10AX090S3F45I2SG vs 10AX090S3F45E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX090S3F45I2SG disebabkan oleh Intel dan 10AX090S3F45E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX090S3F45I2SG | 10AX090S3F45E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory Bits | 59,234,304 | — |
| User I/Os | 624 | — |
| Process Technology | 20 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Kemasan | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45, 45mm flip-chip BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Temperature Grade | Industrial | — |
| Speed Grade | I2 | S3 (-2 speed grade equivalent) |
| Transceivers | Up to 96 (12.5 Gbps chip-to-chip) | 624 (per package aggregate channels) |
| Hard PCIe IP | PCIe Gen3 x8 (backwards compatible to Gen2/Gen1) | — |
| Hard Memory Controllers | 2 (DDR4, DDR3, QDRIV, RLDRAM3) | — |
| DSP Blocks | Variable-precision, up to ~1.5 TFLOPs FP32 | 1,518 |
| LVDS Channels | Up to 1.6 Gbps | — |
| Status RoHS | Compliant | Compliant |
| Adaptive Logic Modules (ALMs) | — | 339,620 |
| Embedded Memory (bits) | — | 59,234,304 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) |
| Process Node | — | TSMC 20nm |
| Core Voltage (nominal) | — | 0.9 V |
| User I/O Banks | — | 12 |
| Maximum User I/O | — | 624 |
| Gambaran Suhu Operasi | — | 0C to 100C (E2 commercial) |
| Memory Interfaces | — | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 |