MPC8306VMABDCA vs MPC8306SCVMABDCA Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8306VMABDCA sa pamamagitan ng NXP Semiconductors at MPC8306SCVMABDCA sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8306VMABDCA - PowerQUICC II Pro SoC, e300, 133MHz | NXP
MPC8306VMABDCA ✗ Tapus ng BuhayNXP Semiconductors
MPC8306SCVMABDCA - PowerQUICC II Pro SoC 133MHz | NXP
MPC8306SCVMABDCA ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MPC8306VMABDCA | MPC8306SCVMABDCA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Tapus ng Buhay |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | 1 |
| Width ng Data Bus | 32 bit | 32 bit |
| Core Frequency | 133 MHz | — |
| Memory Controller | DDR2 with ECC | DDR2 |
| Co-Processor / DSP | QUICC Engine (communications offload) | — |
| Ethernet | 2x 10/100 MAC with R/MII, IEEE 1588 v2 | Dual 10/100 MAC (R/MII) |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| CAN | CAN 2.0 | — |
| Serial Protocols | HDLC, TDM (time-slot) | — |
| Graphics Acceleration | No | — |
| Packhaging | 369-LFBGA (19x19 mm) | 369-PBGA MAP-BGA (19x19 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Temperature na Operasyon | 0 °C to +105 °C | -40C to +105C (extended) |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Series | MPC83xx / PowerQUICC II Pro | — |
| Core | — | PowerPC e300c3 |
| Architecture | — | Power Architecture, 32-bit |
| Maximum Core Frequency | — | 133 MHz |
| Local Bus | — | 16-bit |
| Communications Engine | — | QUICC Engine (HDLC, TDM) |
| Time Synchronization | — | IEEE 1588 v2 |