K4A8G085WC-BIWE vs K4A8G085WC-BCWE Perbandingan
Perbandingan bersamaan detil K4A8G085WC-BIWE dari Samsung Electronics dan K4A8G085WC-BCWE dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4A8G085WC-BIWE | K4A8G085WC-BCWE |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Status Stok | — | In Stock |
| Harga Unit (USD) | — | $7,38 |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gb |
| Organisasi | 1G x 8 | 1G x 8 |
| Laju Data | 3200 Mbps | 3200 Mbps (DDR4-3200) |
| Supply Voltage (VDD) | 1.2 V | — |
| Supply Voltage (VDDQ) | 1.2 V | — |
| Rentang Suhu Kerja | -40°C to +95°C | — |
| Paket | 78-FBGA | 78FBGA |
| Tipe Mounting | Surface Mount | Surface Mount |
| Antarmuka | POD-12 | DDR4 (parallel, double data rate) |
| Burst Length | 8 (BL8), 4 (BC4) | — |
| Latensi CAS | 22 (CL22) | — |
| Refresh | Auto-refresh, self-refresh | Standard DDR4 refresh mechanisms |
| Status RoHS | Compliant | Compliant (per JLCPCB listing) |
| Lead-Free | Yes | — |
| Tegangan Pemuat | — | 1.2 V |
| Suhu Kerja | — | 0C to +85C |
| Application Class | — | Computing / Embedded main memory |
| Manufacturer | — | Samsung Electronics |
| Bank Group Architecture | — | DDR4 bank groups (8n prefetch) |
| Speed Bin Suffix | — | -BCWE (DDR4-3200, commercial temp) |
| On-Die Termination | — | Yes (DDR4 ODT) |