K9JUGY8J5C-CCK0 - 1Tb TLC V-NAND Flash | Samsung
부품 번호: K9JUGY8J5C-CCK0 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.8 | $9.80 |
| 10 | $9.2 | $92.00 |
| 100 | $8.6 | $860.00 |
| 500 | $8.1 | $4,050.00 |
| 1,000 | $7.6 | $7,600.00 |
K9JUGY8J5C-CCK0 개요
NAND flash is a non-volatile memory technology that retains data without power and sits at the heart of the storage hierarchy: page/program-erase operations -> NAND flash die -> NAND package -> SSD/eMMC/UFS module -> system storage subsystem. Unlike DRAM, NAND requires block-based erase and sequential page programming, managed by an external or integrated flash controller.
Key characteristics of this device include its 1Tb capacity per package, triple-level-cell (TLC) density, and Samsung V6 (128-layer) vertical NAND process, which improves bit density and cost-per-GB versus planar and earlier V-NAND generations. The CCK0 speed-grade suffix indicates the device's read latency and interface timing class; controllers must be configured to the correct ONFI/toggle-mode timing for reliable operation.
Technically, the die uses Samsung's charge-trap-flashing vertical channel architecture, which reduces cell-to-cell interference compared to planar floating-gate cells at equivalent scaling. TLC devices require strong ECC (LDPC), die-level interleaving, and wear-leveling firmware to achieve rated endurance over the specified program/erase cycle count.
Typical applications include client and enterprise SSDs, eMMC/UFS embedded storage, USB drives, memory cards, and industrial storage modules where high capacity per footprint is the primary requirement.
Design consideration: verify the exact package footprint, interface mode, and operating temperature range against the official Samsung datasheet before layout, as Samsung NAND part-number suffixes denote package and speed variants that are not always drop-in interchangeable.
This page synthesizes Samsung family cross-references, drop-in alternatives, and selection guidance not consolidated on distributor pages.
드롭인 대체품: K9JUGY8J5C-CCK0 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: K9JUGY8J5C-CCK0 (동일 폼 팩터 및 풋프린트) — 차이점: Memory Type, Cell Type, Technology, Density, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
K9JUGY8J5C-BCK0
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →K9IUGY8J7B-CCK0
✅ 드롭인✓ 재고 있음
$1 / 개
데이터시트 보기 →K9IUGY8J7B-BCK0
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →K9HUGY8J5B-CCK0
✅ 드롭인✓ 재고 있음
$9.6 / 개
데이터시트 보기 →K9HUGY8J5B-BCK0
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →K9JUGY8J5C-CCK0 최대 정격 & 전기적 특성
| Manufacturer | Samsung Electronics |
| 메모리 유형 | NAND Flash - V-NAND (TLC) |
| Density | 1 Tb (128 GB) |
| Cell Type | TLC (Triple-Level Cell) |
| Technology Generation | V6 (6th-gen V-NAND, 128-layer) |
| 실장 유형 | Surface Mount |
K9JUGY8J5C-CCK0 standard 핀 구성 가이드
K9JUGY8J5C-CCK0(standard 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: K9JUGY8J5C-CCK0.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
K9JUGY8J5C-CCK0 적합 용도: 6 애플리케이션s: Client SSD Storage, Enterprise Storage, Embedded eMMC/UFS Storage, USB Flash Drives, Memory Cards, Industrial Storage Modules.
Client SSD Storage
The K9JUGY8J5C-CCK0's 1Tb (128 GB) TLC capacity per package makes it a core building block for client NVMe and SATA SSDs, where 8-16 packages yield 1-2 TB arrays in a compact footprint. Its V6 128-layer V-NAND process lowers power per bit versus previous generations, improving battery life in laptops. The SSD controller schedules interleaved die operations and applies LDPC ECC to meet TLC endurance; the CCK0 speed grade defines read latency used in firmware timing tables.
추천
Enterprise Storage
In enterprise SSDs and all-flash arrays, the K9JUGY8J5C-CCK0 provides high density per package, reducing PCB area and BOM count for multi-terabyte drives. V-NAND V6's charge-trap architecture improves retention and read-disturb behavior compared with planar TLC, important for data-center duty cycles. Firmware-level wear leveling, data scattering, and end-to-end CRC are mandatory; designers should derate endurance based on workload write amplification documented by the controller vendor.
추천
Embedded eMMC/UFS Storage
Smartphones, tablets, and IoT gateways embed NAND directly into eMMC or UFS packages. The K9JUGY8J5C-CCK0's 1Tb TLC die is the class of silicon used in such stacked devices, where capacity per z-height matters. Its low operating voltage class suits mobile power budgets, and V6 process maturity ensures supply continuity across product lifecycles. Integrators using bare NAND must supply their own FTL (flash translation layer) with power-loss protection.
추천
USB Flash Drives
High-capacity USB drives use 1-2 packages of 1Tb TLC NAND such as the K9JUGY8J5C-CCK0 behind a single-chip USB controller. The V6 generation's improved density lets a 128 GB drive use one package, cutting cost and thickness. Because USB controllers typically use simplified FTLs, sustained write speed after the SLC cache fills reflects raw TLC program performance of the CCK0 grade - a key benchmark for product marketing claims.
추천
Memory Cards
SD and microSD cards at 128 GB and above commonly employ a single 1Tb TLC NAND package like the K9JUGY8J5C-CCK0. The V6 128-layer process supports the card-controller interface timing while fitting within the extremely thin card form factor. Card controllers implement dynamic SLC caching and ECC sized for TLC raw bit error rates; the part's read-latency class influences sustained 4K random-read performance cited in V30/V60/UHS speed-class certification.
추천
Industrial Storage Modules
Industrial PCs, gateways, and logging systems use the K9JUGY8J5C-CCK0 on CFast, SATA M.2, or raw-NAND boards where wide-temperature qualification matters. Designers must confirm the operating temperature range of the CCK0 grade against the datasheet; Samsung also offers industrial-grade (IG) screened variants for extended range and fixed-BOM longevity. Under-sizing ECC or omitting power-loss protection are the most common field-failure causes in such deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: K9JUGY8J5C-CCK0 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | K9JUGY8J5C-BCK0 | K9IUGY8J7B-CCK0 | K9HUGY8J5B-CCK0 |
|---|---|---|---|---|
| Package | Fine-pitch BGA (per Samsung V-NAND family) | Fine-pitch BGA - same | Fine-pitch BGA - verify ball map | Fine-pitch BGA - verify ball map |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Cell Type | TLC | TLC | TLC | TLC |
| NAND Generation | V6 (128-layer V-NAND) | V6 (128-layer V-NAND) | V6 (128-layer V-NAND) | V5-generation V-NAND |
| Grade Suffix | CCK0 | BCK0 | CCK0 | CCK0 |
| Lifecycle Status | Active | Active | Active | Active (prior generation) |
주요 차별점
- Newest V6 generation in family (vs K9HUGY8J5B-CCK0)
- Same-die grade option for qualification reuse (vs K9JUGY8J5C-BCK0)
- Largest density per package among listed siblings (vs K9IUGY8J7B-CCK0)
설계 노트
Never assume grade-suffix interchangeability without timing verification. Samsung suffixes such as BCK0 vs CCK0 encode speed/temperature classes; a controller timing table tuned for one grade may violate tR or tPROG limits on another. Validate against the official Samsung datasheet and re-run controller readiness tests (read-retry, calibrate) after any NAND swap, even same-die ones.
Fine-pitch BGA NAND at toggle-mode speeds requires length-matched traces on the DQ/RE/WE bus and solid ground reference. Keep stubs under 2 mm, series-terminate the clock/ strobe lines, and reference the impedance target (typically 50 ohm single-ended) on all flash channels. For multi-die interleaving, group each channel's routing cleanly to avoid crosstalk between independent die buses.
NAND VCC and VCCQ rails see high transient currents during program operations (page programming across multiple die simultaneously). Provide bulk capacitance near each package (e.g., 10 uF per rail) plus 0.1 uF ceramic at ball exits, and size the PMIC for worst-case concurrent programming rather than average current. Estimated: with several die programming concurrently, peak rail current can exceed 3x idle current, causing brown-out resets if decoupling is under-designed.
Confirm the exact BGA ball count, pitch, and A1 ball location from the official Samsung package outline drawing before routing; this page's pinout is intentionally null because Samsung restricts the full ball map to datasheet/NDA channels. Use via-in-pad with filled vias or dog-bone fanout per IPC practice for the fine pitch, and define keep-outs under the package for rework access.
규정 준수 정보
Compliance declarations not present in provided verified data. Samsung publishes per-part environmental certificates on its semiconductor website; obtain RoHS/REACH documents for this specific grade before release.
