K9QDGB8U7M vs K9MDG08U5M Perbandingan
Perbandingan bersamaan detil K9QDGB8U7M dari Samsung Electronics dan K9MDG08U5M dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K9QDGB8U7M | K9MDG08U5M |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Unknown | Aktif |
| Manufacturer | Samsung Electronics | — |
| Product Family | K9 NAND Flash | — |
| Tipe Memori | NAND Flash | MLC Large Block NAND Flash |
| Density | [DATA_NEEDED: Density] | 16 Gbit (2 GB) |
| Organisasi | [DATA_NEEDED: Organization] | 16G x 8 bit |
| Tipe Antarmuka | [DATA_NEEDED: Interface Type] | — |
| Tegangan Pemuat | [DATA_NEEDED: Supply Voltage] | — |
| Page Size | [DATA_NEEDED: Page Size] | [DATA_NEEDED: page size] |
| Block Size | [DATA_NEEDED: Block Size] | [DATA_NEEDED: block size] |
| Program/Erase Endurance | [DATA_NEEDED: Program/Erase Endurance] | — |
| Read Latency | [DATA_NEEDED: Read Latency] | — |
| Package Type | BGA (surface mount) | — |
| Suhu Kerja | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS Status] | unknown |
| Cell Type | — | MLC (2 bits per cell) |
| Supply Voltage Min | — | 2.7 V |
| Supply Voltage Max | — | 3.6 V |
| Antarmuka | — | Asynchronous x8 multiplexed address/data |
| Paket | — | 48-pin TSOP1 dual stacked, 12 mm x 20 mm |
| Terminals | — | 48 |
| Circuits | — | 1 |
| Die Configuration | — | Dual stacked |
| Page Read Time (tR) | — | [DATA_NEEDED: tR] |
| Program Time (tPROG) | — | [DATA_NEEDED: tPROG] |