H5TC4G63AFR-G7A - 4Gb DDR3L SDRAM 1.35V | SK Hynix
MPN: H5TC4G63AFR-G7A ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $5.9 | $5,900.00 |
Drop-in alternatives for H5TC4G63AFR-G7A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5TC4G63AFR-PBA
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View Datasheet →H5TC4G63AFR-RDA
✅ Drop-In📋 Reference alternative (not in catalog)
H5TC4G63AFR-RDI
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MT41K256M16TW-107
✅ Drop-In✓ 99,999 In Stock
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View Datasheet →K4B4G1646E-BYMA
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View Datasheet →H5TC4G63AFR-G7A Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4Gb |
| Organization | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V |
| Data Rate | 1600 Mbps (PC3-12800) |
| Package | 96-ball FBGA |
| Operating Temperature (Case) | 0°C to 95°C |
| CAS Latency | 11 (at 1600 Mbps) |
| Burst Length | 8 and 4 |
| Refresh Period | 7.8us at 85°C |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| RoHS Compliant | Yes |
| Number of Pins | 96 |
| Mounting Type | Surface Mount |
H5TC4G63AFR-G7A Pin Configuration
| Pin A1 | VDD — Power supply (1.35V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin B1 | VDDQ — I/O power supply (1.35V) |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin B4 | VSSQ — I/O ground |
| Pin C1 | VREF — Reference voltage |
| Pin C2 | DQ4 — Data input/output 4 |
| Pin C3 | DQ5 — Data input/output 5 |
| Pin C4 | VSS — Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63AFR-G7A is suitable for 6 applications: Laptop and Ultrabook Memory, Embedded Systems, Networking Equipment, Industrial Computing, Consumer Electronics, Automotive Infotainment.
Laptop and Ultrabook Memory
The H5TC4G63AFR-G7A provides 4Gb DDR3L memory at 1.35V, ideal for laptops and ultrabooks where power efficiency is critical. Its 1600 Mbps data rate supports smooth multitasking and responsive performance. The low voltage reduces battery drain, extending usage time. The 96-ball FBGA package allows compact PCB designs, fitting thin form factors. With RoHS compliance, it meets environmental standards for consumer electronics.
Recommended
Embedded Systems
In embedded systems, the H5TC4G63AFR-G7A offers high-density memory with low power consumption, suitable for industrial controllers and IoT gateways. Its 1.35V operation reduces heat generation, enhancing reliability in enclosed environments. The 256M x 16 organization provides ample storage for firmware and data logging. The device supports auto-refresh and self-refresh modes, simplifying power management. Its wide temperature range ensures operation in harsh conditions.
Recommended
Networking Equipment
The H5TC4G63AFR-G7A is well-suited for networking equipment such as routers and switches, where high bandwidth and low latency are essential. Its 1600 Mbps data rate supports fast packet processing and routing tables. The 1.35V supply reduces power consumption in always-on devices, lowering operational costs. The 96-ball FBGA package enables dense PCB layouts, accommodating multiple memory devices. The device's reliability ensures stable operation in 24/7 environments.
Recommended
Industrial Computing
For industrial PCs and HMI panels, the H5TC4G63AFR-G7A provides robust memory performance with a wide temperature range of 0°C to 95°C. Its low voltage operation reduces power dissipation, important for fanless designs. The 4Gb density supports complex applications like machine vision and data acquisition. The device's RoHS compliance meets industrial environmental regulations. Its high reliability ensures long service life in demanding environments.
Recommended
Consumer Electronics
The H5TC4G63AFR-G7A is used in consumer electronics like smart TVs and set-top boxes, where high bandwidth and low power are required. Its 1600 Mbps data rate enables smooth video streaming and fast app loading. The 1.35V operation reduces energy consumption, contributing to energy-efficient designs. The compact FBGA package fits slim device profiles. The device's cost-effectiveness makes it suitable for mass-market products.
Recommended
Automotive Infotainment
In automotive infotainment systems, the H5TC4G63AFR-G7A offers high-density memory with low power consumption, essential for in-vehicle electronics. Its 1.35V operation reduces heat, improving reliability in the cabin. The 4Gb capacity supports navigation maps, media playback, and connectivity features. The device's wide temperature range accommodates automotive environments. Its RoHS compliance meets automotive industry standards.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63AFR-G7A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63AFR-PBA | H5TC4G63AFR-RDA | MT41K256M16TW-107 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1600 Mbps | 1866 Mbps | [DATA_NEEDED] | 1600 Mbps |
| Operating Temperature | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C |
| RoHS Compliant | Yes | Yes | Yes | Yes |
Key Differentiators
- Low voltage operation at 1.35V (vs MT41K256M16TW-107)
- High density 4Gb in x16 organization (vs K4B4G1646E-BYMA)
- RoHS and halogen-free compliance (vs MT41K256M16TW-107)
Design Notes
Ensure VDD and VDDQ are supplied with 1.35V ±0.045V. Use a low-impedance power plane and place 0.1uF decoupling capacitors close to each VDD and VDDQ pin. The reference voltage VREF should be set to 0.675V and bypassed with a 0.1uF capacitor to ground.
Follow the PCB layout guidelines in the SK Hynix datasheet for DDR3L routing. Maintain controlled impedance for DQ, DQS, and address/command lines. Keep trace lengths matched within 50 mils for each byte lane. Use ground planes to minimize noise and ensure signal integrity at 1600 Mbps.
The H5TC4G63AFR-G7A operates up to 95°C case temperature. Ensure adequate airflow or heatsinking in high-ambient environments. The 96-ball FBGA package has a thermal resistance of approximately 17°C/W (theta_JA). For high-power applications, consider adding thermal vias under the package to improve heat dissipation.
Compliance Information
Lead-free and halogen-free per datasheet. RoHS compliant. REACH and conflict minerals status not specified in provided data.
