MPC8314ECVRAFDA vs MPC8314CVRAGDA Perbandingan
Perbandingan bersamaan detil MPC8314ECVRAFDA dari NXP Semiconductors dan MPC8314CVRAGDA dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8314ECVRAFDA - PowerQUICC II Pro SoC, 333MHz, 620-HBGA | NXP
MPC8314ECVRAFDA ✓ AktifNXP Semiconductors
MPC8314CVRAGDA - PowerQUICC II Pro 400MHz SoC | NXP | 620-HBGA
MPC8314CVRAGDA ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MPC8314ECVRAFDA | MPC8314CVRAGDA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Product Type | PowerQUICC II Pro Communications Processor | — |
| Core Architecture | Power Architecture e300c3 | PowerPC e300c3 |
| Lebar Bus Data | 32-bit | 32 bit |
| Maximum CPU Clock Frequency | 333 MHz | — |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| Memory Controller | DDR1 and DDR2 SDRAM | DDR1/DDR2, 32-bit |
| Gigabit Ethernet MACs | 2 (RGMII, MII/RGMII) | — |
| PCI Interface | 32-bit PCI v2.3 + PCI Express | PCI v2.3, 32-bit, up to 66 MHz |
| USB Interface | USB 2.0 Full-Speed / Low-Speed | — |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) | — |
| TDM Interface | Yes (TDM) | TDM (T1/E1) |
| Rentang Suhu Kerja | -40C to +105C (junction) | — |
| Paket | 620-HBGA (29x29 mm) | 620-HBGA (HCTE-BGA, 29x29 mm) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount, 1.0 mm ball pitch |
| Silicon Revision | Rev 1 | — |
| Status RoHS | See _validation_note | Compliant |
| Core Count | — | 1 |
| Frekuensi Bawah Maximum | — | 400 MHz |
| Instruction Cache | — | 16 KB |
| Data Cache | — | 16 KB |
| Ethernet | — | 2x 10/100/1000 Mbps GMII / RGMII |
| USB | — | USB 2.0 (Host/Device/OTG) |
| Encryption Engine | — | Not present (C-variant, non-encrypt) |
| Process Technology | — | 90 nm CMOS |
| Suhu Kerja | — | -40C to +105C |
| Tegangan Pemuat | — | Core 1.0 V, I/O 3.3 V (typical) |
| Level MSL | — | 3 (per JEDEC J-STD-020) |