10AX090S3F45I2SG vs 10AX090S3F45E2LG Perbandingan
Perbandingan bersamaan detil 10AX090S3F45I2SG dari Intel dan 10AX090S3F45E2LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AX090S3F45I2SG | 10AX090S3F45E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory Bits | 59,234,304 | — |
| User I/Os | 624 | — |
| Process Technology | 20 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Paket | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45, 45mm flip-chip BGA) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Temperature Grade | Industrial | — |
| Speed Grade | I2 | S3 (-2 speed grade equivalent) |
| Transceivers | Up to 96 (12.5 Gbps chip-to-chip) | 624 (per package aggregate channels) |
| Hard PCIe IP | PCIe Gen3 x8 (backwards compatible to Gen2/Gen1) | — |
| Hard Memory Controllers | 2 (DDR4, DDR3, QDRIV, RLDRAM3) | — |
| DSP Blocks | Variable-precision, up to ~1.5 TFLOPs FP32 | 1,518 |
| LVDS Channels | Up to 1.6 Gbps | — |
| Status RoHS | Compliant | Compliant |
| Adaptive Logic Modules (ALMs) | — | 339,620 |
| Embedded Memory (bits) | — | 59,234,304 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) |
| Process Node | — | TSMC 20nm |
| Core Voltage (nominal) | — | 0.9 V |
| User I/O Banks | — | 12 |
| Maximum User I/O | — | 624 |
| Rentang Suhu Kerja | — | 0C to 100C (E2 commercial) |
| Memory Interfaces | — | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 |