MPX10DP vs MPXC2011DT1 तुलना
विस्तृत दोनों ओर की तुलना MPX10DP द्वारा STMicroelectronics और MPXC2011DT1 द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
STMicroelectronics
MPX10DP - 10kPa Differential Pressure Sensor 35mV | STMicroelectronics
MPX10DP ✓ सक्रियNXP Semiconductors
MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP
MPXC2011DT1 ✓ सक्रियविशेषता तुलना
| पैरामीटर | MPX10DP | MPXC2011DT1 |
|---|---|---|
| ब्रांड | STMicroelectronics | NXP Semiconductors |
| श्रेणी | Pressure Sensors | Pressure Sensors |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 kPa to 10 kPa (0 to 1.45 PSI) | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| आउटपुट प्रकार | Analog Wheatstone bridge (uncompensated) | Analog Wheatstone bridge (ratiometric) |
| Output Voltage Span | 0 mV to 35 mV at 3 V excitation | — |
| Supply Voltage (Excitation) | 3 V DC typical | — |
| Port Configuration | Dual male 0.19 in (4.93 mm) tube, axial | — |
| पैकेज / केस | 4-SIP Module | — |
| माउंटिंग प्रकार | Through-Hole | Through-hole (PCB mount with side-port tubing) |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature range] | 0 °C to +85 °C |
| Bridge Impedance | [DATA_NEEDED: input/output bridge resistance] | — |
| Linearity | [DATA_NEEDED: linearity %FS] | — |
| Temperature Compensation | None (uncompensated) | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status not in web data] |
| Media Compatibility | Dry gases (non-corrosive) | — |
| Full-Scale Output | — | 25 mV typical at 10 V excitation |
| Sensitivity | — | 2.5 mV/kPa typical |
| Excitation Voltage | — | 3 V DC to 10 V DC (10 V nominal) |
| पैकेज | — | 4-SSIP Chip Pak module, side port |
| Port Style | — | Female, 3.25 mm (0.128 in) barbed side port |
| Termination Style | — | Through-hole PCB, 4 leads |
| Compensation | — | On-chip temperature compensated and calibrated |
| Technology | — | Piezoresistive silicon strain gauge |
| Module Dimensions | — | 7.6 mm x 12.8 mm nominal |