EP1SGX25DF672C6N - Stratix GX FPGA, 25K LE, 672-FBGA | Intel (Altera)
MPN: EP1SGX25DF672C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265.5 | $2,655.00 |
| 100 | $245.75 | $24,575.00 |
| 500 | $228 | $114,000.00 |
| 1,000 | $210 | $210,000.00 |
Drop-in alternatives for EP1SGX25DF672C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25DF672C6
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View Datasheet →EP1SGX25DF672C5N
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View Datasheet →EP1SGX25CF672C5
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View Datasheet →EP1SGX25DF672C6N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix GX (Stratix I GX) |
| Logic Elements / Cells | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| User I/O Count | 455 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Package | FBGA-672 (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Operating Temperature | 0C to 85C (commercial) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| HTSUS Code | 8542.39.0001 |
| RoHS Status | Lead Free (per part suffix 'N' designator) |
| Pin Count | 672 |
EP1SGX25DF672C6N Pin Configuration
| Pin A1 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file for ball-specific function (FBGA-672 multi-function pins) |
| Pin B1 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin A2 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin B2 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin A3 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin B3 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin A4 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin B4 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin A5 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin B5 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin A6 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin B6 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin A7 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin B7 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin A8 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin B8 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin A9 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin B9 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin A10 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Pin B10 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF672C6N is suitable for 6 applications: Telecom Line Card Aggregation, High-Speed Serial Protocol Bridging, Video and Image Processing Pipelines, Military and Aerospace Signal Processing, Industrial Control and Test Equipment, Legacy Replacement and Long-Life Maintenance.
Telecom Line Card Aggregation
The EP1SGX25DF672C6N's 25,660 logic elements and integrated high-speed transceiver channels make it well suited for telecom line-card aggregation, where multiple SERDES lanes must be bonded, packetized, and forwarded to a framer. With 455 user I/Os, designers can connect parallel SFI buses, tributary framers, and control-plane microcontrollers without external bridging logic. Its 1.5 V core combined with 130 nm CMOS process delivers deterministic latency required for telecom timing budgets. Quartus II IP cores support POS-PHY, SPI-4.2, and UTOPIA interfaces out of the box, accelerating time to market for legacy and next-gen line cards.
Recommended
High-Speed Serial Protocol Bridging
Stratix GX transceivers let the EP1SGX25DF672C6N bridge between proprietary SERDES rates and standard protocols such as PCIe, XAUI, or custom backplane links. The 25K logic cell budget absorbs protocol stacks, link-training state machines, and DMA controllers on a single die, eliminating the need for a companion protocol ASIC. The FBGA-672 package with 1.0 mm pitch provides the controlled-impedance environment required for multi-gigabit signal integrity. Designers can use Quartus II's Transceiver Toolkit to characterize eye diagrams and tune pre-emphasis on a per-channel basis.
Recommended
Video and Image Processing Pipelines
With 2,566 LABs and dedicated DSP blocks, the EP1SGX25DF672C6N implements real-time video scaling, deinterlacing, and color-space conversion pipelines for broadcast and surveillance equipment. The 455 user I/Os accept parallel BT.1120, DVI, or LVDS video streams and drive multi-format HDMI/DVI output stages without external bus switches. The 1.5 V core keeps power within a manageable envelope for fan-cooled video appliances, while the 0C-85C operating range supports standard commercial chassis. Reference designs from Altera provide head-start IP for SDI, DisplayPort, and HD-SDI transport.
Recommended
Military and Aerospace Signal Processing
Although the EP1SGX25DF672C6N is commercial-grade (0C-85C), its high logic density and SERDES resources are commonly used as the development platform for ruggedized signal-processing subsystems that later transition to industrial-temperature Stratix GX parts. The FBGA-672 package supports controlled-impedance routing required by radar, EW, and SIGINT signal chains. Designers prototype the digital front-end on commercial parts and migrate to EP1SGX25 variants with industrial or military temperature grades once the architecture stabilizes, preserving Quartus II project compatibility across the swap.
Recommended
Industrial Control and Test Equipment
Programmable-logic test platforms for industrial control use the EP1SGX25DF672C6N's 25K LEs to host custom stimulus generators, protocol emulators, and high-speed digitizer interfaces on a single FPGA. The 455 I/Os accept parallel ADC/DAC buses, isolated GPIO, and encoder feedback channels used in motor control and precision test. Quartus II's SignalTap logic analyzer embedded in the silicon allows non-intrusive debug during burn-in, eliminating the need for external logic analyzers in production test racks. The 1.5 V core plus PLLs simplifies multi-clock-domain timing for mixed-rate industrial protocols.
Recommended
Legacy Replacement and Long-Life Maintenance
Because the EP1SGX25DF672C6N is obsolete, long-life programs in medical, industrial, and transportation infrastructure often must keep equivalent parts available for repair and spare-pool replenishment. Verified drop-in alternates such as EP1SGX25DF672C5N, EP1SGX25CF672C7N, and EP1SGX25CF672C6N share the FBGA-672 footprint, allowing qualified re-work on existing boards. Field engineers can re-spin service stock by sourcing the same Quartus II bitstream across these variants, provided the timing closure is re-validated. This protects multi-decade service commitments on deployed equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF672C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF672C6 | EP1SGX25DF672C5N | EP1SGX25CF672C7N | EP1SGX25CF672C6N | EP1SGX25CF672C5 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-672 (33x33 mm, 1.0 mm pitch) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O Count | 455 | 455 | 455 | 455 | 455 | 455 |
| Speed Grade | C6 | C6 | C5 (slower) | C7 (faster) | C6 | C5 (slower) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS / Lead-Free | Yes (lead-free, 'N' suffix) | No (SnPb finish) | Yes | Yes | Yes | No (SnPb finish) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Drop-in interchangeable with full family (vs EP1SGX25DF672C5N)
- Higher-density Stratix GX 25K variant for richer pipelines (vs EP1SGX10DF672C6N)
- Lead-free RoHS variant of the same die (vs EP1SGX25DF672C6)
Design Notes
FBGA-672 at 1.0 mm pitch requires a 4-to-6 layer PCB stack-up with matched-length differential routing and a continuous ground reference plane beneath every transceiver lane. Place 0.1 uF X7R decoupling capacitors within 2 mm of every VCC ball, with bulk 10-22 uF tantalum or polymer capacitors on each power rail. Route all high-speed SERDES lanes on the top microstrip layer with no more than two vias per TX/RX pair, and stitch ground vias along the lane edges to suppress return-path discontinuities.
Although the 130 nm Stratix GX FPGA is not the highest-power device in its class, a fully populated 25K-LE design with all transceivers active can dissipate 5-8 W. The FC-FBGA-672 package relies on the PCB top-side copper pour and forced airflow for cooling. Provide at least 4 cm^2 of contiguous top copper under the BGA, thermal vias to inner ground planes (0.3 mm drill, 0.6 mm pitch), and a low-velocity (~1 m/s) heatsink or fan in enclosed chassis to keep junction temperature below 100C.
Do not assume pin compatibility with the smaller FBGA-484 or FBGA-1020 Stratix GX parts; the FBGA-672 ball map is unique to this package and the 672-ball family. When migrating to EP1SGX25DF1020 variants, expect a complete BGA re-ball, pin remapping, and Quartus II device re-assignment. Also verify that all configuration pins (MSEL, nCE, nCONFIG, DATA, DCLK) are pulled correctly during power-up - misconfigured MSEL pins are a common cause of silent configuration failure on first prototypes.
Compliance Information
Lead-free per 'N' suffix; HTSUS 8542.39.0001 confirmed by DigChip listing. REACH, halogen-free, and conflict-minerals declarations not explicitly provided in verified web data.
