MPC880CZP66 vs MPC885CZP66 比較

詳細並排比較 MPC880CZP66 由 NXP Semiconductors 與 MPC885CZP66 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC880CZP66 MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP

MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP

MPC880CZP66 ⚠ 最後購買機會
NXP Semiconductors
MPC885CZP66 MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 Nrnd

規格比較

參數 MPC880CZP66 MPC885CZP66
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 NRND
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Product Category Microprocessors - MPU —
Series MPC8xx (PowerQUICC) PowerQUICC, MPC8xx
Core MPC8xx (PowerPC) —
Core Count 1 1
資料匯流排寬度 32 bit 32 bit
最大時脈頻率 66.67 MHz —
Nominal Supply Voltage 1.8 V —
Package Type 357-PBGA (25x25 mm) PBGA (Plastic Ball Grid Array)
Package Code BGA (Plastic Ball Grid Array) BGA
Terminal Form Ball Ball
Number of Terminals 357 —
安裝類型 Surface Mount Surface Mount
Terminal Finish Tin/Lead (Sn/Pb) - non-RoHS —
工作溫度範圍 [DATA_NEEDED: extended industrial or commercial range] —
RoHS 狀態 Non-compliant (Sn/Pb finish) [DATA_NEEDED: RoHS compliance status]
Core Architecture — Power Architecture, 32-bit
Core Clock Speed — 66 MHz
Process Technology — 0.18 micrometer CMOS
供應電壓 — 3.3 V (typical)
Package Pin Count — 357
Package Size — 25 x 25 mm
Moisture Sensitivity Level — MSL 3
工作溫度 — -40C to +100C
Package Shape — Square
Lead-Free — [DATA_NEEDED: lead-free status]

資料表與資源

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