K4A8G085WC-BCWE - 8Gb DDR4-3200 DRAM 1.2V | Samsung
부품 번호: K4A8G085WC-BCWE ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.6563 | $12.66 |
| 10 | $9.1406 | $91.41 |
| 100 | $8.0859 | $808.59 |
| 500 | $7.7344 | $3,867.20 |
| 1,000 | $7.3828 | $7,382.80 |
K4A8G085WC-BCWE 개요
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is the fourth generation of DDR DRAM and the dominant main-memory technology in computing systems. Within the memory hierarchy, DRAM sits between CPU caches and storage, and DDR4 improved on DDR3 by lowering operating voltage from 1.5 V to 1.2 V, doubling bank groups, and raising data rates up to 3200 Mbps and beyond. As a power management IC-adjacent component, it requires a VDD/VDDQ rail at 1.2 V and precision power-up sequencing.
Key features of the K4A8G085WC-BCWE include the 8 Gb density in a x8 organization, the DDR4-3200 speed bin for high-bandwidth applications, 1.2 V core and I/O operation for reduced power versus DDR3, and the space-saving 78FBGA surface-mount package. The C-die generation offers improved bit density per die, reducing chip count in high-capacity designs.
Architecturally, the device uses DDR4 bank-group architecture with 8n prefetch, on-die termination (ODT), and DDR4-standard command/address training, allowing seamless integration with standard DDR4 memory controllers from AMD Ryzen, Intel, and embedded processor platforms.
Typical applications include desktop and laptop main memory, embedded industrial controllers, computing modules (COM Express, SODIMM-based designs), networking equipment, and replacement sourcing for DDR4-based BOMs.
Design consideration: DDR4 requires correct power-up initialization sequencing and controller training (write leveling, read training); the exact speed bin suffix (-BCWE = DDR4-3200) must match controller timing assumptions.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: K4A8G085WC-BCWE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: K4A8G085WC-BCWE (동일 폼 팩터 및 풋프린트) — 차이점: Interface, Package, Data Rate, RoHS Status, Bank Group Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
K4A8G085WC-BIWE
✓ 재고 있음
$6.29 / 개
데이터시트 보기 →K4A8G085WC-BCTD
✓ 재고 있음
$50.85 / 개
데이터시트 보기 →K4A8G085WC-BCRC
✓ 재고 있음
$4.3 / 개
데이터시트 보기 →K4A8G085WC-BCPB
✓ 재고 있음
$2.95 / 개
데이터시트 보기 →K4A8G085WB-BCWE
✓ 재고 있음
$12.3047 / 개
데이터시트 보기 →K4A8G085WC-BCWE 최대 정격 & 전기적 특성
| 메모리 유형 | DDR4 SDRAM |
| Density | 8 Gb |
| 메모리 구성 | 1G x 8 |
| 데이터 속도 | 3200 Mbps (DDR4-3200) |
| 공급 전압 | 1.2 V |
| 동작 온도 | 0C to +85C |
| 패키지 | 78FBGA |
| 실장 유형 | Surface Mount |
| 인터페이스 | DDR4 (parallel, double data rate) |
| Application Class | Computing / Embedded main memory |
| Manufacturer | Samsung Electronics |
| Bank Group Architecture | DDR4 bank groups (8n prefetch) |
| Speed Bin Suffix | -BCWE (DDR4-3200, commercial temp) |
| RoHS 상태 | Compliant (per JLCPCB listing) |
| Refresh | Standard DDR4 refresh mechanisms |
| On-Die Termination | Yes (DDR4 ODT) |
K4A8G085WC-BCWE 78fbga 핀 구성 가이드
K4A8G085WC-BCWE(78fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: K4A8G085WC-BCWE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
K4A8G085WC-BCWE 적합 용도: 6 애플리케이션s: Desktop and Workstation Main Memory, Embedded Industrial Controllers, Networking and Communication Equipment, Computing Modules (COM Express / SODIMM Carrier Boards), Replacement Sourcing and BOM Continuity, Gaming and Graphics Workloads.
Desktop and Workstation Main Memory
The K4A8G085WC-BCWE serves as discrete main memory in desktop and workstation platforms, where its DDR4-3200 data rate delivers 25.6 GB/s of peak bandwidth per 64-bit channel. The 8 Gb, 1G x 8 organization allows module designers to build 8 GB UDIMMs with eight chips or 16 GB DIMMs with sixteen, all on the fly-by command/address topology DDR4 mandates. Its listing on AMD Ryzen validator lists and Intel DRAM compatibility lists confirms platform acceptance. Compared with DDR3 predecessors, the 1.2 V supply cuts memory subsystem power significantly, improving thermal design margin in compact cases. Designers should confirm the memory controller supports the -BCWE timing tables via BIOS memory training before release.
추천
Embedded Industrial Controllers
Industrial controllers, IPCs, and HMI panels use the K4A8G085WC-BCWE as code and data memory alongside processors such as the TI AM263P or NXP i.MX families. The 8 Gb density in a single 78FBGA die simplifies BOM and board space compared with stacking smaller chips, while the DDR4-3200 bin gives headroom for frame buffers and logging workloads. Because industrial environments demand wider temperature ranges, designs targeting -40C should instead use the pin-identical K4A8G085WC-BIWE industrial variant, which requires zero PCB redesign per Samsung's migration guide. Layout must follow DDR4 fly-by routing with ODT tuning; the 1.2 V VDDQ rail needs a low-noise buck regulator such as the TPS54218 for clean power.
추천
Networking and Communication Equipment
Routers, switches, and network appliances rely on the K4A8G085WC-BCWE for packet buffering, routing tables, and control-plane memory. The x8 organization and 3200 Mbps per-pin rate provide the sustained bandwidth needed for gigabit and multi-gigabit line-rate forwarding, while 8 Gb per chip keeps chip count low on dense line cards. DDR4 bank-group architecture with 8n prefetch improves random-access efficiency for scattered packet buffers, an advantage over DDR3 in network workloads. Thermal conditions in fanless or constrained networking enclosures favor the 1.2 V operating voltage, which lowers DRAM idle and active power relative to DDR3-era parts. Validate the speed bin against the network processor's supported DDR4 frequency before layout.
추천
Computing Modules (COM Express / SODIMM Carrier Boards)
Computer-on-module carrier designs and SODIMM-based embedded systems use the K4A8G085WC-BCWE either as soldered-down memory on the module or as reference for module DRAM qualification. The 78FBGA package supports the standard DDR4 land pattern used across carrier and module boards, enabling drop-in substitution among Samsung speed bins (BCTD, BCRC, BCPB) during supply shortages without PCB respins - a critical advantage for long-lifecycle embedded products. The DDR4-3200 rating matches the memory interface speed of modern embedded x86 and ARM SoCs used in COM Express Type 6 and Type 10 modules. Power-up initialization and training sequences must follow the Samsung datasheet exactly to pass BIOS-level memory training.
추천
Replacement Sourcing and BOM Continuity
As Samsung shifts capacity toward DDR5 and HBM, buyers maintaining legacy DDR4-based products use the K4A8G085WC-BCWE and its family members for last-time-buy and continuity planning. The verified cross-reference data shows the full ordering code - not just the 8 Gb headline - determines substitution safety: organization, package, temperature class, speed bin, and die generation (WB vs WC) must all match controller assumptions. This page's alternatives table ranks the K4A8G085WC-BIWE, -BCTD, -BCRC, and -BCPB by parametric proximity, letting procurement prioritize validated drop-ins. Buyers should verify date codes and run incoming inspection when sourcing DDR4 through secondary distributors, since market volatility has increased counterfeit risk in this segment.
추천
Gaming and Graphics Workloads
Gaming consoles, GPUs with discrete memory controllers, and high-frame-rate graphics workloads use the K4A8G085WC-BCWE where GDDR is unnecessary but sustained bandwidth matters. The DDR4-3200 speed bin supplies 25.6 GB/s per 64-bit channel, and multiple x8 devices can be ganged into 128-bit or 256-bit buses for proportionally higher aggregate bandwidth. On-die termination reduces the external component count needed for high-speed signal integrity, cutting BOM cost on multi-chip graphics boards. The 1.2 V rail simplifies power delivery versus DDR3's dual 1.5 V/1.35 V schemes, important in thermally constrained GPU boards. Designers should place the DRAM within tight length-matching windows and validate eye diagrams at 3200 Mbps on their stackup.
추천
추천 제품 요약
엔지니어링 참조 데이터: K4A8G085WC-BCWE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | K4A8G085WC-BIWE | K4A8G085WC-BCTD | K4A8G085WC-BCRC | K4A8G085WC-BCPB | K4A8G085WB-BCWE |
|---|---|---|---|---|---|---|
| Package | 78FBGA | 78FBGA - same | 78FBGA - same | 78FBGA - same | 78FBGA - same | 78FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 1G x 8 | 1G x 8 | 1G x 8 | 1G x 8 | 1G x 8 | 1G x 8 |
| Data Rate | 3200 Mbps (DDR4-3200) | 3200 Mbps (industrial grade) | 2666 Mbps (DDR4-2666) | 2400 Mbps (DDR4-2400) | 2133 Mbps class | 3200 Mbps (DDR4-3200) |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | 0C to +85C | -40C to +85C (industrial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Die Generation | C-die | C-die | C-die | C-die | C-die | B-die (timing differences) |
주요 차별점
- Fastest speed bin in the WC family (vs K4A8G085WC-BCTD)
- C-die timing consistency (vs K4A8G085WB-BCWE)
- Commercial-temperature cost advantage (vs K4A8G085WC-BIWE)
설계 노트
Power the K4A8G085WC-BCWE from a clean 1.2 V rail for both VDD and VDDQ. A synchronous buck such as the TI TPS54218 with 22 uF of bulk and per-ball 100 nF decoupling provides the low ripple DDR4 requires. Follow the Samsung datasheet power-up initialization sequence exactly: stabilize VDD before applying CK/CK# and completing reset/controller initialization, otherwise memory training may fail intermittently.
DDR4-3200 signaling (1600 MHz clock, 3200 Mbps per pin) demands disciplined fly-by command/address routing and per-byte length-matched data groups. Use on-die termination (ODT) settings from the controller training algorithm and simulate eye diagrams on your stackup. Slower bins (-BCRC at 2400 Mbps) tolerate looser geometry, so if SI margin is insufficient at 3200 Mbps, switching to the drop-in BCTD/BCRC speed bin recovers margin without PCB respin.
Do not substitute B-die (K4A8G085WB) and C-die (K4A8G085WC) parts without validation: cross-reference analysis reports critical timing differences between the generations despite identical 8 Gb/x8/3200/78FBGA headline specs. Also verify the temperature suffix - the -BCWE commercial grade (0C to +85C) is not a substitute for industrial designs; use the -BIWE. Finally, cross-brand DDR4 swaps (Micron/Hynix) require controller supported-MPN validation and are not true drop-ins.
규정 준수 정보
RoHS compliant per JLCPCB and LCSC product listings. REACH, halogen-free, and conflict-minerals declarations not present in retrieved data; request formal certificates from Samsung if required.
