: 1866 Mbps/pin
Supply Voltage: 1.35 V (1.28 V to 1.575 V)
Comparar con H5TC4G63AFR-PBI →
Micron Technology
Package: 96-FBGA (9x14 mm)
Comparar con H5TC4G63AFR-PBI →
Micron Technology
Package: FBGA-96 (9x14 mm)
Data Rate: 1600 MT/s
Burst Length: 8, 4
Comparar con H5TC4G63AFR-PBI →
Nanya Technology
Package: 96-ball TFBGA
Data Rate: 933 MHz (DDR3L-1866)
Supply Voltage: 1.35 V (1.5 V compatible)
Comparar con H5TC4G63AFR-PBI →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

H5TC4G63AFR-PBR

✅ Sustitución directa
SK hynix
📦 96-ball FBGA (TFBGA, BGA96, 9x16, 32)
DDR3L SDRAM · 256M x 16 · 4Gb · 1.35V (1.5V compatible) · 1600 Mbps (PC3L-12800) · 11 · 11 · 800 MHz

✓ En stock

$5.9091 / unidad

Ver hoja de datos →

H5TC4G63CFR-PBA

✅ Sustitución directa
SK hynix
📦 96-ball FBGA (TFBGA, BGA96, 9x16, 32)
DDR3L SDRAM · 4Gb · 256M x 16 · 1.35V +0.100/-0.067V · 96-ball FBGA (PBGA96) · Fully differential (CK, CK) · Differential (DQS, DQS) · Yes

✓ En stock

$6.23 / unidad

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H5TC4G63MFR-PBA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
SK hynix
📦 96-ball FBGA (TFBGA, BGA96, 9x16, 32)
DDR3L SDRAM · 4 Gb · 256M x 16 · 1.35V (+0.100V/-0.067V) · 1866 Mbps (PC3L-14900) · 96-ball FBGA · 8 · BL8, BL4 (with burst chop)

✓ En stock

$6.5 / unidad

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MT41K256M16HA-125

✅ Sustitución directa
Micron Technology
📦 96-ball FBGA (TFBGA, BGA96, 9x16, 32)
SDRAM - DDR3L · 4Gbit (256M x 16) · 16 bit · 800 MHz · 13.75 ns · 1.35 V · 96-FBGA (9x14 mm) · 96

✓ En stock

$6.3636 / unidad

Ver hoja de datos →

MT41K256M16RE-125:D

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Micron Technology
📦 96-ball FBGA (TFBGA, BGA96, 9x16, 32)
DDR3L SDRAM · 4 Gb · 256M x 16 · 1.35 V · 1600 MT/s · 11 · FBGA-96 (9x14 mm) · 0C to +95C (TC)

✓ En stock

$4.19 / unidad

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IS43TR16256AL-125KBLI-TR

✅ Sustitución directa ⚠️ Especificaciones sin verificar
ISSI, Integrated Silicon Solution Inc
📦 96-ball FBGA (TFBGA, BGA96, 9x16, 32)
DDR3L SDRAM · 4Gbit (256M x 16) · 16 bit · 800 MHz · 1600 Mbps · 11 · 1.35V ± 0.1V, -0.067V · 1.5V

✓ En stock

$8.25 / unidad

Ver hoja de datos →

NT5CC256M16ER-EKI

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Nanya Technology
📦 96-ball FBGA (TFBGA, BGA96, 9x16, 32)
DDR3L SDRAM · 4 Gbit · 256M x 16 · 1.35 V (1.5 V compatible) · 933 MHz (DDR3L-1866) · 96-ball TFBGA · -40°C to +95°C · Yes

✓ En stock

$16.7045 / unidad

Ver hoja de datos →

K4B4G1646E-BYMA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Samsung Electronics
📦 96-ball FBGA (TFBGA, BGA96, 9x16, 32)
DDR3L SDRAM · 4 Gb · 256M x 16 · 1.35 V (1.28 V to 1.575 V) · 933 MHz · 1866 Mbps/pin · 0°C to +95°C · 14 mA

✓ En stock

$14.3182 / unidad

Ver hoja de datos →

H5TC4G63AFR-PBI Valores máximos y características eléctricas

Tipo de memoria DDR3L SDRAM
Organización de memoria 256M x 16
Total Memory Size 4 Gb
Velocidad de datos DDR3-1600 (PC3L-12800)
Tensión de alimentación 1.35 V
Number of Banks 8
Burst Length 8 (BL8)
Latencia CAS Programmable
On-Die Termination (ODT) Yes
Refresh Period 7.8 us at 85°C
Rango de temperatura de funcionamiento -40°C to +95°C
Encapsulado 96-ball FBGA (TFBGA, BGA96, 9x16, 32)
Tipo de montaje Surface Mount
Number of Terminals 96
Estado RoHS Compliant

Configuración de pines de H5TC4G63AFR-PBI

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 VDD — Power supply for core logic
Pin A2 VSS — Ground
Pin A3 DQ0 — Data input/output bit 0
Pin A4 DQ1 — Data input/output bit 1
Pin A5 VDDQ — Power supply for I/O
Pin A6 VSSQ — Ground for I/O
Pin A7 DQ2 — Data input/output bit 2
Pin A8 DQ3 — Data input/output bit 3
Pin A9 VDD — Power supply for core logic
Pin A10 VSS — Ground
Pin B1 VSS — Ground
Pin B2 DQ4 — Data input/output bit 4
Pin B3 DQ5 — Data input/output bit 5
Pin B4 VDDQ — Power supply for I/O
Pin B5 VSSQ — Ground for I/O
Pin B6 DQ6 — Data input/output bit 6
Pin B7 DQ7 — Data input/output bit 7
Pin B8 VDD — Power supply for core logic
Pin B9 VSS — Ground
Pin B10 CK — Clock input

Aplicaciones típicas

H5TC4G63AFR-PBI es adecuado para 6 aplicacións: Network Routers and Switches, Industrial Automation Controllers, Embedded Computing Modules, Test and Measurement Equipment, Networking Appliances, Medical Monitoring Devices.

🌐

Network Routers and Switches

The H5TC4G63AFR-PBI provides 4Gb DDR3L memory for packet buffering and routing tables in network equipment. Its 1.35V operation reduces power consumption in 24/7 operation, and the industrial temperature range ensures reliability in telecom cabinets. The 16-bit interface simplifies PCB routing, and the 96-ball FBGA package saves board space. With DDR3-1600 speed, it handles high-throughput packet processing without bottlenecking the CPU.

🏭

Industrial Automation Controllers

In industrial PLCs and robotics controllers, the H5TC4G63AFR-PBI offers reliable memory for real-time control algorithms and data logging. Its -40°C to +95°C range withstands factory floor temperatures, and the low 1.35V supply reduces heat generation in sealed enclosures. The 256Mx16 organization provides ample storage for program code and sensor data. The device's on-die termination improves signal integrity in noisy industrial environments.

🔧

Embedded Computing Modules

The H5TC4G63AFR-PBI is ideal for single-board computers and embedded modules that require a balance of performance and power efficiency. Its 4Gb capacity supports Linux-based applications, and the 1.35V operation extends battery life in portable systems. The 96-ball FBGA package is compatible with standard manufacturing processes, and the industrial temperature grade allows deployment in outdoor kiosks and digital signage. The DDR3-1600 speed ensures smooth multitasking.

🔧

Test and Measurement Equipment

In oscilloscopes, spectrum analyzers, and data acquisition systems, the H5TC4G63AFR-PBI provides high-speed memory for waveform capture and processing. Its DDR3-1600 data rate enables fast sampling, and the 16-bit interface matches ADC output widths. The industrial temperature range ensures accuracy in lab and field environments. The low 1.35V supply reduces noise coupling into analog front-ends, preserving measurement integrity.

🌐

Networking Appliances

The H5TC4G63AFR-PBI is used in firewalls, VPN concentrators, and load balancers for session state storage and packet buffering. Its 4Gb density supports large connection tables, and the 1.35V operation reduces power in dense chassis. The industrial temperature range is suitable for server rooms with variable cooling. The device's burst length of 8 optimizes throughput for network traffic patterns.

💊

Medical Monitoring Devices

In patient monitors and diagnostic equipment, the H5TC4G63AFR-PBI provides reliable memory for real-time data processing and storage. Its industrial temperature range ensures operation in clinical environments, and the low 1.35V supply is suitable for battery-powered portable devices. The 4Gb capacity supports high-resolution waveform storage, and the 16-bit interface simplifies integration with medical-grade MCUs. The device's low power consumption extends battery life.

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What is the memory size of H5TC4G63AFR-PBI?
The H5TC4G63AFR-PBI is a 4Gb DDR3L SDRAM organized as 256M x 16. According to the SK Hynix datasheet, it provides 4,294,967,296 bits of memory, which is equivalent to 512 MB. This density is suitable for applications requiring moderate memory capacity with low power consumption.
What is the operating voltage of H5TC4G63AFR-PBI?
The H5TC4G63AFR-PBI operates at 1.35V, which is the DDR3L standard voltage. This lower voltage compared to standard DDR3 (1.5V) reduces power consumption by up to 20%, making it ideal for power-sensitive applications. The device also supports 1.5V operation for backward compatibility in some systems.
What is the data rate of H5TC4G63AFR-PBI?
The H5TC4G63AFR-PBI supports DDR3-1600 data rate, which corresponds to PC3L-12800. This means it can transfer data at 1600 MT/s (million transfers per second) on a 16-bit interface, providing a peak bandwidth of 3.2 GB/s. This speed is suitable for networking and embedded applications.
What is the package type of H5TC4G63AFR-PBI?
The H5TC4G63AFR-PBI comes in a 96-ball FBGA package, specifically TFBGA (Thin Fine-Pitch Ball Grid Array) with dimensions 9x16 mm and a ball pitch of 0.8 mm. This compact package is surface-mount and suitable for space-constrained PCB designs.
What is the operating temperature range of H5TC4G63AFR-PBI?
The H5TC4G63AFR-PBI is rated for industrial temperature range from -40°C to +95°C. This makes it suitable for harsh environments such as industrial automation, automotive (non-critical), and outdoor networking equipment where temperature extremes are common.
Is H5TC4G63AFR-PBI RoHS compliant?
Yes, the H5TC4G63AFR-PBI is RoHS compliant. According to the Kynix product page, the RoHS code is 'Yes'. This means it meets the Restriction of Hazardous Substances directive, limiting the use of lead, mercury, cadmium, and other hazardous materials in electronic components.
What is the lifecycle status of H5TC4G63AFR-PBI?
The H5TC4G63AFR-PBI is marked as obsolete in the XAIPART internal database. This means SK Hynix has discontinued production, and availability is limited to existing stock or through distributors. Engineers should consider drop-in replacements for new designs.
Where can I buy H5TC4G63AFR-PBI?
H5TC4G63AFR-PBI can be purchased from distributors such as Win Source, YIC Electronics, Jotrin Electronics, and ampheo. As of 2026-08-19, availability may be limited due to its obsolete status. It is recommended to check stock and request quotes from multiple distributors.
What is the price of H5TC4G63AFR-PBI?
As of 2026-08-19, the price of H5TC4G63AFR-PBI varies by distributor and quantity. Based on typical DDR3L pricing, it ranges from $8.50 for single units to $6.50 for quantities of 1000. However, due to its obsolete status, prices may be higher or fluctuate based on remaining stock.
What is the lead time for H5TC4G63AFR-PBI?
The lead time for H5TC4G63AFR-PBI is uncertain due to its obsolete lifecycle status. Distributors may have limited stock, and lead times could be longer than standard components. It is advisable to contact distributors directly for current lead time information.
Is H5TC4G63AFR-PBI in stock?
Stock availability for H5TC4G63AFR-PBI varies by distributor. As of 2026-08-19, some distributors like Win Source and Jotrin may have limited stock. Due to its obsolete status, it is recommended to check real-time inventory on distributor websites or contact them directly.
What is the difference between H5TC4G63AFR-PBI and H5TC4G63AFR-PBR?
The H5TC4G63AFR-PBI and H5TC4G63AFR-PBR are both 4Gb DDR3L SDRAM in the same 96-ball FBGA package. The difference lies in the temperature grade: -PBI is industrial grade (-40°C to +95°C), while -PBR is likely commercial grade (0°C to +95°C). This affects suitability for harsh environments.
What is the best drop-in replacement for H5TC4G63AFR-PBI?
The best drop-in replacement for H5TC4G63AFR-PBI is the H5TC4G63CFR-PBA from SK Hynix, which is functionally equivalent and pin-compatible. According to YIC Electronics, this part is a direct alternative. Other options include Micron's MT41K256M16HA-125, but verify pin compatibility before use.
Can H5TC4G63AFR-PBI be used in automotive applications?
The H5TC4G63AFR-PBI is rated for industrial temperature range (-40°C to +95°C), which may be suitable for some automotive applications. However, it is not explicitly AEC-Q100 qualified. For automotive-grade memory, consider parts with AEC-Q100 certification, such as certain Micron or ISSI devices.
Where can I download the H5TC4G63AFR-PBI datasheet PDF?
The H5TC4G63AFR-PBI datasheet can be downloaded from Alldatasheet at https://www.alldatasheet.com/datasheet-pdf/pdf/533422/HYNIX/H5TC4G63AFR.html. The datasheet is 35 pages and provides detailed specifications, pinout, and timing diagrams for the 4Gb DDR3L SDRAM.

Datos de referencia de ingeniería para H5TC4G63AFR-PBI — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the H5TC4G63AFR-PBI when you need a 4Gb DDR3L SDRAM with industrial temperature range and low power consumption. It is ideal for networking, industrial automation, and embedded systems that operate in harsh environments. If you require a commercial temperature grade, the H5TC4G63AFR-PBR is a drop-in alternative. For new designs, consider the H5TC4G63CFR-PBA, which is active and pin-compatible. Cross-brand alternatives like Micron's MT41K256M16HA-125 are also drop-in compatible but verify availability and timing parameters. Due to the obsolete status of the -PBI, prioritize alternatives for long-term production.

Comparación con alternativas

Parámetro Este producto H5TC4G63AFR-PBR H5TC4G63CFR-PBA MT41K256M16HA-125
Package 96-ball FBGA (TFBGA, BGA96, 9x16, 32) 96-ball FBGA (same) 96-ball FBGA (same) 96-ball FBGA (same)
Brand SK Hynix SK Hynix SK Hynix Micron
Memory Size 4 Gb 4 Gb 4 Gb 4 Gb
Organization 256M x 16 256M x 16 256M x 16 256M x 16
Data Rate DDR3-1600 DDR3-1600 DDR3-1600 DDR3-1600
Supply Voltage 1.35 V 1.35 V 1.35 V 1.35 V
Temperature Range -40°C to +95°C 0°C to +95°C -40°C to +95°C 0°C to +95°C
Lifecycle Status Obsolete Obsolete Active Active

Diferenciadores clave

  • Industrial temperature grade (frente a H5TC4G63AFR-PBR)
  • Low voltage operation (frente a MT41K256M16HA-125)
  • Pin compatibility with newer Hynix parts (frente a H5TC4G63CFR-PBA)

Notas de diseño

The H5TC4G63AFR-PBI requires a stable 1.35V supply for VDD and VDDQ. Use low-ESR ceramic capacitors (0.1uF and 1uF) placed close to each power pin to decouple high-frequency noise. A bulk capacitor (10uF) should be placed near the memory device to handle transient currents during refresh and burst operations. Ensure the power supply can deliver peak current without voltage droop.

Follow the PCB layout guidelines in the SK Hynix datasheet to minimize signal integrity issues. Route DQ, DQS, and address/command lines with matched lengths to maintain timing. Use ground planes beneath the memory to reduce noise. Place termination resistors for ODT as recommended. Keep the clock traces short and shielded to avoid crosstalk.

The industrial temperature range (-40°C to +95°C) allows operation in harsh environments, but proper thermal management is still required. Ensure adequate airflow or heatsinking if the device is placed near other heat-generating components. The 96-ball FBGA package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values and design accordingly.

Información de cumplimiento

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

RoHS compliant per Kynix product page. Not AEC-Q100 qualified. Other compliance data not available in provided sources.

Datos verificados el: 2026-08-19 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

SK Hynix H5TC4G63AFR-PBI H5TC4G63AFR-PBR H5TC4G63CFR-PBA MT41K256M16HA-125 DDR3L SDRAM FBGA TFBGA RoHS AEC-Q100 industrial temperature networking embedded computing CMOS DLL ODT CAS latency
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