MPC880CZP66 vs MPC885CZP66 Perbandingan

Perbandingan bersamaan detil MPC880CZP66 dari NXP Semiconductors dan MPC885CZP66 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC880CZP66 MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP

MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP

MPC880CZP66 ⚠ Waktu Beli Terakhir
NXP Semiconductors
MPC885CZP66 MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 Nrnd

Perbandingan Spesifikasi

Parameter Umum MPC880CZP66 MPC885CZP66
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Waktu Pembelian Terakhir NRND
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Product Category Microprocessors - MPU —
Series MPC8xx (PowerQUICC) PowerQUICC, MPC8xx
Core MPC8xx (PowerPC) —
Core Count 1 1
Lebar Bus Data 32 bit 32 bit
Frekuensi Bawah Maximum 66.67 MHz —
Nominal Supply Voltage 1.8 V —
Package Type 357-PBGA (25x25 mm) PBGA (Plastic Ball Grid Array)
Package Code BGA (Plastic Ball Grid Array) BGA
Terminal Form Ball Ball
Number of Terminals 357 —
Tipe Mounting Surface Mount Surface Mount
Terminal Finish Tin/Lead (Sn/Pb) - non-RoHS —
Rentang Suhu Kerja [DATA_NEEDED: extended industrial or commercial range] —
Status RoHS Non-compliant (Sn/Pb finish) [DATA_NEEDED: RoHS compliance status]
Core Architecture — Power Architecture, 32-bit
Core Clock Speed — 66 MHz
Process Technology — 0.18 micrometer CMOS
Tegangan Pemuat — 3.3 V (typical)
Package Pin Count — 357
Package Size — 25 x 25 mm
Moisture Sensitivity Level — MSL 3
Suhu Kerja — -40C to +100C
Package Shape — Square
Lead-Free — [DATA_NEEDED: lead-free status]

Spek dan Sumber

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