EP1SGX10DF672I6N vs EP1SGX10DF672I6 Perbandingan

Perbandingan bersamaan detil EP1SGX10DF672I6N dari Intel dan EP1SGX10DF672I6 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP1SGX10DF672I6N EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP1SGX10DF672I6N EP1SGX10DF672I6
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir Obsolete
Series Stratix GX —
Family Stratix GX (EP1SGX) Stratix GX
Logic Elements 10,570 —
Logic Cells 10,570 —
CLBs (Logic Array Blocks) 1,200 LABs / 1200 CLBs —
Total RAM Bits 920,448 bits —
User I/O Pins 362 —
Package Type FBGA-672 (FineLine BGA) —
Package Code BGA, 672 balls —
Package Dimensions 33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch —
Tipe Mounting Surface Mount Surface Mount
Core Supply Voltage 1.5 V (1.425 V to 1.575 V) 1.5 V
Suhu Kerja 0 C to 85 C (Industrial, "I" grade) 0 C to +85 C (commercial)
Logic Family CMOS —
Lead Free Status Lead Free (FBGA-672, per Ampheo listing) —
Status RoHS Compliant [DATA_NEEDED: RoHS Status]
Logic Elements (LEs) — 10,570
Embedded RAM — 920,448 bits
Embedded Multipliers — Yes (DSP blocks)
Transceiver Channels — 12 (3.125 Gbps)
Maximum User I/O — 362
PLLs — 4
Process Technology — 130 nm CMOS
Paket — 672-ball FC-FBGA (DF672)
Package Body Size — 33 x 33 mm, 1.0 mm pitch
Level MSL — [DATA_NEEDED: MSL Level]

Spek dan Sumber

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