MPC8314ECVRAFDA vs MPC8314CVRAGDA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8314ECVRAFDA disebabkan oleh NXP Semiconductors dan MPC8314CVRAGDA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8314ECVRAFDA - PowerQUICC II Pro SoC, 333MHz, 620-HBGA | NXP
MPC8314ECVRAFDA ✓ AktifNXP Semiconductors
MPC8314CVRAGDA - PowerQUICC II Pro 400MHz SoC | NXP | 620-HBGA
MPC8314CVRAGDA ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | MPC8314ECVRAFDA | MPC8314CVRAGDA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Product Type | PowerQUICC II Pro Communications Processor | — |
| Core Architecture | Power Architecture e300c3 | PowerPC e300c3 |
| Lebar Bus Data | 32-bit | 32 bit |
| Maximum CPU Clock Frequency | 333 MHz | — |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| Memory Controller | DDR1 and DDR2 SDRAM | DDR1/DDR2, 32-bit |
| Gigabit Ethernet MACs | 2 (RGMII, MII/RGMII) | — |
| PCI Interface | 32-bit PCI v2.3 + PCI Express | PCI v2.3, 32-bit, up to 66 MHz |
| USB Interface | USB 2.0 Full-Speed / Low-Speed | — |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) | — |
| TDM Interface | Yes (TDM) | TDM (T1/E1) |
| Gambaran Suhu Operasi | -40C to +105C (junction) | — |
| Kemasan | 620-HBGA (29x29 mm) | 620-HBGA (HCTE-BGA, 29x29 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount, 1.0 mm ball pitch |
| Silicon Revision | Rev 1 | — |
| Status RoHS | See _validation_note | Compliant |
| Core Count | — | 1 |
| Frekuensi Klock Maksimum | — | 400 MHz |
| Instruction Cache | — | 16 KB |
| Data Cache | — | 16 KB |
| Ethernet | — | 2x 10/100/1000 Mbps GMII / RGMII |
| USB | — | USB 2.0 (Host/Device/OTG) |
| Encryption Engine | — | Not present (C-variant, non-encrypt) |
| Process Technology | — | 90 nm CMOS |
| Suhu Operasi | — | -40C to +105C |
| Tegangan Pemberi Arus | — | Core 1.0 V, I/O 3.3 V (typical) |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |