EP1SGX10DF672I6N vs EP1SGX10DF672I6 比較

詳細並排比較 EP1SGX10DF672I6N 由 Intel 與 EP1SGX10DF672I6 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP1SGX10DF672I6N EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N ⚠ 最後購買機會

規格比較

參數 EP1SGX10DF672I6N EP1SGX10DF672I6
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 Obsolete
Series Stratix GX —
Family Stratix GX (EP1SGX) Stratix GX
Logic Elements 10,570 —
Logic Cells 10,570 —
CLBs (Logic Array Blocks) 1,200 LABs / 1200 CLBs —
Total RAM Bits 920,448 bits —
User I/O Pins 362 —
Package Type FBGA-672 (FineLine BGA) —
Package Code BGA, 672 balls —
Package Dimensions 33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch —
安裝類型 Surface Mount Surface Mount
Core Supply Voltage 1.5 V (1.425 V to 1.575 V) 1.5 V
工作溫度 0 C to 85 C (Industrial, "I" grade) 0 C to +85 C (commercial)
Logic Family CMOS —
Lead Free Status Lead Free (FBGA-672, per Ampheo listing) —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS Status]
Logic Elements (LEs) — 10,570
Embedded RAM — 920,448 bits
Embedded Multipliers — Yes (DSP blocks)
Transceiver Channels — 12 (3.125 Gbps)
Maximum User I/O — 362
PLLs — 4
Process Technology — 130 nm CMOS
封裝 — 672-ball FC-FBGA (DF672)
Package Body Size — 33 x 33 mm, 1.0 mm pitch
MSL 等級 — [DATA_NEEDED: MSL Level]

資料表與資源

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