10AX090S3F45I2SG vs 10AX090S3F45E2LG 比較

詳細並排比較 10AX090S3F45I2SG 由 Intel 與 10AX090S3F45E2LG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 10AX090S3F45I2SG 10AX090S3F45E2LG
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series Arria 10 GX Arria 10 GX
Logic Elements 900,000 900,000
Embedded Memory Bits 59,234,304 —
User I/Os 624 —
Process Technology 20 nm —
Core Supply Voltage 0.9 V —
封裝 1932-ball FCBGA (F45) 1932-ball FCBGA (F45, 45mm flip-chip BGA)
安裝類型 Surface Mount Surface Mount (BGA)
Temperature Grade Industrial —
Speed Grade I2 S3 (-2 speed grade equivalent)
Transceivers Up to 96 (12.5 Gbps chip-to-chip) 624 (per package aggregate channels)
Hard PCIe IP PCIe Gen3 x8 (backwards compatible to Gen2/Gen1) —
Hard Memory Controllers 2 (DDR4, DDR3, QDRIV, RLDRAM3) —
DSP Blocks Variable-precision, up to ~1.5 TFLOPs FP32 1,518
LVDS Channels Up to 1.6 Gbps —
RoHS 狀態 Compliant Compliant
Adaptive Logic Modules (ALMs) — 339,620
Embedded Memory (bits) — 59,234,304
Maximum Transceiver Data Rate — 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT)
Process Node — TSMC 20nm
Core Voltage (nominal) — 0.9 V
User I/O Banks — 12
Maximum User I/O — 624
工作溫度範圍 — 0C to 100C (E2 commercial)
Memory Interfaces — DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3

資料表與資源

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