10AX090S3F45I2SG vs 10AX090S3F45E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090S3F45I2SG sa pamamagitan ng Intel at 10AX090S3F45E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090S3F45I2SG | 10AX090S3F45E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory Bits | 59,234,304 | — |
| User I/Os | 624 | — |
| Process Technology | 20 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Packhaging | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45, 45mm flip-chip BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature Grade | Industrial | — |
| Speed Grade | I2 | S3 (-2 speed grade equivalent) |
| Transceivers | Up to 96 (12.5 Gbps chip-to-chip) | 624 (per package aggregate channels) |
| Hard PCIe IP | PCIe Gen3 x8 (backwards compatible to Gen2/Gen1) | — |
| Hard Memory Controllers | 2 (DDR4, DDR3, QDRIV, RLDRAM3) | — |
| DSP Blocks | Variable-precision, up to ~1.5 TFLOPs FP32 | 1,518 |
| LVDS Channels | Up to 1.6 Gbps | — |
| Tindminan RoHS | Compliant | Compliant |
| Adaptive Logic Modules (ALMs) | — | 339,620 |
| Embedded Memory (bits) | — | 59,234,304 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) |
| Process Node | — | TSMC 20nm |
| Core Voltage (nominal) | — | 0.9 V |
| User I/O Banks | — | 12 |
| Maximum User I/O | — | 624 |
| Hanay ng Temperature na Operasyon | — | 0C to 100C (E2 commercial) |
| Memory Interfaces | — | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 |