EP3SE50F780C2N vs EP3SE260H780C2N Perbandingan

Perbandingan bersamaan detil EP3SE50F780C2N dari Intel dan EP3SE260H780C2N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE50F780C2N EP3SE260H780C2N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Waktu Pembelian Terakhir
Family Stratix III Enhanced (E) —
Logic Elements 47,500 255,000
Adaptive Logic Modules (ALMs) 19,000 —
Embedded Memory 5,760,000 bits —
DSP Blocks Yes (number not in source data) —
User I/O Count 488 488
Transceiver Channels 12 (data rate not in source data) —
Process Technology 65 nm CMOS —
Core Voltage 0.9 V to 1.1 V 0.9 V
Maximum Internal Clock Frequency 600 MHz —
Paket 780-ball FC-FBGA (FBGA-780) 780-BGA FCBGA
Speed Grade C2 C2
Temperature Grade Commercial (C2) —
Tipe Mounting Surface Mount (BGA) Surface Mount
Lead Free Yes —
Configuration Mode Passive Serial / Fast Passive Parallel —
Series — Stratix III E
LABs / CLBs — 10,200
Total RAM Bits — 16,672,768
Number of Transceivers — [DATA_NEEDED: transceiver count]
Rentang Suhu Kerja — Commercial (0C to +85C)
Level MSL — 3 (168 hours)
Reflow Peak Time Max — 40 s
Status RoHS — [DATA_NEEDED: rohs status]
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780
Process Node — 40 nm

Spek dan Sumber

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