MPC860SRVR66D4 vs MPC860ENVR66D4 Perbandingan
Perbandingan bersamaan detil MPC860SRVR66D4 dari NXP Semiconductors dan MPC860ENVR66D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Waktu Beli TerakhirNXP Semiconductors
MPC860ENVR66D4 - 66MHz PowerQUICC MPU, 357-BBGA | NXP
MPC860ENVR66D4 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MPC860SRVR66D4 | MPC860ENVR66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Processor Type | MPC8xx PowerQUICC | MPC8xx PowerQUICC, 32-Bit |
| Core Architecture | PowerPC 32-bit | PowerPC Embedded |
| Number of Cores | 1 | 1 |
| Clock Speed | 66 MHz | — |
| Operating Voltage | 3.3 V (5 V tolerant I/O) | — |
| Instruction Cache | 4 Kbyte | 4 KB |
| Data Cache | 4 Kbyte | 4 KB |
| MMU | Yes | Yes (integrated) |
| Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/SPI/I2C) | — |
| Multiply-Accumulate (MAC) Unit | Yes | — |
| JTAG / Debug | IEEE 1149.1 compliant | — |
| Suhu Kerja | -40C to +95C | [DATA_NEEDED: operating temperature range] |
| Paket / Case | 357-PBGA (25 mm x 25 mm) | 357-PBGA (25x25 mm) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Packaging (Shipping) | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | Compliant |
| Core Clock Speed | — | 66 MHz |
| Tegangan Pemuat Kerja | — | 3.3 V |
| Communications Processor Module (CPM) | — | Yes (SCC/SMC/SPI/I2C) |
| Ethernet MAC | — | Dual 10/100 Mbps (Fast Ethernet) |
| Lead Free | — | Yes |
| Packaging | — | Tray |
| Process Technology | — | 0.32 um CMOS |