EP3SE50F780C2N vs EP3SE260H780C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F780C2N disebabkan oleh Intel dan EP3SE260H780C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE50F780C2N | EP3SE260H780C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Stratix III Enhanced (E) | — |
| Logic Elements | 47,500 | 255,000 |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Embedded Memory | 5,760,000 bits | — |
| DSP Blocks | Yes (number not in source data) | — |
| User I/O Count | 488 | 488 |
| Transceiver Channels | 12 (data rate not in source data) | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 0.9 V to 1.1 V | 0.9 V |
| Maximum Internal Clock Frequency | 600 MHz | — |
| Kemasan | 780-ball FC-FBGA (FBGA-780) | 780-BGA FCBGA |
| Speed Grade | C2 | C2 |
| Temperature Grade | Commercial (C2) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Lead Free | Yes | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel | — |
| Series | — | Stratix III E |
| LABs / CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Gambaran Suhu Operasi | — | Commercial (0C to +85C) |
| Aras MSL | — | 3 (168 hours) |
| Reflow Peak Time Max | — | 40 s |
| Status RoHS | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Number of Terminals | — | 780 |
| Process Node | — | 40 nm |