MPC860SRVR66D4 vs MPC860ENVR66D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860SRVR66D4 disebabkan oleh NXP Semiconductors dan MPC860ENVR66D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MPC860ENVR66D4 - 66MHz PowerQUICC MPU, 357-BBGA | NXP
MPC860ENVR66D4 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | MPC860SRVR66D4 | MPC860ENVR66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Processor Type | MPC8xx PowerQUICC | MPC8xx PowerQUICC, 32-Bit |
| Core Architecture | PowerPC 32-bit | PowerPC Embedded |
| Number of Cores | 1 | 1 |
| Clock Speed | 66 MHz | — |
| Operating Voltage | 3.3 V (5 V tolerant I/O) | — |
| Instruction Cache | 4 Kbyte | 4 KB |
| Data Cache | 4 Kbyte | 4 KB |
| MMU | Yes | Yes (integrated) |
| Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/SPI/I2C) | — |
| Multiply-Accumulate (MAC) Unit | Yes | — |
| JTAG / Debug | IEEE 1149.1 compliant | — |
| Suhu Operasi | -40C to +95C | [DATA_NEEDED: operating temperature range] |
| Kemasan / Case | 357-PBGA (25 mm x 25 mm) | 357-PBGA (25x25 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Packaging (Shipping) | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | Compliant |
| Core Clock Speed | — | 66 MHz |
| Tegangan Pemberi Arus Operasi | — | 3.3 V |
| Communications Processor Module (CPM) | — | Yes (SCC/SMC/SPI/I2C) |
| Ethernet MAC | — | Dual 10/100 Mbps (Fast Ethernet) |
| Lead Free | — | Yes |
| Packaging | — | Tray |
| Process Technology | — | 0.32 um CMOS |