EP1SGX10DF672I6N vs EP1SGX10DF672I6 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX10DF672I6N sa pamamagitan ng Intel at EP1SGX10DF672I6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP1SGX10DF672I6N EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP1SGX10DF672I6N EP1SGX10DF672I6
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Series Stratix GX —
Family Stratix GX (EP1SGX) Stratix GX
Logic Elements 10,570 —
Logic Cells 10,570 —
CLBs (Logic Array Blocks) 1,200 LABs / 1200 CLBs —
Total RAM Bits 920,448 bits —
User I/O Pins 362 —
Package Type FBGA-672 (FineLine BGA) —
Package Code BGA, 672 balls —
Package Dimensions 33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch —
Uri ng Pagpapasok Surface Mount Surface Mount
Core Supply Voltage 1.5 V (1.425 V to 1.575 V) 1.5 V
Temperature na Operasyon 0 C to 85 C (Industrial, "I" grade) 0 C to +85 C (commercial)
Logic Family CMOS —
Lead Free Status Lead Free (FBGA-672, per Ampheo listing) —
Tindminan RoHS Compliant [DATA_NEEDED: RoHS Status]
Logic Elements (LEs) — 10,570
Embedded RAM — 920,448 bits
Embedded Multipliers — Yes (DSP blocks)
Transceiver Channels — 12 (3.125 Gbps)
Maximum User I/O — 362
PLLs — 4
Process Technology — 130 nm CMOS
Packhaging — 672-ball FC-FBGA (DF672)
Package Body Size — 33 x 33 mm, 1.0 mm pitch
Level ng MSL — [DATA_NEEDED: MSL Level]

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