K9QDGB8U7M vs K9MDG08U5M Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K9QDGB8U7M disebabkan oleh Samsung Electronics dan K9MDG08U5M disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K9QDGB8U7M | K9MDG08U5M |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Unknown | Aktif |
| Manufacturer | Samsung Electronics | — |
| Product Family | K9 NAND Flash | — |
| Jenis Ingatan | NAND Flash | MLC Large Block NAND Flash |
| Density | [DATA_NEEDED: Density] | 16 Gbit (2 GB) |
| Organisasi | [DATA_NEEDED: Organization] | 16G x 8 bit |
| Jenis Antaramuka | [DATA_NEEDED: Interface Type] | — |
| Tegangan Pemberi Arus | [DATA_NEEDED: Supply Voltage] | — |
| Page Size | [DATA_NEEDED: Page Size] | [DATA_NEEDED: page size] |
| Block Size | [DATA_NEEDED: Block Size] | [DATA_NEEDED: block size] |
| Program/Erase Endurance | [DATA_NEEDED: Program/Erase Endurance] | — |
| Read Latency | [DATA_NEEDED: Read Latency] | — |
| Package Type | BGA (surface mount) | — |
| Suhu Operasi | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS Status] | unknown |
| Cell Type | — | MLC (2 bits per cell) |
| Supply Voltage Min | — | 2.7 V |
| Supply Voltage Max | — | 3.6 V |
| Antaramuka | — | Asynchronous x8 multiplexed address/data |
| Kemasan | — | 48-pin TSOP1 dual stacked, 12 mm x 20 mm |
| Terminals | — | 48 |
| Circuits | — | 1 |
| Die Configuration | — | Dual stacked |
| Page Read Time (tR) | — | [DATA_NEEDED: tR] |
| Program Time (tPROG) | — | [DATA_NEEDED: tPROG] |