MPX10DP vs MPXC2011DT1 Perbandingan
Perbandingan bersamaan detil MPX10DP dari STMicroelectronics dan MPXC2011DT1 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
STMicroelectronics
MPX10DP - 10kPa Differential Pressure Sensor 35mV | STMicroelectronics
MPX10DP ✓ AktifNXP Semiconductors
MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP
MPXC2011DT1 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MPX10DP | MPXC2011DT1 |
|---|---|---|
| Merek | STMicroelectronics | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Aktif |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 kPa to 10 kPa (0 to 1.45 PSI) | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Tipe Output | Analog Wheatstone bridge (uncompensated) | Analog Wheatstone bridge (ratiometric) |
| Output Voltage Span | 0 mV to 35 mV at 3 V excitation | — |
| Supply Voltage (Excitation) | 3 V DC typical | — |
| Port Configuration | Dual male 0.19 in (4.93 mm) tube, axial | — |
| Paket / Case | 4-SIP Module | — |
| Tipe Mounting | Through-Hole | Through-hole (PCB mount with side-port tubing) |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | 0 °C to +85 °C |
| Bridge Impedance | [DATA_NEEDED: input/output bridge resistance] | — |
| Linearity | [DATA_NEEDED: linearity %FS] | — |
| Temperature Compensation | None (uncompensated) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status not in web data] |
| Media Compatibility | Dry gases (non-corrosive) | — |
| Full-Scale Output | — | 25 mV typical at 10 V excitation |
| Sensitivity | — | 2.5 mV/kPa typical |
| Excitation Voltage | — | 3 V DC to 10 V DC (10 V nominal) |
| Paket | — | 4-SSIP Chip Pak module, side port |
| Port Style | — | Female, 3.25 mm (0.128 in) barbed side port |
| Termination Style | — | Through-hole PCB, 4 leads |
| Compensation | — | On-chip temperature compensated and calibrated |
| Technology | — | Piezoresistive silicon strain gauge |
| Module Dimensions | — | 7.6 mm x 12.8 mm nominal |