S912XEP100W1MALR - 16-bit MCU, 1MB Flash, 50MHz | NXP
Référence : S912XEP100W1MALR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.66 | $14,66 |
| 10 | $13.8 | $138,00 |
| 100 | $12.95 | $1 295,00 |
| 500 | $12.1 | $6 050,00 |
| 1 000 | $11.25 | $11 250,00 |
S912XEP100W1MALR Présentation
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripherals into one chip. Within the system hierarchy, the MCU sits at the heart of an embedded system, sitting above discrete logic and below application processors. The 16-bit HCS12X family from NXP (originally Freescale Semiconductor) is a widely deployed automotive and industrial control architecture descended from the HC12/HCS12 lineage, with an enhanced instruction set and XGATE co-processor concept for peripheral offload.
Key features of this device include 1 MB of Flash program memory for large application code, a 50 MHz bus-capable S12X core, and automotive temperature qualification from -40C to +125C. Connectivity peripherals cover CANbus, EBI/EMI, I2C, IrDA, SCI (UART), and SPI, making the part a natural fit for multi-node in-vehicle networks. System peripherals include low-voltage detect (LVD), power-on reset (POR), PWM, and a watchdog timer (WDT).
The device integrates 91 general-purpose I/O lines, giving designers ample pin budget for switch monitoring, relay driving, and sensor interfaces. According to the S912XEP100W1MAL specifications, the part operates from 3.3V/5V supply rails typical of automotive electrical environments and ships in Tape & Reel (T/R) packing for automated assembly. The XEP100 family also includes EEPROM and RAM on chip, supporting calibration data storage without external memory.
Typical applications include body control modules, gateway nodes on CAN networks, HVAC controllers, instrument clusters, industrial motor control, and building automation. The combination of CAN connectivity, wide temperature rating, and 1 MB Flash suits nodes that must store large lookup tables or firmware images.
Design consideration: validate Flash programming and erase endurance against the reference manual for your end-of-line flash update strategy, and budget the 112-LQFP thermal footprint when running at full 50 MHz in high ambient temperatures.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone. Pricing data as of 2026-10-18.
Alternatives de remplacement direct pour S912XEP100W1MALR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912XEP100W1MALR (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Flash Memory, Qualification, Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12XEP100MAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XEP768CAG
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →MC9S12XEQ384CAG
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →S912XET512J2VAGR
✅ Remplacement direct✓ En stock
$1 / unité
Voir la fiche technique →S912XEG384J2VAL
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →S912XEP100W1MALR Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12X (S12X) |
| Core Size | 16-bit |
| Maximum Clock Speed | 50 MHz |
| Program Memory Size | 1 MB (1M x 8) |
| Program Memory Type | FLASH |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Number of I/O | 91 |
| Tension d'alimentation | 3.3 V / 5 V |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 112-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Terminal Form | Gull Wing |
| Qualification | Automotive Qualified (AEC) / Temperature Grade: Automotive |
| Series | HCS12X (S12XE Family) |
| Packaging | Tape & Reel (T/R) |
| Part Status | Active |
Guide de configuration des broches du S912XEP100W1MALR 112-lqfp (20x20 mm)
Configuration des broches du S912XEP100W1MALR (boîtier 112-lqfp (20x20 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour S912XEP100W1MALR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
S912XEP100W1MALR convient pour 6 applications: Automotive Body Control Module, CAN Network Gateway Node, Industrial Motor Control, Instrument Cluster, HVAC and Climate Control, Building Automation and Access Control.
Automotive Body Control Module
The S912XEP100W1MALR fits body control modules because it combines an automotive-qualified -40C to +125C temperature rating with 91 I/O lines and multiple PWM channels for lamp, relay, and motor load control. Its CANbus interface connects the module to the vehicle network, while the 1 MB Flash stores extensive diagnostic routines, configuration datasets, and OTA-ready bootloader code. The LVD and POR peripherals protect against brown-out conditions common in automotive electrical systems. Placed as the main controller with a CAN transceiver on the bus, the MCU offloads load diagnostics to software while meeting OEM thermal requirements without external supervision complexity. Reduced cost of consolidating multiple discrete monitors into one 16-bit MCU is a key benefit.
Recommandé
CAN Network Gateway Node
Gateway nodes bridging multiple CAN segments benefit from the S912XEP100W1MALR's 50 MHz S12X core and its 1 MB Flash, which accommodates protocol stacks, routing tables, and diagnostic databases (DTCs) for multi-network vehicles. The SCI, SPI, and I2C interfaces allow the same controller to service LIN-bridge or sensor sub-buses, while the EBI/EMI external bus can attach supplementary RAM or FPGA-based routing logic when frame buffering demands exceed on-chip resources. The watchdog timer supports ISO-functional-safety-style recovery behavior on message faults. Positioned between high-speed and low-speed CAN channels via external transceivers, the device routes messages with deterministic 16-bit interrupt latency headroom, and the industrial temperature equivalence makes it usable in off-highway gateway designs as well.
Recommandé
Industrial Motor Control
In industrial motor control, the S912XEP100W1MALR's PWM peripherals generate gate or drive signals while the 50 MHz core executes field-oriented or scalar control loops. Its 91 I/O lines interface limit switches, encoders, and status indicators, and the CAN or SCI link connects to a factory supervisory controller. The -40C to +125C range and LVD/POR protection give robust behavior in electrically noisy cabinet environments where supply sags and temperature swings are routine. The 1 MB Flash supports field-upgradable firmware with a resident bootloader plus a full golden-image fallback. With a gate driver and current-sense front end, the MCU closes current loops at several kHz with margin, and its 5V-native I/O simplifies interfacing to legacy industrial sensors.
Recommandé
Instrument Cluster
The S912XEP100W1MALR suits instrument clusters because its 1 MB Flash stores gauge lookup tables, language packs, and telltale logic, while the 50 MHz core drives stepper-motor gauge pointers through PWM-derived waveforms and services CAN messages for speed, RPM, and warning states. The -40C to +125C automotive qualification covers dashboard thermal extremes from cold soak to solar load. SCI and LIN-capable serial ports connect to lighting and chime subsystems, and the 91 I/O support backlight control and switch monitoring. Deployed with CAN transceivers and a voltage regulator tolerant of load-dump events, the MCU provides a single-chip cluster controller; its large memory removes the need for external Flash, improving reliability under vibration.
Recommandé
HVAC and Climate Control
Automotive and building HVAC controllers leverage the S912XEP100W1MALR's PWM outputs for blower and damper actuation, its I2C/SPI ports for temperature and pressure sensor acquisition, and its CAN/SCI links for zone or vehicle-network coordination. The wide -40C to +125C rating handles engine-bay-adjacent mounting, and the 1 MB Flash holds fuzzy-control tables and fault-log history without external memory. LVD and POR ensure state integrity across crank and brown-out events. In a typical topology, the MCU reads NTC or digital sensors over I2C, executes a PID loop at tens of Hz, and drives MOSFET pre-drivers via PWM, achieving quiet variable-speed blower control with deterministic response and no external controller IC.
Recommandé
Building Automation and Access Control
The S912XEP100W1MALR serves building automation nodes where CAN, SCI, and SPI connectivity links door controllers, sensor arrays, and supervisory panels. Its 91 I/O drive locks, relays, and indicator LEDs, while the 1 MB Flash supports event logging, credential databases, and field-updatable access-rule firmware. The -40C to +125C range permits unconditioned outdoor or rooftop installation, and the watchdog timer guarantees recovery from lockups that would otherwise strand a door in an unsafe state. Operating from a 5V rail native to legacy alarm wiring simplifies power design. The 50 MHz S12X core handles encryption-lite protocols and multi-node polling with comfortable cycle margin, consolidating what previously needed a controller plus external memory ICs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912XEP100W1MALR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12XEP100MAL | MC9S12XEP768CAG | S912XET512J2VAGR | S912XEG384J2VAL |
|---|---|---|---|---|---|
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | LQFP/QFP 112-class package - verify suffix | QFP-class package - verify suffix | QFP-class package - verify suffix |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Speed | HCS12X, 50 MHz | HCS12X, 50 MHz | HCS12X, 50 MHz | HCS12X, 50 MHz | HCS12X, 50 MHz |
| Flash Memory | 1 MB (1M x 8) | 1 MB | 768 KB | 512 KB | 384 KB |
| Connectivity | CAN, EBI/EMI, I2C, IrDA, SCI, SPI | CAN, I2C, SCI, SPI (same die) | CAN, I2C, SCI, SPI | CAN, I2C, SCI, SPI | CAN, I2C, SCI, SPI |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Principaux différenciateurs
- Largest Flash in the S12XE family on this listing (vs S912XET512J2VAGR)
- Direct same-die substitute availability (vs MC9S12XEP100MAL)
- Memory headroom trade-off vs cost (vs S912XEG384J2VAL)
Notes de conception
The S12XE family includes multiple Flash sizes (384 KB to 1 MB) sharing one reference manual, and package suffixes (MAL, CAG, VAL, MAG) denote different pinouts and pin counts. Before substituting any S12XE part on an existing PCB, confirm both the pinout chapter and the memory map section of the MC9S12XE Family Reference Manual against your board. Mask-set differences between MC9S12XEP100MAL and S912XEP100W1MAL were raised on NXP's community forum - confirm errata applicability for your mask revision before release.
The device operates from 3.3V/5V rails typical of automotive systems. Apply the LVD and POR peripherals as intended: enable low-voltage reset thresholds appropriate to your rail (5V systems should not reuse 3.3V threshold settings) and provide bulk plus 0.1 uF ceramic decoupling at each VDD pin pair of the 112-LQFP. During crank or load-dump events, ensure the upstream regulator clamps within the absolute maximum ratings stated in the datasheet electrical chapter.
The 112-LQFP (20x20 mm, 0.5 mm pitch) footprint requires careful land-pattern compliance for reliable gull-wing solder joints in automotive assembly. Route CAN pairs as controlled-impedance differential traces with a common-mode choke near the transceiver, keep the crystal loop short with guard ground, and provide thermal relief vias under any exposed thermal features. Verify Flash programming access (BDM/debug header) is testable on the assembled board for end-of-line programming.
Informations de conformité
NXP product page and Mouser listing state the part is Automotive Qualified and rated -40C to +125C. Explicit RoHS/REACH/lead-free certificate status was not stated in the verified web data; obtain the compliance certificate from NXP's product page.
