MPC860SRVR66D4 vs MPC860ENVR66D4 比較

詳細並排比較 MPC860SRVR66D4 由 NXP Semiconductors 與 MPC860ENVR66D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC860SRVR66D4 MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860SRVR66D4 ⚠ 最後購買機會
NXP Semiconductors
MPC860ENVR66D4 MPC860ENVR66D4 - 66MHz PowerQUICC MPU, 357-BBGA | NXP

MPC860ENVR66D4 - 66MHz PowerQUICC MPU, 357-BBGA | NXP

MPC860ENVR66D4 ⚠ 最後購買機會

規格比較

參數 MPC860SRVR66D4 MPC860ENVR66D4
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 最後購買
Processor Type MPC8xx PowerQUICC MPC8xx PowerQUICC, 32-Bit
Core Architecture PowerPC 32-bit PowerPC Embedded
Number of Cores 1 1
Clock Speed 66 MHz —
Operating Voltage 3.3 V (5 V tolerant I/O) —
Instruction Cache 4 Kbyte 4 KB
Data Cache 4 Kbyte 4 KB
MMU Yes Yes (integrated)
Communication Processor Module (CPM) Yes (FCC/SCC/SMC/SPI/I2C) —
Multiply-Accumulate (MAC) Unit Yes —
JTAG / Debug IEEE 1149.1 compliant —
工作溫度 -40C to +95C [DATA_NEEDED: operating temperature range]
封裝 / 外殼 357-PBGA (25 mm x 25 mm) 357-PBGA (25x25 mm)
安裝類型 Surface Mount (BGA) Surface Mount
Packaging (Shipping) Tray —
Lead Free Status Lead Free —
RoHS 狀態 RoHS Compliant Compliant
Core Clock Speed — 66 MHz
工作電源電壓 — 3.3 V
Communications Processor Module (CPM) — Yes (SCC/SMC/SPI/I2C)
Ethernet MAC — Dual 10/100 Mbps (Fast Ethernet)
Lead Free — Yes
Packaging — Tray
Process Technology — 0.32 um CMOS

資料表與資源

瀏覽所有產品 建立 BOM 索取報價