MPC880CZP66 vs MPC885CZP66 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC880CZP66 disebabkan oleh NXP Semiconductors dan MPC885CZP66 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPC880CZP66 MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP

MPC880CZP66 - 32-Bit PowerQUICC MPU, 66MHz, 357-PBGA | NXP

MPC880CZP66 ⚠ Bahagian terakhir untuk beli
NXP Semiconductors
MPC885CZP66 MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 Nrnd

Pengandingan Spesifikasi

Parametr MPC880CZP66 MPC885CZP66
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Product Category Microprocessors - MPU —
Series MPC8xx (PowerQUICC) PowerQUICC, MPC8xx
Core MPC8xx (PowerPC) —
Core Count 1 1
Lebar Bus Data 32 bit 32 bit
Frekuensi Klock Maksimum 66.67 MHz —
Nominal Supply Voltage 1.8 V —
Package Type 357-PBGA (25x25 mm) PBGA (Plastic Ball Grid Array)
Package Code BGA (Plastic Ball Grid Array) BGA
Terminal Form Ball Ball
Number of Terminals 357 —
Jenis Pemasangan Surface Mount Surface Mount
Terminal Finish Tin/Lead (Sn/Pb) - non-RoHS —
Gambaran Suhu Operasi [DATA_NEEDED: extended industrial or commercial range] —
Status RoHS Non-compliant (Sn/Pb finish) [DATA_NEEDED: RoHS compliance status]
Core Architecture — Power Architecture, 32-bit
Core Clock Speed — 66 MHz
Process Technology — 0.18 micrometer CMOS
Tegangan Pemberi Arus — 3.3 V (typical)
Package Pin Count — 357
Package Size — 25 x 25 mm
Moisture Sensitivity Level — MSL 3
Suhu Operasi — -40C to +100C
Package Shape — Square
Lead-Free — [DATA_NEEDED: lead-free status]

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