MPC8314ECVRAFDA vs MPC8314CVRAGDA Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC8314ECVRAFDA sa pamamagitan ng NXP Semiconductors at MPC8314CVRAGDA sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC8314ECVRAFDA MPC8314ECVRAFDA - PowerQUICC II Pro SoC, 333MHz, 620-HBGA | NXP

MPC8314ECVRAFDA - PowerQUICC II Pro SoC, 333MHz, 620-HBGA | NXP

MPC8314ECVRAFDA ✓ Nakahanda
NXP Semiconductors
MPC8314CVRAGDA MPC8314CVRAGDA - PowerQUICC II Pro 400MHz SoC | NXP | 620-HBGA

MPC8314CVRAGDA - PowerQUICC II Pro 400MHz SoC | NXP | 620-HBGA

MPC8314CVRAGDA ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro MPC8314ECVRAFDA MPC8314CVRAGDA
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Huling Pagbili
Manufacturer NXP Semiconductors (formerly Freescale) —
Product Type PowerQUICC II Pro Communications Processor —
Core Architecture Power Architecture e300c3 PowerPC e300c3
Width ng Data Bus 32-bit 32 bit
Maximum CPU Clock Frequency 333 MHz —
L1 Instruction Cache 16 KB —
L1 Data Cache 16 KB —
Memory Controller DDR1 and DDR2 SDRAM DDR1/DDR2, 32-bit
Gigabit Ethernet MACs 2 (RGMII, MII/RGMII) —
PCI Interface 32-bit PCI v2.3 + PCI Express PCI v2.3, 32-bit, up to 66 MHz
USB Interface USB 2.0 Full-Speed / Low-Speed —
Security Engine SEC 2.0 (DES/3DES/AES/SHA) —
TDM Interface Yes (TDM) TDM (T1/E1)
Hanay ng Temperature na Operasyon -40C to +105C (junction) —
Packhaging 620-HBGA (29x29 mm) 620-HBGA (HCTE-BGA, 29x29 mm)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount, 1.0 mm ball pitch
Silicon Revision Rev 1 —
Tindminan RoHS See _validation_note Compliant
Core Count — 1
Maksimum na Taktiko ng Oras — 400 MHz
Instruction Cache — 16 KB
Data Cache — 16 KB
Ethernet — 2x 10/100/1000 Mbps GMII / RGMII
USB — USB 2.0 (Host/Device/OTG)
Encryption Engine — Not present (C-variant, non-encrypt)
Process Technology — 90 nm CMOS
Temperature na Operasyon — -40C to +105C
Volte ng Pagbibigay — Core 1.0 V, I/O 3.3 V (typical)
Level ng MSL — 3 (per JEDEC J-STD-020)

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