MPC8306VMABDCA vs MPC8306SCVMABDCA Perbandingan
Perbandingan bersamaan detil MPC8306VMABDCA dari NXP Semiconductors dan MPC8306SCVMABDCA dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8306VMABDCA - PowerQUICC II Pro SoC, e300, 133MHz | NXP
MPC8306VMABDCA ✗ Akhir HidupNXP Semiconductors
MPC8306SCVMABDCA - PowerQUICC II Pro SoC 133MHz | NXP
MPC8306SCVMABDCA ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | MPC8306VMABDCA | MPC8306SCVMABDCA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | 1 |
| Lebar Bus Data | 32 bit | 32 bit |
| Core Frequency | 133 MHz | — |
| Memory Controller | DDR2 with ECC | DDR2 |
| Co-Processor / DSP | QUICC Engine (communications offload) | — |
| Ethernet | 2x 10/100 MAC with R/MII, IEEE 1588 v2 | Dual 10/100 MAC (R/MII) |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| CAN | CAN 2.0 | — |
| Serial Protocols | HDLC, TDM (time-slot) | — |
| Graphics Acceleration | No | — |
| Paket | 369-LFBGA (19x19 mm) | 369-PBGA MAP-BGA (19x19 mm) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Suhu Kerja | 0 °C to +105 °C | -40C to +105C (extended) |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Series | MPC83xx / PowerQUICC II Pro | — |
| Core | — | PowerPC e300c3 |
| Architecture | — | Power Architecture, 32-bit |
| Maximum Core Frequency | — | 133 MHz |
| Local Bus | — | 16-bit |
| Communications Engine | — | QUICC Engine (HDLC, TDM) |
| Time Synchronization | — | IEEE 1588 v2 |