10AX090N2F45E2LG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
부품 번호: 10AX090N2F45E2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7619.06 | $7,619.06 |
| 10 | $7238.11 | $72,381.10 |
| 100 | $6857.16 | $685,716.00 |
| 500 | $6476.2 | $3,238,100.00 |
| 1,000 | $6095.25 | $6,095,250.00 |
10AX090N2F45E2LG 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic, interconnect, and I/O behavior are fully configurable after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-defined processors, enabling hardware-level parallelism, deterministic latency, and rapid design iteration. The Arria 10 GX family in particular emphasizes transceiver-rich applications such as wireline backhaul, broadcast video processing, and PCI Express acceleration.
Key specifications for 10AX090N2F45E2LG include a 0.9 V core supply, embedded hard memory controllers, high-speed transceivers, and signal-integrity features suitable for backplane and chip-to-chip links. The 1932-FCBGA package offers high pin count for parallel memory and high-speed serial I/O fan-out. Compared with earlier Arria generations, Arria 10 GX delivers improved power efficiency per logic element, supporting thermally constrained boards without sacrificing throughput.
Typical applications include 4K/8K video broadcast infrastructure, wireless baseband processing, military/aerospace signal intelligence, high-performance computing accelerators, and radar front-end digital signal processing. Its combination of DSP blocks, on-chip memory, and high-speed transceivers makes it well-suited for compute-intensive, latency-sensitive workloads that must be deployed on a reconfigurable fabric.
When designing with this part, ensure the PCB has a controlled-impedance stack-up for the transceivers, and provide adequate decoupling close to the package balls. Use Intel Quartus Prime for synthesis, place-and-route, and bitstream generation. The lead-free 1932-FCBGA package requires a high-layer-count PCB with microvia technology for reliable assembly.
This page consolidates distributor pricing, parametric context, and practical design considerations that go beyond the manufacturer datasheet, giving engineers a single reference for sourcing, evaluation, and PCB integration of the 10AX090N2F45E2LG.
드롭인 대체품: 10AX090N2F45E2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090N2F45E2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, DSP Blocks, Operating Temperature, Speed Grade, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090N2F45E2SG
✅ 드롭인✓ 재고 있음
$4943.22 / 개
데이터시트 보기 →10AX090N2F45E1SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10250 / 개
데이터시트 보기 →10AX090N2F45E2LG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| User I/O Pins | 768 |
| Core Voltage | 0.9 V |
| Process Technology | 20 nm |
| 패키지 | 1932-ball FCBGA (FBGA) |
| Package Type | Flip-Chip BGA, surface mount |
| Operating Temperature Grade | Enhanced (E2) |
| Lead-Free / RoHS | Yes (per part suffix LG) |
| Configuration Memory | SRAM-based, volatile (external flash required) |
| 실장 유형 | Surface Mount |
| 수명 주기 상태 | Active |
10AX090N2F45E2LG 핀 구성
| 핀 Bank 3A | User I/O Bank 3A — General-purpose user I/O and high-speed differential pairs |
| 핀 Bank 3B | User I/O Bank 3B — General-purpose user I/O |
| 핀 Bank 3C | User I/O Bank 3C — General-purpose user I/O |
| 핀 Bank 4A | User I/O Bank 4A — General-purpose user I/O |
| 핀 Bank 4B | User I/O Bank 4B — General-purpose user I/O |
| 핀 Bank 4C | User I/O Bank 4C — General-purpose user I/O |
| 핀 Bank 5A | User I/O Bank 5A — High-voltage I/O bank |
| 핀 Bank 5B | User I/O Bank 5B — High-voltage I/O bank |
| 핀 Bank 6A | User I/O Bank 6A — High-voltage I/O bank |
| 핀 Bank 6B | User I/O Bank 6B — High-voltage I/O bank |
| 핀 Bank 7A | User I/O Bank 7A — High-voltage I/O bank |
| 핀 Bank 7B | User I/O Bank 7B — High-voltage I/O bank |
| 핀 Bank 7C | User I/O Bank 7C — High-voltage I/O bank |
| 핀 Bank 8A | User I/O Bank 8A — High-voltage I/O bank |
| 핀 Bank 8B | User I/O Bank 8B — High-voltage I/O bank |
| 핀 Bank 9A | User I/O Bank 9A — High-voltage I/O bank |
| 핀 Bank L0 | Transceiver Bank L0 — High-speed serial transceiver lanes |
| 핀 Bank L1 | Transceiver Bank L1 — High-speed serial transceiver lanes |
| 핀 Bank L2 | Transceiver Bank L2 — High-speed serial transceiver lanes |
| 핀 Bank L3 | Transceiver Bank L3 — High-speed serial transceiver lanes |
| 핀 Bank R0 | Transceiver Bank R0 — High-speed serial transceiver lanes |
| 핀 Bank R1 | Transceiver Bank R1 — High-speed serial transceiver lanes |
| 핀 Bank R2 | Transceiver Bank R2 — High-speed serial transceiver lanes |
| 핀 Bank R3 | Transceiver Bank R3 — High-speed serial transceiver lanes |
| 핀 VCC | Core / Aux / I/O Power — 0.9 V core and auxiliary supplies plus I/O bank supplies (multiple pins) |
| 핀 GND | Ground — Common ground reference (multiple pins) |
| 핀 NC | No-Connect / Reserved — Unused balls per package pinout (multiple pins) |
| 핀 JTAG_TCK | JTAG TCK — JTAG test clock |
| 핀 JTAG_TMS | JTAG TMS — JTAG test mode select |
| 핀 JTAG_TDI | JTAG TDI — JTAG test data in |
| 핀 JTAG_TDO | JTAG TDO — JTAG test data out |
| 핀 CONFIG_DONE | Configuration Done — Open-drain configuration complete indicator |
| 핀 nCONFIG | nCONFIG — Configuration start / reset (active low) |
| 핀 nSTATUS | nSTATUS — Configuration status (active low) |
| 핀 CLK_USR | Dedicated Clock Inputs — Differential clock input pins (multiple) |
일반적인 애플리케이션
10AX090N2F45E2LG 적합 용도: 6 애플리케이션s: 4K/8K Video Broadcast Infrastructure, Wireless Baseband and DSP Acceleration, Radar and Signal Intelligence (SIGINT), High-Performance Computing (HPC) Acceleration, Industrial Test and Measurement Instrumentation, Medical Imaging and Diagnostic Equipment.
4K/8K Video Broadcast Infrastructure
The 10AX090N2F45E2LG's 900K logic elements and 59 Mb embedded memory make it a strong fit for 4K and 8K video broadcast pipelines, including multi-channel SDI ingest, frame-rate conversion, and HDR tone mapping. The device handles 12G-SDI quad-link aggregation at production frame rates when paired with Intel's video IP cores and external DDR4 memory. Compared with smaller Arria 10 devices, the 900K fabric absorbs multiple parallel video processing paths without dropping frames, and the 1932-ball FCBGA exposes the transceiver lanes required for SDI, HDMI, and DisplayPort aggregation. Power-sensitive broadcast racks benefit from the 20 nm process's improved performance-per-watt versus older 28 nm Arria V / Stratix V parts.
추천
Wireless Baseband and DSP Acceleration
The 10AX090N2F45E2LG is well matched to wireless baseband processing such as LTE, 5G NR PHY layer acceleration, and digital predistortion (DPD) for RF power amplifiers. The 900K LE and abundant DSP blocks run multi-antenna MIMO processing, FFT/IFFT engines, and crest-factor reduction in parallel. The integrated high-speed transceivers interface directly to RF ADC/DAC JESD204B/C links, eliminating companion FPGA glue logic. Compared with a Stratix 10 part, the Arria 10 GX balances cost and thermal envelope for macro-cell base stations and small-cell deployments where thousands of units ship per month.
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Radar and Signal Intelligence (SIGINT)
Military radar front-end and electronic-warfare systems benefit from the 10AX090N2F45E2LG's combination of high logic density, large embedded memory, and fast transceivers. Pulse compression, beamforming, and direction-finding algorithms run in real time across the 900K fabric, while 59 Mb of block RAM buffers multi-channel ADC samples at gigasample-per-second rates. The 1932-ball FCBGA exposes dedicated transceiver pins for direct ADC/DAC connectivity, and the 20 nm Arria 10 process provides radiation-tolerant behavior for high-altitude or space applications when paired with mitigation flows in Quartus Prime.
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High-Performance Computing (HPC) Acceleration
The 10AX090N2F45E2LG serves as an HPC compute accelerator in data-center and lab-instrument workloads, offloading compute kernels from host CPUs via PCI Express Gen3 links. The 900K fabric runs custom OpenCL or RTL accelerators for genomics, financial Monte Carlo, and machine-learning inference. The 1932-ball FCBGA exposes multiple PCIe hard IP blocks, and the 59 Mb block RAM keeps working sets close to the fabric to minimize external DRAM round-trips. Compared with a Stratix 10 accelerator, this Arria 10 part offers a more attractive cost-per-FLOP for sustained-throughput workloads.
추천
Industrial Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and automated test equipment leverage the 10AX090N2F45E2LG for real-time signal processing, deep acquisition memory, and high-speed serial trigger logic. The 900K LE fabric parallelizes FFT computation, eye-diagram analysis, and protocol decoding across multiple lanes simultaneously. The 1932-ball FCBGA connects directly to high-speed ADC/DAC converters via the device's transceivers, while 768 user I/Os fan out to front-panel connectors, displays, and trigger logic. Compared with smaller Arria 10 devices, the 900K LE budget enables longer acquisition windows and more complex triggering without external pre-processors.
추천
Medical Imaging and Diagnostic Equipment
Ultrasound, CT, and MRI image-processing pipelines benefit from the 10AX090N2F45E2LG's real-time DSP throughput and large embedded memory budget. The 900K LE fabric runs beamformers for ultrasound probes, image reconstruction for CT, and gradient processing for MRI in a single device. The 59 Mb of block RAM holds raw channel data, while the transceivers connect to high-channel-count ADC modules. Compared with lower-density Arria 10 parts, the 900K fabric supports higher probe counts and higher frame rates without dropping samples, which is critical for diagnostic-grade image quality.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090N2F45E2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090N2F45E2SG | 10AX090N2F45E1SG | 10AX090N2F40I2LG | 10AX090N2F40I1SG | 10AX066N2F40E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA | 1932-ball FCBGA (same) | 1932-ball FCBGA (same) | 1517-ball FCBGA (NOT pin-compatible) | 1517-ball FCBGA (NOT pin-compatible) | 1517-ball FCBGA (NOT pin-compatible) |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 660,000 |
| Temperature Grade | Enhanced (E2) | Enhanced (E2) | Industrial (E1) | Industrial (I2) | Industrial (I1) | Enhanced (E1) |
| Packaging Media | Tray (LG) | Tape and Reel (SG) | Tape and Reel (SG) | Tray (LG) | Tape and Reel (SG) | Tape and Reel (SG) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
주요 차별점
- Highest-density Arria 10 with 900K LE and 59 Mb memory in the F45 footprint (vs 10AX066N2F40E1SG)
- 1932-ball FCBGA with maximum I/O count and transceiver fan-out (vs 10AX090N2F40I2LG (1517-ball))
- Enhanced (E2) temperature grade suitable for thermally stressed deployments (vs 10AX090N2F45E1SG (E1 grade))
설계 노트
Estimated: the 1932-ball FCBGA requires a high-layer-count PCB (typically 14+ layers) with microvia and via-in-pad technology. Route all high-speed transceiver lanes with controlled differential impedance (typically 100 ohm). Provide adequate thermal vias under the package to dissipate the 20 nm Arria 10 power budget. The Intel Arria 10 PCB Design Guidelines provide ball-map and stack-up reference for this package.
Estimated: at typical Arria 10 GX utilization (60-70% LE, mid transceiver activity), the 10AX090N2F45E2LG draws 20-35 W. Use a multi-rail power solution with 0.9 V core, 1.1 V auxiliary, and per-bank I/O supplies. Decoupling must follow Intel's reference capacitor network, with bulk capacitors close to each supply pin. Use a PMBus-compliant point-of-load regulator for telemetry.
Do not substitute the F45 package variant with the F40 package variant on the same PCB layout - the F40 uses a smaller 1517-ball FCBGA. Verify the exact MPN suffix matches your PCB footprint before ordering production units. Confirm operating temperature grade (E1 vs E2 vs I1 vs I2) matches the deployment environment, since under-specifying temperature grade is a common source of field failures.
Place the configuration flash within 4 inches of the MSEL pins to minimize signal integrity issues during FPGA boot. Keep JTAG chain signals away from switching power supplies and high-speed transceivers. For multi-FPGA boards, isolate each FPGA's power and ground planes to prevent return-current coupling. The Arria 10 transceiver signal-integrity checklist (AN 678) provides lane-by-lane routing guidance.
규정 준수 정보
RoHS / lead-free indicated by the LG suffix. AEC-Q100 not applicable (FPGAs are not qualified automotive ICs in the same sense as discrete power devices). Conflict-minerals compliance follows Intel's standard CMRT declarations.
